TDA1308

Class-AB stereo headphone driver

Rev. 5 — 14 March 2011 Product data sheet

1. General description
The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or
a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal
Oxide Semiconductor (CMOS) process and has been primarily developed for portable
digital audio applications.

2. Features and benefits

„ Wide temperature range
„ No switch ON/OFF clicks
„ Excellent power supply ripple rejection
„ Low power consumption
„ Short-circuit resistant
„ High performance
‹ High signal-to-noise ratio
‹ High slew rate
‹ Low distortion
„ Large output voltage swing

3. Quick reference data

Table 1. Quick reference data
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VDD supply voltage single supply 3.0 5.0 7.0 V
dual supply 1.5 2.5 3.5 V
VSS negative supply dual supply −1.5 −2.5 −3.5 V
voltage
IDD supply current no load - 3 5 mA
Ptot total power no load - 15 25 mW
dissipation
Po output power maximum; THD+N < 0.1 % [1] - 40 80 mW
THD+N total harmonic [1] - 0.03 0.06 %
distortion-plus-noise [1] - −70 −65 dB
RL = 5 kΩ - −101 - dB
S/N signal-to-noise ratio 100 110 - dB
NXP Semiconductors TDA1308
Class-AB stereo headphone driver

Table 1. Quick reference data …continued

VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
αcs channel separation - 70 - dB
RL = 5 kΩ [1] - 105 - dB
PSRR power supply ripple fi = 100 Hz; - 90 - dB
rejection Vripple(p-p) = 100 mV
Tamb ambient temperature −40 - +85 °C

[1] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB).

4. Ordering information
Table 2. Ordering information
Type number Package
Name Description Version
TDA1308T SO8 plastic small outline package; 8 leads; body width SOT96-1
3.9 mm
TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; SOT505-1
body width 3 mm

5. Block diagram

TDA1308
1 8
OUTA VDD

2
INA-
3 7
INA+
OUTB

6
4 INB-
VSS 5
INB+

mka779

Fig 1. Block diagram

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Product data sheet Rev. 5 — 14 March 2011 2 of 17

NXP Semiconductors TDA1308
Class-AB stereo headphone driver

6. Pinning information

6.1 Pinning

TDA1308

OUTA 1 8 VDD

INA- 2 7 OUTB

INA+ 3 6 INB-

VSS 4 5 INB+

001aaf782

Fig 2. Pin configuration

6.2 Pin description

Table 3. Pin description
Symbol Pin Description
OUTA 1 output A
INA− 2 inverting input A
INA+ 3 non-inverting input A
VSS 4 negative supply
INB+ 5 non-inverting input B
INB− 6 inverting input B
OUTB 7 output B
VDD 8 positive supply

7. Internal circuitry

VDD

I1

INA/B+ M1 M2 A1 M3

INA/B-

OUTA/B

Cm

M4 M5
D1 D2 D3 D4 A2 M6

VSS
mka781

Fig 3. Equivalent schematic diagram

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Product data sheet Rev. 5 — 14 March 2011 3 of 17

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Class-AB stereo headphone driver

8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0 8.0 V
tsc short-circuit duration time output; Tamb = 25 °C; 20 - s
Ptot = 1 W
Tstg storage temperature −65 +150 °C
Tamb ambient temperature −40 +85 °C
VESD electrostatic discharge HBM [1] −2 +2 kV
voltage MM [2] −200 +200 V

[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.

9. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction SO8 210 K/W
to ambient TSSOP8 220 K/W

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Product data sheet Rev. 5 — 14 March 2011 4 of 17

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Class-AB stereo headphone driver

10. Characteristics
Table 6. Characteristics
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VDD supply voltage single supply 3.0 5.0 7.0 V
dual supply 1.5 2.5 3.5 V
VSS negative supply voltage dual supply −1.5 −2.5 −3.5 V
IDD supply current no load - 3 5 mA
Ptot total power dissipation no load - 15 25 mW
Static characteristics
|VI(offset)| input offset voltage - 10 - mV
IIB input bias current - 10 - pA
Vcm common-mode voltage 0 - 3.5 pA
Gv(ol) open-loop voltage gain RL = 5 kΩ - 70 - dB
IO output current maximum - 60 - mA
Ro output resistance THD+N < 0.1 % - 0.25 - Ω
ΔVO output voltage variation [1] 0.75 - 4.25 V
RL = 16 Ω [1] 1.5 - 3.5 V
RL = 5 kΩ [1] 0.1 - 4.9 V
αcs channel separation - 70 - dB
RL = 5 kΩ [1] - 105 - dB
PSRR power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV - 90 - dB
CL load capacitance - - 200 pF
Dynamic characteristics
THD+N total harmonic [2] - 0.03 0.06 %
distortion-plus-noise [2] - −70 −65 dB
RL = 5 kΩ [2] - −101 - dB
RL = 5 kΩ [2] - 0.0009 - %
S/N signal-to-noise ratio 100 110 - dB
f1 unity gain frequency open-loop; RL = 5 kΩ - 5.5 - MHz
Po output power maximum; THD+N < 0.1 % - 40 80 mW
Ci input capacitance - 3 - pF
SR slew rate unity gain inverting - 5 - V/μs
B bandwidth unity gain inverting - 20 - kHz

[1] Values are proportional to VDD; THD+N < 0.1 %.

[2] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB).

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NXP Semiconductors TDA1308
Class-AB stereo headphone driver

11. Application information

R6 C4
VOUTA
3.9 kΩ 100 μF/6 V
RL

C7 1 8
R5 2
VINA
R1 3.9 kΩ
1 μF
10 kΩ 3
C2
C5
TDA1308 100 μF
5 0.1 μF
10 V
C1
R2
22 μF C6 R3
6V
10 kΩ 6
VINB
1 μF 3.9 kΩ
7 4

R4 C3
VOUTB
3.9 kΩ 100 μF/6 V
RL

001aan758

Fig 4. Typical application

12. Test information

VDD

3.9 kΩ 100 μF
VOUTA

RL

1 8
3.9 kΩ
VINA 2
3

Vref C6
TDA1308 100 μF
(typ. 2.5 V) 5
3.9 kΩ
VINB 6

7 4

3.9 kΩ 100 μF
VOUTB

RL

mka782

Fig 5. Measurement circuit for inverting application

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Product data sheet Rev. 5 — 14 March 2011 6 of 17

NXP Semiconductors TDA1308
Class-AB stereo headphone driver

mka784 mka785
-70

Xtalk
80 (dB)

Gv
(dB) -90

RL = 32 Ω
40
RL = 16 Ω
no load
-110
32 Ω

0
5 kΩ

-130
10−2 10−3 10−4 10−5 10−6 10−7 10−8 10-1 10-2 10-3 10-4 10-5
fi (Hz) fi (Hz)

Fig 6. Open-loop gain as a function of input frequency Fig 7. Crosstalk as a function of input frequency

mka786 mka787
100 -50
Po
RL = 16 Ω
(mW) THD+N
(dB)
60 RL = 16 Ω; Po = 50 mW
32 Ω
-70
40 RL = 32 Ω; Po = 50 mW
8Ω

-90
20
RL = 5 kΩ; Vo(p-p) = 3.5 V

10 -110
3 4 5 10-1 10-2 10-3 10-4 10-5
VDD (V) fi (Hz)

Fig 8. Output power as a function of supply voltage Fig 9. Total harmonic distortion plus noise ratio as a
function of input frequency

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NXP Semiconductors TDA1308
Class-AB stereo headphone driver

mka788
-40

THD+N
(dB)
RL = 8 Ω

-60 16 Ω

32 Ω

-80
5 kΩ

fi = 1 kHz
-100
10-2 10-1 1 10
Vo(p-p) (V)

Fig 10. Total harmonic distortion plus noise ratio as a function of output voltage level

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Class-AB stereo headphone driver

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

D E A
X

y HE v M A

8 5

Q
A2
(A 3) A
A1
pin 1 index
θ
Lp

1 4 L

e w M detail X
bp

0 2.5 5 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ

0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7
mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 o
0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8
o
0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0
inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004
0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012

Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT96-1 076E03 MS-012
03-02-18

Fig 11. Package outline SOT96-1 (SO8)

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NXP Semiconductors TDA1308
Class-AB stereo headphone driver

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

D E A
X

y HE v M A

8 5

A2 (A3) A
A1
pin 1 index

θ
Lp
L
1 4
detail X
e w M
bp

0 2.5 5 mm
scale

DIMENSIONS (mm are the original dimensions)

A
UNIT A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ
max.
0.15 0.95 0.45 0.28 3.1 3.1 5.1 0.7 0.70 6°
mm 1.1 0.25 0.65 0.94 0.1 0.1 0.1
0.05 0.80 0.25 0.15 2.9 2.9 4.7 0.4 0.35 0°

Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-04-09
SOT505-1
03-02-18

Fig 12. Package outline SOT505-1 (TSSOP8)

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Class-AB stereo headphone driver

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities

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Class-AB stereo headphone driver

14.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8

Table 7. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220

Table 8. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.

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Class-AB stereo headphone driver

maximum peak temperature

temperature = MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak
temperature

time
001aac844

MSL: Moisture Sensitivity Level

Fig 13. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

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Class-AB stereo headphone driver

15. Revision history

Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TDA1308 v.5 20110314 Product data sheet - TDA1308_A_4
Modifications: • Removed all references to type numbers TDA1308, TDA1308A, TDA1308AUK
• Changed pin names INA(neg), INA(pos), INB(pos), INB(neg) to INA−, INA+, INB+ and INB−
• Updated parameter symbols in Tables 4 and 6, and Figures 7, 9 and 10
• Replaced Figure 4
TDA1308_A_4 20070125 Product data sheet - TDA1308_A_3
TDA1308_A_3 20020719 Product specification - TDA1308_A_2
TDA1308_A_2 20020227 Product specification - TDA1308_1
TDA1308_1 19940905 Product specification - -

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Class-AB stereo headphone driver

16. Legal information

16.1 Data sheet status

Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
Draft — The document is a draft version only. The content is still under
NXP Semiconductors products in such equipment or applications and
internal review and subject to formal approval, which may result in
therefore such inclusion and/or use is at the customer’s own risk.
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these
information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no
use of such information. representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications
for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors
full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product
sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP
office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and
full data sheet shall prevail. products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their
data sheet shall define the specification of the product as agreed between applications and products.
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however, NXP Semiconductors does not accept any liability related to any default,
shall an agreement be valid in which the NXP Semiconductors product is damage, costs or problem which is based on any weakness or default in the
deemed to offer functions and qualities beyond those described in the customer’s applications or products, or the application or use by customer’s
Product data sheet. third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
16.3 Disclaimers the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.

Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in
be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC 60134) will cause permanent
representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper)
completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in
consequences of use of such information. the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
In no event shall NXP Semiconductors be liable for any indirect, incidental,
repeated exposure to limiting values will permanently and irreversibly affect
punitive, special or consequential damages (including - without limitation - lost
the quality and reliability of the device.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors
damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial
contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective
customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to
with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or
limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant,
notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or
to the publication hereof. other industrial or intellectual property rights.

Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein
authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior
safety-critical systems or equipment, nor in applications where failure or authorization from national authorities.

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Class-AB stereo headphone driver

Quick reference data — The Quick reference data is an extract of the product for such automotive applications, use and specifications, and (b)
product data given in the Limiting values and Characteristics sections of this whenever customer uses the product for automotive applications beyond
document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Non-automotive qualified products — Unless this data sheet expressly
liability, damages or failed product claims resulting from customer design and
states that this specific NXP Semiconductors product is automotive qualified,
use of the product for automotive applications beyond NXP Semiconductors’
the product is not suitable for automotive use. It is neither qualified nor tested
standard warranty and NXP Semiconductors’ product specifications.
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
16.4 Trademarks
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

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18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
10 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Application information. . . . . . . . . . . . . . . . . . . 6
12 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Soldering of SMD packages . . . . . . . . . . . . . . 11
14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 11
14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 11
14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11
14.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
17 Contact information. . . . . . . . . . . . . . . . . . . . . 16
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2011. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 March 2011
Document identifier: TDA1308