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AnaloG Layout Interview Questions

The document discusses various topics related to designing standard cells and layouts for lower node technologies, including how to choose the height of standard cells, constraints to follow, managing power, differences between higher and lower node technologies, poly pitch, CMOS vs FinFET advantages and disadvantages, fabrication of FinFETs, challenges of lower node technologies, what fins are, device placement planning, identifying analog and digital layouts, prioritizing layout types, separating layouts, calculating metal width and length, reducing metal resistance, metal stacking, choosing power metal, reducing resistance in high speed layouts, contacts and vias, using multiple vias to reduce resistance, and resistance shielding.

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Harish Kumar
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4K views

AnaloG Layout Interview Questions

The document discusses various topics related to designing standard cells and layouts for lower node technologies, including how to choose the height of standard cells, constraints to follow, managing power, differences between higher and lower node technologies, poly pitch, CMOS vs FinFET advantages and disadvantages, fabrication of FinFETs, challenges of lower node technologies, what fins are, device placement planning, identifying analog and digital layouts, prioritizing layout types, separating layouts, calculating metal width and length, reducing metal resistance, metal stacking, choosing power metal, reducing resistance in high speed layouts, contacts and vias, using multiple vias to reduce resistance, and resistance shielding.

Uploaded by

Harish Kumar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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1. How do you choose height of Standard cells?

2.What are the constraints you will follow while doing


standard cells.

3.How you will take care power in standard cells?

1.what are the difference between higher and lower node

technologies?

2.what is poly pitch?

3.cmos and finfet difference?? Advantages


and disadvantages? and why?

1.Fabrication of FinFet?

2.what are the challenges did you faced lower node technologies?

3.what is mean by Fins?

1.How do you plan for device placement?

2.How you will identify Analog and Digital layout?

3.which one you will give more priority

Analog or digital layout?

* How do you separate in layout.

1.how do you calculate metal width and length?

2.what are the ways to reduce metal resistance?


3.what is mean by metal stag?

4.How do you choose power metal?

4.High speed layout how you will reduce resistance?

5.what is mean by contact and via?

How many vias you will use and how it will help to reduce
resistance.
6.what is mean by resistance shielding?

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