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Introduction To MEMS

This document provides an overview of MEMS (Micro-Electro Mechanical Systems), including what MEMS are, types of sensors, fabrication processes, manufacturing technologies, and applications. MEMS integrate electrical and mechanical components on a chip to sense and control the environment. Sensors can measure parameters like pressure, temperature, chemicals and more. Fabrication uses processes like deposition, patterning, and etching. Manufacturing includes bulk micromachining, surface micromachining, and high aspect ratio micromachining. Applications discussed are in medical, marine, and military fields.

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70 views

Introduction To MEMS

This document provides an overview of MEMS (Micro-Electro Mechanical Systems), including what MEMS are, types of sensors, fabrication processes, manufacturing technologies, and applications. MEMS integrate electrical and mechanical components on a chip to sense and control the environment. Sensors can measure parameters like pressure, temperature, chemicals and more. Fabrication uses processes like deposition, patterning, and etching. Manufacturing includes bulk micromachining, surface micromachining, and high aspect ratio micromachining. Applications discussed are in medical, marine, and military fields.

Uploaded by

gokul
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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Outline

 MEMS Introduction
 Sensor and its type
 Fabrication
 MEMS Manufacturing Technology
 Applications
 Conclusion
 References
What is MEMS?

 MEMS or Micro-Electro Mechanical System is a


technique of combining Electrical and Mechanical
components together on a chip, to produce a system
of miniature dimensions.

 MEMS is the integration of a number of micro-


components on a single chip which allows the
microsystem to both sense and control the
environment.

 The components are integrated on a single chip


using micro fabrication technologies.
What is a Sensor?

 A device used to measure a physical quantity(such as N


temperature) and convert it into an electronic signal of W E
2 Axis Magnetic
some kind(e.g. a voltage), without modifying the S
Sensor
environment.
2 Axis
 What can be sensed? Accelerometer
Almost Everything!!!
Commonly sensed parameters are: Light Intensity
Sensor
 Pressure
 Temperature Humidity Sensor
 Flow rate
 Radiation Pressure Sensor
 Chemicals
 Pathogens
Temperature Sensor
But why MEMS for sensors?

 Smaller in size
 Have lower power consumption
 More sensitive to input variations
 Cheaper due to mass production
 Less invasive than larger devices
Type of Sensors

Mechanical Optical Thermal Chemical & Biological


Sensors Sensors Sensors Sensors
• Strain Gauges • Direct Sensors (Light • Thermo mechanical • Electronic Nose
• Accelerometers  Electronic Signal) (Dimension) • Electronic Tongue
• Pressure Sensors • Indirect Sensors (Light • Thermo Resistive
• Microphones  Intermediate (Resistance)
Energy  Electronic • Acoustic (Sound)
• Gyroscopes(Rotation
Signal) • Biological
Rate)
• Biological Light
Sensors
Fabrication

Materials used are:


 Silicon Basic Process

 Polymers
 Metals Deposition Patterning Etching

 Ceramics
Basic Process of Fabrication

 Deposition
 Deposition that happen because of a chemical reaction or physical reaction.

 Patterning
 The pattern is transfer to a photosensitive material by selective exposure to a radiation source such as
light. If the resist is placed in a developer solution after selective exposure to a light source, it will etch
away.

 Etching
 Etching is the process of using strong acid to cut into the unprotected parts of a metal surface to create
a design in.
 There are two classes of etching processes:
 Wet Etching
 Dry Etching.
MEMS Manufacturing Technology

Bulk Micromachining

Surface Micromachining

High Aspect Ratio (HAR) Silicon Micromachining


MEMS Manufacturing Technology

Bulk Micromachining

 This technique involves the selective removal of the


substrate material in order to realize miniaturized
mechanical components.

 A widely used bulk micromachining technique in


MEMS is chemical wet etching, which involves the
immersion of a substrate into a solution of reactive
chemical that will etch exposed regions of the
substrate at very high rates.
Etched grooves using
(a) Anisotropic etchants,
(b) Isotropic etchants,
(c) Reactive Ion Etching (RIE)
MEMS Manufacturing Technology

Surface Micromachining

 In surface micromachining, the MEMS sensors are formed on top of the wafer
using deposited thin film materials.

(a) Spacer layer deposition.


(b) Pattering of the spacer layer.
(c) Deposition of the microstructure layer.
(d) Patterning of desired structure.
(e) Stripping of the spacer layer resolves final
structure.
MEMS Manufacturing Technology

High Aspect Ratio (HAR) Silicon Micromachining

 HAR combines aspects of both surface and bulk


micromachining to allow for silicon structures with
extremely high aspect ratios through thick layers of
silicon (hundreds of nanometers, up to hundreds of
micrometers).

 HAR MEMS technology enables a high degree of


immunity to high-frequency, high-amplitude parasitic
vibrations.
Applications in Medical Science
 Biocavity Laser : This device distinguishes
cancerous from non cancerous cells thus aiding the
surgeons in operations.

 Smart Pill :
 Implanted in the body
 Automatic drug delivery (on demand)

 Sight for the blind : MEMS based array that may


be inserted in the retina of a blind person to provide
partial sight
Applications in Marine Science

Sensing in marine environment maybe done for


various reasons:

Oil exploration and related applications

Global weather predictions

Monitor water quality for any contamination

Measure parameters detrimental to the “health” of


structures in the sea ( like oil rigs and ships )

Study of aquatic plants and animals

In military operations


Applications in Marine Military Operations

 An array of MEMS sensors spread on the ocean


floor could detect the presence of enemy
submarines.

 MEMS sensors (pressure sensors, accelerometers


etc.) are being used in anti-torpedo weapons on
submarines and ships.

 MEMS sensors in torpedoes are responsible for


 Detonating the torpedo at the right time
 Hitting the target in a crowded environment
 Prevent any premature explosion
CONCLUSION

 MEMS promises to be an effective technique of producing sensors of high quality, at lower costs.

 Thus we can conclude that the MEMS can create a proactive computing world, connected
computing nodes automatically, acquire and act on real-time data about a physical environment,
helping to improve lives, promoting a better understanding of the world and enabling people to
become more productive.
References

 X. Wang, J. Engel, C. Liu, J. Micromech. Microeng. 2003, 13, 628.

 Christian A. Zorman, Mehran Mehregany, MEMS Design and Fabrication, 2nd Ed. 2,16.

 Ms. Santoshi Gupta, MEMS and Nanotechnology IJSER, Vol 3, Issue 5,2012

 Stephen Beeby, MEMS Mechanical Sensor, PP. 7

 Lenz, J., Edelstein, A.S., "Magnetic sensors and their applications." IEEE Sensors J. 2006, 6,
631-649.

 Sinclair M J 2000 A high force low area MEMS thermal actuator Proc. 7th Intersociety Conf. on
Thermal and Thermomechanical Phenomena (Las Vegas, NV) pp 127–32

 R. Ghodssi, P. Lin (2011). MEMS Materials and Processes Handbook. Berlin: Springer.

 Chang, Floy I. (1995).Gas-phase silicon micromachining with xenon difluoride. 2641. pp. 117.

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