SN65HVD251

www.ti.com SLLS545C – NOVEMBER 2002 – REVISED SEPTEMBER 2005

CAN TRANSCEIVER
FEATURES Designed for operation in harsh environments, the
• Drop-In Improved Replacement for the device features cross-wire, over-voltage and loss of
PCA82C250 and PCA82C251 ground protection to ±36 V. Also featured are
over-temperature protection as well as -7 V to 12 V
• Bus-Fault Protection of ±36 V
common-mode range, and tolerance to transients of
• Meets or Exceeds ISO 11898 ±200 V. The transceiver interfaces the single-ended
• Signaling Rates(1) Up to 1 Mbps CAN controller with the differential CAN bus found in
• High Input Impedance Allows up to 120 industrial, building automation, and automotive appli-
SN65HVD251 Nodes on a Bus cations.
• Bus Pin ESD Protection Exceeds 14 kV HBM Rs, pin 8, selects one of three different modes of
• Unpowered Node Does Not Disturb the Bus operation: high-speed, slope control, or low-power
• Low-Current Standby Mode — 200 µA Typical mode. The high-speed mode of operation is selected
by connecting pin 8 to ground, allowing the transmit-
• Thermal Shutdown Protection
ter output transistors to switch as fast as possible
• Glitch-Free Power-Up and Power-Down Bus with no limitation on the rise and fall slope. The rise
Protection For Hot-Plugging and fall slope can be adjusted by connecting a
• DeviceNet Vendor ID # 806 resistor to ground at pin 8; the slope is proportional to
(1) The signaling rate of a line is the number of voltage transitions the pin's output current. Slope control with an external
that are made per second expressed in bps (bits per second).
resistor value of 10 kΩ gives ~ 15 V/us slew rate; 100
kΩ gives ~ 2 V/us slew rate.
APPLICATIONS If a high logic level is applied to the Rs pin 8, the
• CAN Data Buses device enters a low-current standby mode where the
driver is switched off and the receiver remains active.
• Industrial Automation
The local protocol controller returns the device to the
– DeviceNet™ Data Buses normal mode when it transmits to the bus.
– Smart Distributed Systems (SDS™)
The SN65HVD251 may be used in CAN,
• SAE J1939 Standard Data Bus Interface DeviceNet™ or SDS™ applications with the Texas
• NMEA 2000 Standard Data Bus Interface Instruments' TMS320F241 and TMS320F243 DSPs
• ISO 11783 Standard Data Bus Interface with CAN 2.0B controllers.
function diagram
DESCRIPTION (positive logic)
The SN65HVD251 is intended for use in applications D 1 8 Rs VCC
3 5 V
ref
employing the Controller Area Network (CAN) serial GND 2 7 CANH 1
communication physical layer in accordance with the D
ISO 11898 Standard. The SN65HVD251 provides Vcc 3 6 CANL RS 8
differential transmit capability to the bus and differen- R 4 5 Vref 7
4 CANH
tial receive capability to a CAN controller at speeds R 6 CANL
up to 1 megabits per second (Mbps).

ORDERING INFORMATION
PART NUMBER PACKAGE MARKED AS
SN65HVD251D 8-pin SOIC (Tube) VP251
SN65HVD251DR 8-pin SOIC (Tape & Reel) VP251
SN65HVD251P 8-pin DIP 65HVD251

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DeviceNet is a trademark of Allen-Bradley.
SDS is a trademark of Honeywell.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted (1) (2)
SN65HVD251
Supply voltage range, VCC -0.3 V to 7 V
Voltage range at any bus terminal (CANH or CANL) -36 V to 36 V
Transient voltage per ISO 7637, pulse 1, 2, 3a, 3b CANH, CANL ±200 V
Input voltage range, VI (D, Rs, or R) -0.3 V to VCC + 0.5
Receiver output current, IO –10 mA to 10 mA
CANH, CANL and GND 14 kV
Human Body Model (3)
Electrostatic discharge All pins 6 kV
Charged-Device Model (4) All pins 1 kV
Continuous total power dissipation (see Dissipation Rating
Table)

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-A.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101.

ABSOLUTE MAXIMUM POWER DISSIPATION RATINGS

CIRCUIT BOARD TA = 25°C DERATING FACTOR (1) TA = 85°C POWER TA = 125°C POWER
PACKAGE
MODEL POWER RATING ABOVE TA = 25°C RATING RATING
Low-K (2) 576 mW 4.8 mW/°C 288 mW 96 mW
SOIC (D)
High-K (3) 924 mW 7.7 mW/°C 462 mW 154 mW
Low-K (2) 888 mW 7.4 mW/°C 444 mW 148 mW
PDIP (P)
High-K (3) 1212 mW 10.1 mW/°C 606 mW 202 mW

(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.
(3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7.

THERMAL CHARACTERISTICS
PARAMETER TEST CONDITIONS VALUE UNITS
MIN TYP MAX
D 78.7
Θ JB Junction-to-board thermal resistance °C/W
P 48.9
D 44.6
Θ JC Junction-to-case thermal resistance °C/W
P 66.6
VCC = 5 V, Tj = 27 °C, RL = 60Ω, 97.7 mW
RS at 0 V, Input to D a 500-kHz
50% duty cycle square wave
PD Device power dissipation
VCC = 5.5 V, Tj = 130°C, RL = 60Ω, 142 mW
RS at 0 V, Input to D a 500-kHz 50%
duty cycle square wave
TSD Thermal shutdown junction temperature 165 °C

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RECOMMENDED OPERATING CONDITIONS

over recommended operating conditions (unless otherwise noted).
PARAMETER MIN NOM MAX UNIT
Supply voltage, VCC 4.5 5.5 V
Voltage at any bus terminal (separately or common mode) VI or VIC -7 (1) 12 V
High-level input voltage, VIH D input 0.7 VCC V
Low-level input voltage, VIL D input 0.3 VCC V
Differential input voltage, VID -6 6 V
Input voltage to Rs, VI(Rs) 0 VCC V
Input voltage at Rs for standby, VI(Rs) 0.75 VCC VCC V
Rs wave-shaping resistance 0 100 kΩ
Driver -50
High-level output current, IOH mA
Receiver -4
Driver 50
Low-level output current, IOL mA
Receiver 4
Operating free-air temperature, TA -40 125 °C
PDIP Package 145
Junction temperature, Tj °C
SOIC Package 145

(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

DRIVER ELECTRICAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP ( MAX UNIT
1)

Bus output voltage CANH Figure 1 & Figure 2 , 2.75 3.5 4.5
VO(D)
(Dominant) CANL D at 0 V Rs at 0 V 0.5 2
V
Bus output voltage CANH 2 2.5 3
VO(R) Figure 1 & Figure 2 , D at 0.7VCC , Rs at 0 V
(Recessive) CANL 2 2.5 3
VOD(D) Differential output voltage (Dominant) Figure 1 , D at 0 V, Rs at 0 V 1.5 2 3 V
VOD(D) Differential output voltage (Dominant) Figure 2 & Figure 3 , D at 0 V, Rs at 0 V 1.2 2 3.1 V
VOD(R) Differential output voltage (Recessive) Figure 1 & Figure 2 , D at 0.7 VCC -120 12 mV
VOD(R) Differential output voltage (Recessive) D at 0.7 VCC, no load -0.5 0.05 V
VOC(pp) Peak-to-peak common-mode output voltage Figure 9, Rs at 0 V 600 mV
IIH High-level input current, D Input D at 0.7 VCC -40 0 µA
IIL Low-level input current, D Input D at 0.3 VCC -60 0 µA
Figure 11, VCANH at -7 V, CANL Open -200
Figure 11, VCANH at 12 V, CANL Open 2.5
IOS(SS) Short-circuit steady-state output current mA
Figure 11, VCANL at -7 V, CANH Open -2
Figure 11, VCANL at 12 V, CANH Open 200
CO Output capacitance See receiver input capacitance
IOZ High-impedance output current See receiver input current
IIRs(s) Rs input current for standby Rs at 0.75 VCC -10 µA
IIRs(f) Rs input current for full speed operation Rs at 0 V -550 0 µA
Standby Rs at VCC, D at VCC 275 µA
ICC Supply current Dominant D at 0 V, 60Ω load, Rs at 0 V 65
mA
Recessive D at VCC, no load, Rs at 0 V 14

(1) All typical values are at 25°C and with a 5-V supply.

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DRIVER SWITCHING CHARACTERISTICS

over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Figure 4, Rs at 0 V 40 70
tpLH Propagation delay time, low-to-high-level output Figure 4, Rs with 10 kΩ to ground 90 125
Figure 4, Rs with 100 kΩ to ground 500 800
Figure 4, Rs at 0 V 85 125
tpHL Propagation delay time, high-to-low-level output Figure 4, Rs with 10 kΩ to ground 200 260
Figure 4, Rs with 100 kΩ to ground 1150 1450
Figure 4, Rs at 0 V 45 85
tsk(p) Pulse skew (|tpHL - tpLH|) Figure 4, Rs with 10 kΩ to ground 110 180 ns
Figure 4, Rs with 100 kΩ to ground 650 900
tr Differential output signal rise time 35 100
Figure 4, Rs at 0 V
tf Differential output signal fall time 35 100
tr Differential output signal rise time 100 250
Figure 4, Rs with 10 kΩ to ground
tf Differential output signal fall time 100 250
tr Differential output signal rise time 600 1550
Figure 4, Rs with 100 kΩ to ground
tf Differential output signal fall time 600 1550
ten Enable time from standby to dominant Figure 8 0.5 µs

RECEIVER ELECTRICAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT+ Positive-going input threshold voltage 750 900
VIT- Negative-going input threshold voltage Rs at 0 V, (See Table 1) 500 650 mV
Vhys Hysteresis voltage (VIT+ - VIT-) 100
VOH High-level output voltage Figure 6, IO = -4mA 0.8 V
Vcc
VOL Low-level output voltage Figure 6, IO = 4mA 0.2 V
Vcc
CANH or CANL at 12 V 600
CANH or CANL at 12 V, Other bus
pin at 0 V, 715
VCC at 0 V
II Bus input current Rs at 0 V, µA
CANH or CANL at -7 V D at 0.7 -460
CANH or CANL at -7 V, VCC
-340
VCC at 0 V
Pin-to-ground, VI = 0.4 sin (4E6πt) + pF
CI Input capacitance, (CANH or CANL) 20
0.5 V, D at 0.7 VCC
Pin-to-pin, VI = 0.4 sin (4E6πt) + 0.5 pF
CID Differential input capacitance 10
V, D at 0.7 VCC
RID Differential input resistance D at 0.7 VCC, Rs at 0 V 40 100 kΩ
RIN Input resistance, (CANH or CANL) D at 0.7 VCC, Rs at 0 V 20 50 kΩ
Standby Rs at VCC, D at VCC 275 µA
ICC Supply current Dominant D at 0 V, 60Ω Load, Rs at 0 V 65
mA
Recessive D at VCC, No Load, Rs at 0 V 14

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RECEIVER SWITCHING CHARACTERISTICS

over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tpLH Propagation delay time, low-to-high-level output 35 50
tpHL Propagation delay time, high-to-low-level output 35 50
tsk(p) Pulse skew (|tpHL - tpLH|) Figure 6 20
ns
tr Output signal rise time 2 4
tf Output signal fall time 2 4
tp(sb) Propagation delay time in standby Figure 12, Rs at VCC 500

VREF-PIN CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
-5 µA < IO < 5 µA 0.45 VCC 0.55 VCC
VO Reference output voltage V
-50 µA < IO < 50 µA 0.4 VCC 0.6 VCC

DEVICE SWITCHING CHARACTERISTICS

over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Figure 10, Rs at 0 V 60 100
Total loop delay, driver input to receiver
tloop1 Figure 10, Rs with 10 kΩ to ground 100 150 ns
output, recessive to dominant
Figure 10, Rs with 100 kΩ to ground 440 800
Figure 10, Rs at 0 V 115 150
Total loop delay, driver input to receiver
tloop2 Figure 10, Rs with 10 kΩ to ground 235 290 ns
output, dominant to recessive
Figure 10, Rs with 100 kΩ to ground 1070 1450
tloop2 Total loop delay, driver input to receiver Figure 10, Rs at 0 V, VCC from 4.5 V to 5.1 105 145 ns
output, dominant to recessive V,

PARAMETER MEASUREMENT INFORMATION

IO(CANH)

D VO(CANH)
II VOD
60

1%
VO(CANH) + VO(CANL)
2
Rs IIRs VOC
VI + IO(CANL)
VI(Rs) VO(CANL)
_

Figure 1. Driver Voltage, Current, and Test Definition

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PARAMETER MEASUREMENT INFORMATION (continued)

Dominant VO(CANH)

3.5 V

Recessive

2.5 V

1.5 V VO(CANL)

Figure 2. Bus Logic State Voltage Definitions

330
 1%
CANH

D 60
 1%
VI VOD
+
_ –7 V  VTEST  12 V
RS
CANL
330
 1%

Figure 3. Driver VOD

CANH

D RL = CL =
VO
60 
1% 50 pF
20%
VI (see Note B)
Rs +
(see Note A) VI(Rs) CANH
_

VCC
VI VCC/2 VCC/2
0V

tPLH tPHL
VO(D)
0.9V 90%
VO 0.5V
10% VO(R)
tr tf

Figure 4. Driver Test Circuit and Voltage Waveforms

CANH
VI(CANH) R IO
VID
VI(CANH) + VI(CANL)
VIC =
2
VO
VI(CANL) CANL

Figure 5. Receiver Voltage and Current Definitions

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PARAMETER MEASUREMENT INFORMATION (continued)

CANH
R
IO
VI
CANL CL = 15 pF
(see Note A) 1.5 V
20% (see Note B) VO

3.5 V
VI 2V 2.4 V
1.5 V
tPLH tPHL
VOH
VO 0.7 VCC 90% 0.3 VCC
10% 10%
VOL
tr tf

A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 125 kHz, 50% duty cycle, tr≤
6ns, tf≤ 6ns, ZO = 50Ω.
B. CL includes instrumentation and fixture capacitance within ±20%.

Figure 6. Receiver Test Circuit and Voltage Waveforms

CANH

R
CANL
100

Pulse Generator
D at 0 V
15 s Duration
or VCC
1% Duty Cycle
tr, tr
100 ns
RS at 0 V or VCC
A. This test is conducted to test survivability only. Data stability at the R output is not specified.

Figure 7. Test Circuit, Transient Over-Voltage Test

Table 1. Receiver Characteristics Over Common Mode Voltage

INPUT MEASURED OUTPUT
VCANH VCANL |VID| R
12 V 11.1 V 900 mV L
-6.1 V -7 V 900 mV L
VOL
-1 V -7 V 6V L
12 V 6V 6V L
-6.5 V -7 V 500 mV H
12 V 11.5 V 500 mV H
-7 V -1 V 6V H VOH
6V 12 V 6V H
open open X H

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DUT
CANH

D
0V 60
 1%

Rs CANL
VI

+
VO 15 pF  20%
_

VCC
0.7 VCC
VI
0V

VOH

VO 0.3 VCC 0.3 VCC

VOL
ten

Figure 8. ten Test Circuit and Voltage Waveforms

27
 1%
CANH

D
VI
CANL 27
 1% 50 pF 20%
VOC
RS

VOC(PP)
VOC

A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 125 kHz, 50% duty cycle, tr≤
6ns, tf≤ 6ns, ZO = 50Ω.

Figure 9. Peak-to-Peak Common Mode Output Voltage

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DUT
CANH

D
VI 60

1%

10 k
or 100 k

5%
RS CANL
_ VRs +
R
+
VO 15 pF
20%
_

VCC
D Input 50%
0V
tLoop2 tLoop1
VOH
0.7 Vcc
R Output 0.3 Vcc
VOL

Figure 10. tLOOP Test Circuit and Voltage Waveforms

IOS

D CANH
0 V or VCC

Rs CANL Vin –7 V or 12 V

IOS(SS)


IOS(P)

15 s
0V
12 V

Vin
0V
or 10
s
0V
Vin

–7 V

Figure 11. Driver Short-Circuit Test

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CANH

R
VI
CANL CL = 15 pF
(see Note A) 1.5 V VO
(see Note B)

3.5 V
2.4 V
VI
1.5 V
tp(sb)
VOH
VO
0.3 VCC
VOL

A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 125 kHz, 50% duty cycle, tr≤
6ns, tf≤ 6ns, ZO = 50Ω.
B. CL includes instrumentation and fixture capacitance within ±20%.

Figure 12. Receiver Propagation Delay in Standby Test Circuit and Waveform

DEVICE INFORMATION
5V

R2
1%
R1
1%

CANH +
R
VID

CANL – Vac
R1
1%
VI
R2
1%

VID R1 R2

500 mV 50
450

900 mV 50
227

12 V

VI
–7 V
A. All input pulses are supplied by a generator having the following characteristics: f < 1.5 MHz, TA = 25oC, VCC = 5.0 V.

Figure 13. Common-Mode Input Voltage Rejection Test

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DEVICE INFORMATION (continued)

FUNCTION TABLES

Table 2. DRIVER
INPUTS OUTPUTS
Voltage at Rs, VRs BUS STATE
D CANH CANL
L VRs < 1.2 V H L Dominant
H VRs < 1.2 V Z Z Recessive
Open X Z Z Recessive
X VRs > 0.75 VCC Z Z Recessive

Table 3. RECEIVER
DIFFERENTIAL INPUTS [VID = V(CANH) - V(CANL)] OUTPUT R (1)
VID≥ 0.9 V L
0.5V < VID < 0.9 V ?
VID ≤ 0.5 V H
Open H

(1) H = high level; L = low level; X = irrelevant; ? = indeterminate; Z = high impedance

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D Input R Output

Vcc Vcc

100 k

1 k
15

Input Output

9V 9V

CANH Input CANL Input

Vcc Vcc

110 k
9 k
110 k
9 k

45 k
45 k

Input Input

40 V 9 k
40 V 9 k

CANH and CANL Outputs Rs Input

Vcc Vcc

Output

40 V
+

Input

Figure 14. Equivalent Input and Output Schematic Diagrams

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TYPICAL CHARACTERISTICS

tLOOP1-LOOP TIME tLOOP2-LOOP TIME SUPPLY CURRENT (RMS)

vs vs vs
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE SIGNALING RATE
150 33
74 RS = 0 V RS = 0 V VCC = 5 V,
32 TA = 25°C,
145

ICC – RMS Supply Current – mA

VCC = 5.5 V RS = 0 V,
tLOOP1 – Loop Time – ns

72

tLOOP2 – Loop Time – ns

VCC = 4.5 V 31 RL = 60 Ω,
VCC = 5 V
140 CL = 50 pF
70 VCC = 5 V 30

135 29
68
28
130
66
VCC = 4.5 V 27
VCC = 5.5 V
64 125
26
62 120 25
–40 –25 –10 5 20 35 50 65 80 95 110 125 –40 –25 –10 5 20 35 50 65 80 95 110 125 0 250 500 750 1000 1250 1500 1750 2000
TA – Free-Air Temperature – C TA – Free-Air Temperature – C Signaling Rate – kbps

Figure 15. Figure 16. Figure 17.

DRIVER LOW-LEVEL OUTPUT CUR- DRIVER HIGH-LEVEL OUTPUT CUR- DOMINANT DIFFERENTIAL
RENT RENT OUTPUT VOLTAGE
vs vs vs
LOW-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE FREE-AIR TEMPERATURE
140 80
IOL – Driver Low-Level Output Current – mA

VOD(D) – Dominant Differential Output Voltage – V

IOH – Driver High-Level Output Current – mA

VCC = 5 V, VCC = 5 V, 3
120 TA = 25°C, 70 TA = 25°C, VCC = 5.5 V
RS = 0 V, RS = 0 V, 2.5
D at 0V 60 D at 0V
100

50 2
80
VCC = 4.5 V
VCC = 5 V
40
60 1.5
30
40
1
20
20 RS = 0 V,
10 0.5 D at 0V,
RL = 60 Ω
0 0
0 1 2 3 4 5 0 1 2 3 4 5 0
VOCANL – Low-Level Output Voltage – V VOCANH – High-Level Output Voltage – V –55 –40 0 25 70 85 125
TA – Free-Air Temperature – C

Figure 18. Figure 19. Figure 20.

DRIVER OUTPUT CURRENT DIFFERENTIAL OUTPUT INPUT RESISTANCE MATCHING

vs FALL TIME vs
SUPPLY VOLTAGE vs FREE-AIR TEMPERATURE
SLOPE RESISTANCE (Rs)
60 1000 0
TA = 25°C VCC = 5.5 V
TA = 25°C, 900
tf - Differential Output Fall Time - ns

RS = 0 V,
IO – Driver Output Current – mA

−0.50 VCC = 5.5 V

Input Resistance Matching − %

50 800
D at 0V, VCC = 5 V
RL = 60 Ω 700
40 −1
600
VCC = 4.5 V
30 500 −1.50
VCC = 5 V
400
20 −2
300
VCC = 4.5 V
200
10 −2.50
100

0 0 −3
1 2 3 4 5 6 0 10 20 30 40 50 60 70 80 90 100 −50 0 50 100 150
VCC – Supply Voltage – V RS - Slope Resistance - k
TA − Free-Air Temperature − °C

Figure 21. Figure 22. Figure 23.

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APPLICATION INFORMATION
lators in a system must also be accounted for with
The basics of bus arbitration require that the receiver adjustments in signaling rate and stub & bus length.
at the sending node designate the first bit as domi- Table 4 lists the maximum signaling rates achieved
nant or recessive after the initial wave of the first bit with the SN65HVD251 in high-speed mode with
of a message travels to the most remote node on a several bus lengths of category-5, shielded
network and back again. Typically, this sample is twisted-pair (CAT 5 STP) cable.
made at 75% of the bit width, and within this
limitation, the maximum allowable signal distortion in Table 4. Maximum Signaling Rates for Various
a CAN network is determined by network electrical Cable Lengths
parameters.
BUS LENGTH (m) SIGNALING RATE (kbps)
Factors to be considered in network design include 30 1000
the 5 ns/m propagation delay of typical twisted-pair
100 500
bus cable; signal amplitude loss due to the loss
mechanisms of the cable; and the number, length, 250 250
and spacing of drop-lines (stubs) on a network. Under 500 125
strict analysis, variations among the different oscil- 1000 62.5

The ISO 11898 standard specifies a maximum bus length of 40 m and maximum stub length of 0.3 m with a
maximum of 30 nodes. However, with careful design, users can have longer cables, longer stub lengths, and
many more nodes on a bus. (Note: Non-standard application may come with a trade-off in signaling rate.) A bus
with a large number of nodes requires a transceiver with high input impedance such as the HVD251.
The Standard specifies the interconnect to be a single twisted-pair cable (shielded or unshielded) with 120-Ω
characteristic impedance (Zo). Resistors equal to the characteristic impedance of the line terminate both ends of
the cable to prevent signal reflections. Unterminated drop-lines connect nodes to the bus and should be kept as
short as possible to minimize signal reflections.
Connectors, while not specified by the ISO 11898 standard, should have as little effect as possible on standard
operating parameters such as capacitive loading. Although unshielded cable is used in many applications, data
transmission circuits employing CAN transceivers are usually used in applications requiring a rugged
interconnection with a wide common-mode voltage range. Therefore, shielded cable is recommended in these
electronically harsh environments, and when coupled with the –2-V to 7-V common-mode range of tolerable
ground noise specified in the standard, helps to ensure data integrity. The HVD251 extends data integrity beyond
that of the standard with an extended –7-V to 12-V range of common-mode operation.

NOISE MARGIN

900 mV Threshold
RECEIVER DETECTION WINDOW 75% SAMPLE POINT
500 mV Threshold
NOISE MARGIN

ALLOWABLE JITTER

Figure 24. Typical CAN Differential Signal Eye-Pattern

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An eye pattern is a useful tool for measuring overall signal quality. As displayed in Figure 24, the differential
signal changes logic states in two places on the display, producing an eye. Instead of viewing only one logic
crossing on the scope, an entire bit of data is brought into view. The resulting eye pattern includes all effects of
systemic and random distortion, and displays the time during which a signal may be considered valid.
The height of the eye above or below the receiver threshold voltage level at the sampling point is the noise
margin of the system. Jitter is typically measured at the differential voltage zero-crossing during the logic state
transition of a signal. Note that jitter present at the receiver threshold voltage level is considered by some to be a
more effective representation of the jitter at the input of a receiver.
As the sum of skew and noise increases, the eye closes and data is corrupted. Closing the width decreases the
time available for accurate sampling, and lowering the height enters the 900 mV or 500 mV threshold of a
receiver.
Different sources induce noise onto a signal. The more obvious noise sources are the components of a
transmission circuit themselves; the signal transmitter, traces & cables, connectors, and the receiver. Beyond
that, there is a termination dependency, cross-talk from clock traces and other proximity effects, VCC & ground
bounce, and electromagnetic interference from near-by electrical equipment.
The balanced receiver inputs of the HVD251 mitigate most sources of signal corruption, and when used with a
quality shielded twisted-pair cable, help ensure data integrity.

Typical Application
Bus Lines – 40 m max CANH
120  Stub Lines –– 0.3 m max 120 

CANL
5V 5V 3.3 V
Vref VCC Vref VCC Vref VCC
0.1 F 0.1 F 0.1 F
RS SN65HVD251 RS SN65HVD251 RS SN65HVD230
GND GND GND
D R D R D R

CANTX CANRX CANTX CANRX CANTX CANRX

TMS320F243 TMS320F243 TMS320LF2407A

Sensor, Actuator, or Sensor, Actuator, or Sensor, Actuator, or

Control Equipment Control Equipment Control Equipment

Figure 25. Typical HVD251 Application

15
 PACKAGE OPTION ADDENDUM
www.ti.com 18-Jul-2006

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
SN65HVD251D ACTIVE SOIC D 8 75 TBD CU NIPDAU Level-1-220C-UNLIM
SN65HVD251DR ACTIVE SOIC D 8 2500 TBD CU NIPDAU Level-1-220C-UNLIM
SN65HVD251DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65HVD251P ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN65HVD251PE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1
 MECHANICAL DATA

MPDI001A – JANUARY 1995 – REVISED JUNE 1999

P (R-PDIP-T8) PLASTIC DUAL-IN-LINE

0.400 (10,60)
0.355 (9,02)
8 5

0.260 (6,60)
0.240 (6,10)

1 4
0.070 (1,78) MAX

0.325 (8,26)
0.020 (0,51) MIN
0.300 (7,62)

0.015 (0,38)

Gage Plane
0.200 (5,08) MAX
Seating Plane

0.125 (3,18) MIN 0.010 (0,25) NOM

0.100 (2,54) 0.430 (10,92)

MAX
0.021 (0,53)
0.010 (0,25) M
0.015 (0,38)

4040082/D 05/98

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001

For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

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