Overview : Microelectronics Manufacturing

Izzani Mohd Israz 2013742633

Nurul Afiqah Abdul Rahim 2013475976
Nurul Ibtisam Mat Seman 2013707673
Nur Aiman Nabihah Ahmad Sarbini 2013383197
PHY605 / AS251 5D
We have seen Tiny Units such as Diode, Transistor, Resistor..
They are basically known as microelectronics, which created from a thing called semiconductor. We
may also have learnt what is semiconductor and its behaviour.

BUT...... OR IN SIMPLE TERMS,

Have you ever wonder how all of these Do you know exactly the microelectronics
microelectronic products are formed? manufacturing process from the beginning until
the end?

1
 What is
Manufacturing
Microelectronics

INTRODUCTION General Steps

OUTLINE Manufacturing
World wide

Wafer Dicing

Assembly Die Bond

MICROELECTRONIC MANUFACTURING
Packaging Wire Bond
MANUFACTURING PROCESS

Testing

Market Change

Microelectronic
Challenges
Overview

Future Trends
2
1 INTRODUCTION
We will deal with the explanation of the microelectronics
manufacturing, general steps in microelectronics manufacturing
process, and manufacturing process companies world wide.

3
 MICROELECTRONICS
MANUFACTURING PROCESS

In simple explanation,
Microelectronic Manufacturing
can be defined as the process by which raw materials are
converted into finished products of microelectronics. [1]

Microelectronics, which are actually produced from the semiconductor materials are generally
created by almost all semiconductor manufacturing companies around the world.

[1] Source from : Fundamentals of Semiconductor Manufacturing and Process Control, By Gary S. May and Costas J. Spanos Copyright 2006 John Wiley & Sons, Inc. 4
Lets check it out!

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 MICROELECTRONIC MANUFACTURING PROCESS
ASSEMBLY
Wafer Dicing Die Bond Wire Bond

Mark, Scan, Pack Testing Packaging

TEST PACKAGE

Microelectronic manufacturing process begins with Assembly;

Wafer dicing, Die bond and Wire bond. It will be packaged then.
After packaging process is complete, the unit will be tested.

Manufacturing Process Overview. [2]

[2] Source/Photo from : http://semiconductorindustry.com 6

 ,
TOP SEMICONDUCTOR COMPANIES
WORLDWIDE

We have seen the general process of microelectronic manufacturing from semiconductor material. Now let us see top 50 semiconductor
companies that involved in microelectronics manufacturing process around the world !!

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 TOP 50 SEMICONDUCTOR COMPANIES WORLDWIDE [3]
1. AMI Semiconductor: Manufacturers of semiconductor and integrated circuit devices.
2. Advanced Semiconductor Engineering: The ASE Group is the worlds largest provider of independent semiconductor manufacturing services in
assembly and test.
3. Analog Devices: High performance signal processing solutions.
4. Atmel: Design and manufacture advanced semiconductors.
5. Avago Technologies: Manufacturers and suppliers of semiconductors analog, mixed-signal and optoelectronic components and subsystems.
6. Cosmic Circuits: Provider of differentiated Analog and Mixed-Signal silicon IP for integration on to System-on-Chips.
7. Crocus Technology: Manufacturers of Magnetic Random Access Memory (MRAM) products and technologies for the semiconductor and electronic
systems industries.
8. Dynex Semiconductor: Manufacturer of power semiconductors, IGBTs, SCRs, GTO Thyristors, fast recovery and rectifier diodes, SCR/Diode modules,
power assemblies, SAW filters and SOS ICs.
9. Elpida Memory: Leading manufacturer of dynamic random access memory (DRAM), RDRAM(R), SDRAM, DDR SDRAM, mobile RAM and consumer
SDRAM.
10. Fairchild Semiconductor: Global supplier of high performance semiconductor products for electronics industry.

[3] Source/Photo from : http://www.electronicsandyou.com/blog/top-50-semiconductor-manufacturing-companies-in-the-world.html 8

 TOP 50 SEMICONDUCTOR COMPANIES WORLDWIDE [3]
11. Freescale Semiconductor: Manufacturer of microcontrollers, microprocessors and semiconductors.
12. Fujitsu: Manufacturer and supplier of customer-focused IT and communications solutions
13. Hynix (Formerly Hyundai Electronics): Memory semiconductor supplier of dynamic random access memory (DRAM) chips and flash memory chips.
14. IBM: IBM manufactures and sells computer hardware and software.
15. IM Flash Technologies: IM Flash Technologies is a joint venture of Micron Technology and Intel. Providers of advanced semiconductor solutions and
NAND flash products.
16. Infineon Technologies: Manufacturer of memory, MOSFET, power, microcontrollers, communications, and consumer products.
17. Inotera: Provides commodity DRAM foundry services on 300mm silicon wafers.
18. Intel Corporation: The world leader in silicon innovation develops processor technologies and supports global initiatives.
19. International Rectifier: Manufacturer of power semiconductors (MOSFET, IBGT, diodes and Thyristors).
20. IPtronics: Fabless semiconductor company offering next generation integrated circuits for parallel optical Interconnects.

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 TOP 50 SEMICONDUCTOR COMPANIES WORLDWIDE [3]
21. Jennic Limited: Market leader in ZigBee, 6LoWPAN, IEEE802.15.4 wireless microcontrollers, modules and evaluation kits.
22. Luxtera: Silicon photonics, CMOS photonics.
23. Materials Research Corporation (Praxair): Global manufacturer and supplier of highly specialized semiconductor materials and equipment.
24. Maxim Integrated Products: Analog and mixed signal ICs in 28 categories.
25. Microchip Technology: Microcontroller and analog semiconductors.
26. Micron Technology: Offers DRAM components, modules, and NAND flash memory.
27. National Semiconductor: Manufacturer and supplier of analog and mixed-signal technologies for systems on a chip.
28. NEC: Providers of Internet, broadband network and enterprise business solutions.
29. Nemotek Technologie: Manufactures customized wafer level cameras (WLC) for portable applications such as mobile phones and laptop computers.
30. Numonyx: A semiconductor company making flash memories.

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 TOP 50 SEMICONDUCTOR COMPANIES WORLDWIDE [3]
31. Nuvoton: Offers consumer IC design, and foundry service.
32. NXP Semiconductors: semiconductors, system solutions and software.
33. ON Semiconductor: Supplies a broad portfolio of semiconductors and integrated circuit devices.
34. Oramir (now Applied Materials): Advanced technology for cleaning silicon wafers
35. Panasonic Corporation: Electronics manufacturing.
36. Qimonda: Memory / DRAM
37. Reading Works (Now Closed): Manufacturer of integrated circuit and optoelectronic equipment for communication and computing.
38. Renesas Technology: Semiconductor, microcomputers, logic and analog devices, discrete devices and memory products.
39. Samsung Electronics: Semiconductors including DRAM, flash, SRAM, graphics memory, MCP, mask ROM, system LSI, TFT LCD modules etc.
40. Sanyo: Semiconductors including discrete devices, flash memory and ICs.

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 TOP 50 SEMICONDUCTOR COMPANIES WORLDWIDE [3]
41. Seiko: Semiconductor CMOS IC, power management ICs, EEPROMs, sensors and real-time clocks.
42. SensorDynamics: Micro- and wireless semiconductor sensor.
43. Sharp Corporation: Among the Worldwide top 20 semiconductor sales leaders
44. Sitronics: Offers telecommunications solutions, information technologies, system integration and consulting, and the development and manufacture of
microelectronics products.
45. Sony: Sony semiconductor
46. STMicroelectronics: Offers System-on-Chip (SoC) and semiconductor solutions.
47. Texas Instruments: Designer and supplier of digital signal processors, discrete and integrated circuits, calculators, and digital light processing (DLP).
48. Toshiba: Manufacturer and supplier of semiconductor, memory storages device, general-purpose logic IC, transistors, diode, optical semiconductor
device, sensor, radio-frequency device, microcomputer, ASIC, ASSP, general-purpose linear IC, power supply IC, transistor array, motor driver,
operational amplifier IC, comparator IC, Op Amp.
49. TriQuint Semiconductor: High-performance RF components for wireless communication.
50. Winbond: Semiconductor memory solutions.

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2 MANUFACTURING PROCESS
We will go through all the microelectronics manufacturing process
step by step ; Assembly, Packaging, Testing.

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WHAT IS ASSEMBLY?
A process in which fully processed
semiconductor device or circuit in
the form of a chip is mechanically
and electrically connected to the
package.

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 Assembly Process Overview..

Leads on the lead

These semiconductor frame are then
The assembly process connected by
Once the front-end chips are then
is necessary to protect aluminum or gold
production process is individually attached
the chip, facilitate its wires to the
complete, the wafer is by means of an alloy
integration into input/output terminals
transferred to an or an adhesive to a
electronic systems, on the semiconductor
assembly facility, lead frame, a metallic
limit electrical chip through the use of
where it is sawed into device used to
interference and automated machines
individual connect the
enable the dissipation known as wire
semiconductor chips. semiconductor to a
of heat from the device bonders.
circuit board

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Steps in Assembly Process

Wafer
Die Bond Wire Bond
Dicing

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 Assembly : Wafer Dicing [4]
Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The
dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser
cutting. ......
During dicing, wafers are typically mounted on dicing tape which has a sticky backing
that holds the wafer on a thin sheet metal frame. Dicing tape has different properties
depending on the dicing application. UV curable tapes are used for smaller sizes and
non-UV dicing tape for larger die sizes.
Once a wafer has been diced, the pieces left on the dicing tape are referred to as die,
dice or dies. Each will be packaged in a suitable package or placed directly on a
printed circuit board substrate as a "bare die".
Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of
semiconductor material following wafer microfabrication. The tape holds the pieces
of semiconductor, known as dies, together during the cutting process, mounting them
to a thin metal frame.

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[4] Source/Photo from : www.furukawa.co.jp
 Assembly : Wafer Dicing
Type of Wafer Dicing : Diamond Blade Dicing
There are three common type of dicing : Diamond Blade Dicing, Stealth Dicing and Plasma Dicing.

......1. DIAMOND BLADE DICING

A diamond saw can be used to dice materials such as amorphous or polycrystalline
silicon that do not fracture neatly, whereas scribing cannot be used on these
materials. Diamond scribing also follows the natural contours of the material, so the
edges tend to be angles as opposed to vertical as they are with diamond saw wafer
dicing.

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 Assembly : Wafer Dicing
Type of Wafer Dicing : Stealth Dicing
......2. STEALTH DICING
Stealth dicing is an innovative, high-quality dicing technology that uses a laser to cut a semiconductor wafer into small pieces by
internal processing. Stealth dicing is a technology absolutely essential for meeting these harsh conditions. This is one part of the overall
flow in the semiconductor fabrication process where a change in the dicing step can exert drastic effects on the entire process.

Laser Processing Process

Stealth Dicing Processing

Method

Separation Process

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 Assembly : Wafer Dicing
......2. STEALTH DICING
Type of Wafer Dicing : Stealth DicingSeparation
[5] Process
Laser Processing Process
In the laser processing process, a laser beam scans along the pre- In the separation process, an external force such as tape
planned dicing line on the wafer affixed by tape, forming an SD layer expansion is applied to the wafer that has now been laser-
internally in the wafer. machined to form the SD layer along the preplanned SD lines.
Stealth dicing allows processing optional positions within the wafer by This force or expansion creates cracks that extend perpendicularly
using a dedicated laser and optical system. from the SD layer towards the front and back sides of the wafer,
splitting it into individual chips.
This means that the processing forms no debris or damage on the
front and back side surfaces and no purified water is needed for Crack extension causes the wafer to split so that cutting loss is
washing. Stealth dicing can be performed in a completely dry process. essentially zero. It is therefore possible to allow the split surface to
A dedicated AF function also allows high-speed operation. approach the active area or to separate ultra-thin wafers and
MEMS wafers into chips without applying mechanical stress

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[5] Source/Photo from : www.hanamatsu.com
 Assembly : Wafer Dicing
Type of Wafer Dicing : Plasma Dicing
......3. PLASMA DICING
Plasma dicing, using Deep Reactive Ion Etching (DRIE) processing, is gaining rapid acceptance within the semiconductor industry as a
viable alternative to conventional singulation methods using saw blades or LASERs.
Plasma dicing can be carried out before grinding, where deep dicing lanes are etched into the wafer and the die are singulated by a
final backside grind operation, or after grind where DRIE is used to etch through thinned wafers mounted on taped frames, or carriers.

Benefits of
Plasma Dicing

Up to 80% more die

Up to 100% stronger Flexibility for die
wafer at higher
die at higher yields layout and design
throughout

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 22
COMPARISONS OF TYPE OF DICING : Blade, Laser, Stealth
 Assembly : Die Bond
Type of Die Bond: Eutectic Bonding [6]
Die Bonding is the process of attaching the semiconductor die either to its package or to some substrate. Common types of die
bond ; Eutectic Bond, Epoxy Bond, Solder Attach Bond.
......1. EUTECTIC BONDING
Parameters for Eutectic Bonding A eutectic bond is formed by melting a preform consisting of a mixture or alloy of two
or more dissimilar metals in the joint between the die and substrate.
In some cases the die may have a eutectic alloy pre-plated on its back omitting the
Bonding Bonding need for a preform. The preform has a melting point which is lower than the melting
Tool pressure
temperature duration point of its base materials.

Pros Cons
Good thermal conductivity High processing temperature
Electrically conductive Requires use of inert gas to prevent oxidation
Good fatigue/creep resistance
Low contamination

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[6] Source/Photo from : www.eetimes.com
 Assembly : Die Bond
Type of Die Bond: Epoxy Bonding
......2. EPOXY BONDING
An epoxy bond is formed by attaching the die to the substrate with the use of epoxy glue. A drop of epoxy is dispensed on the
package and the die placed on top of it.
This process uses adhesives such as polyimide, epoxy and silver-filled glass as die attach material to mount the die on the die pad. The
mass of epoxy climbing the edges of the die is known as the die attach fillet.

Pros Cons
Low curing temperatures Outgassing
Wide range of die sizes Voids in the bond (sometimes)
Rework is possible Inferior thermal/electrical conductivity
Low cost Sensitive to harsh environments
Reduced die stresses Dimensional changes during processing and service life

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 Assembly : Die Bond
Type of Die Bond: Solder Attach Bonding
......3. SOLDER ATTACH BONDING
Solder attach is the most preferably type of die bonding because of the better thermal conductivity of the solder material .
As there is extreme variation of temperature on die during its operation, solder attach is used as the important concept to dissipate
heat generated from the power device efficiently.

Pros Cons
Relatively insensitive to metallization High processing temperature
Good thermal & electrical conductivity Heat during processing causes oxidation

Limited stress relaxation

Low void content

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 Assembly : Wire Bond
Wire Bond
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its
packaging during semiconductor device fabrication

Copper wire

Material of bond
Pure gold wire
wire
Techniques of Wire Bonding
Alloyed aluminium wire

Ball Bonding Wedge Bonding Compliant Bonding

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 Flip Chip Bonding [9]
Known as controlled collapse chip connection or its
abbreviation, C4, is a method for interconnecting
semiconductor devices, such as IC chips and
Assembly : Wire Bond microelectromechanical systems (MEMS), to external
circuitry with solder bumps that have been
Type of Wire Bonding: Ball, Wedge, Flip deposited onto the chip pads.
Ball Bonding [7] Chip Bonding Advantages : greatly reduce inductance
allowing higher-speed signals
Ball bonding is the process in which pads are connected onto a die and leadframe (or substrate) conduct heat better
using very fine diameter wire. The basic steps of ball bonding include the formation of: the first Disadvantages : not suitable for easy replacement or
bond (normally on the chip), the wire loop, and the second bond (normally on the substrate). manual installation, require very flat surfaces to
mount to.
Wedge Bonding [8]
In wedge bonding, the wire must be drawn in a straight line
according to the first bond. This slows down the process
due to time needed for tool alignment

[7] Source/Photo from : Wire Bond/Ball Shear, Application Notes,

Dielectric Laboratories
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[8] Source/Photo from : www.integratedhybridassembly.com
[9] Source/Photo from : http://web.eng.gla.ac.uk/
WHAT IS ELECTRONIC PACKAGING?

Electronic packaging refers to the method

of enclosing, protecting or providing
physical structure to either electronic
components, assemblies of components or
finished electronic devices.

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 Electronic Packaging...

Electronic Packaging must provide : A typical microelectronic package is designed to

Circuit support and protection provide the following functions :
Heat dissipation Connections for signal lines leading onto and off the
Signal distribution silicon chip.
Manufacturability and serviceability Connections for power lines that powers the
Power distribution circuits on the chip.
Connections of signal lines between the system
components and interconnections for input/output
terminals.
Removal of the heat generated by the circuits.
Support and protection of the bare chip

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Electronic Packaging Requirements
Large Requirements for packaging :
Must provide acceptable electrical properties,
including capacitance, resistance and inductance
IC assembly technologies should provide a low cost
solution for the electrical interface between the chip
and package
High throughput manufacturing
High reliability
Repair ability or replace ability where
interconnection between IC and package should
provide removal of the failed IC

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Packaging Characteristics

Thermal Performance Signal integrity Power distribution

Ability to dissipate the heat To ensure that the package The package must be able to
generated by the IC parasitic inductances and supply enough current for the IC
capacitances do not distort the to work, and it must be also
I/O signals capable of handling the highest
current peaks

Manufacturability Stability Reliability

The best package is useless if it To check if all pins have been The package must provide a
cannot be soldered. It should correctly soldered. It is also good long-term reliability even
not require excessive handling about its prototyping capabilities in the harshest environments
precautions

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Materials used in packaging

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Issues in electronic packaging

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 Hierarchy of Interconnection level [10]
Level 0
Gate-to-gate interconnections on the
silicon die
Level 1
Connections from the chip to its
package
Level 2
PCB, from component to component
or to external connector
Level 3
Connections between PCBs, including
backplanes or motherboards
Level 4
Connections between subassemblies,
for example a rack
Level 5
Connections between physically
separate systems, using for example an
Ethernet LAN 34
[10] Source from : http://www.doe.carleton.ca/~tjs/10-Packaging.pdf
 INTEGRATED CIRCUITS PACKAGE FAMILY TREE [11]

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[11] Source from : http://www.pcbheaven.com/userpages/semiconductor_package_families/
 INDUSTRIAL PACKAGING HISTORY [12]

[12] Source from : http://anysilicon.com/semiconductor-packaging-history-trends/

 Electronic Packaging Classification [13]
PTH (pin-through-hole)
Pins are inserted into through-holes in the circuit
board and soldered in place from the opposite
side of the board
* Sockets available
* Manual P&P possible

SMT (surface-mount-technology):
SMT packages have leads that are soldered
directly to corresponding exposed metal lands on
the surface of the circuit board
* Elimination of holes
* Ease of manufacturing (high-speed P&P)
* Components on both sides of the PCB
* Smaller dimensions
* Improved package parasitic components
* Increased circuit-board wiring density

37
[13] Source from : http://slideplayer.com/slide/5922715/
 Molding Process (in BGA)
SAMPLE
TEXT 4. After opening of top & bottom molds, the
This is a molded products are taken out, the mold
surface is automatically cleaned, and
sample text SAMPLE every molding process completes.
TEXT
This is a sample text.
1. Put the wired silicon chips Insert your desired
with the integrated circuits on text here. 3. The compound comes into the molding
a mold, and the load a TEXT areas slowly not to bend the thin wires and
particular epoxy compound a This is a not to have voids, and then keep the top &
pot sample bottom molds closing until the compound
TEXT text has been cured.
This is a *The epoxy compound has a particular
sample text
property, and it never be melt down even
by high temperature once it is cured.
TEXT
2. After closing top and bottom mold with several tens of clamping tonnage, a
transfer unit pushes compound up and the compound flows into molding areas
melting down by mold temperature(approx. 180 degrees C). 38
WHAT IS MICROELECTRONIC TESTING?

Electronic packaging refers to the method

of enclosing, protecting or providing
physical structure to either electronic
components, assemblies of components or
finished electronic devices.

39
 Microelectronics Testing
5. Stud Pull Testing
1. Microelectronics Device Testing The stud pull method of bond strength testing requires accurate specimen preparation and test
for verification and validation of modeling, reliability and alignment.
life prediction (accelerated life testing), process control The self-aligning stud pull test fixture ensure excellent test alignment, while a specimen preparation
and development, failure analysis and quality assurance fixture ensures correct specimen positioning.
8. Fatigue Testing of Solder Joints
2. Film Adhesion Testing 6. Microelectronics Materials Testing
Mechanical test techniques can be
To test fixed and variable angle fixtures for peel testing Materials testing is used to determine the basic thermo- used in place of thermal cycling for
on a range of film types. mechanical properties (e.g. modulus, yield strength,
fatigue and accelerated life testing of
In both cases the use of a special linkage system ensures Poisson's ratio) needed for realistic modeling as well as system components.
a constant peel angle during the test the advanced properties (e.g. creep, fatigue and fracture
Compared to thermal cycling,
mechanics) needed for life prediction.
3. Ball, Die and Component Shear Testing mechanical cycling allows much
7. Micro Bend Testing on Silicon Dies shorter test times and independent
The shear fixture is suitable for solder ball, die and
In order to accurately measure the strength of silicon dies control of temperature and humidity.
component shear testing.
in a bend test, the fixture must be highly precise.
It incorporates features designed to minimize variables
The micro bend fixture incorporates a stepped upper anvil 9. Determination of Interfacial
associated with this test method in order to ensure high
that engages with the lower supports, allowing separation Strength
quality data. to determine the strength of an
and alignment of the lower anvils to be set precisely.
4. Other Device and Component Tests interface between a lead frame
lead and component pull testing, fatigue of individual joints and assemblies, switch activation forces and durability material and a molding compound.
and torsion testing. A precision bend fixture with the
10. Determination of Interfacial Strength ability to locate the specimen
to determine the strength of an interface between a lead frame material and a molding compound. position allows this test to be carried
A precision bend fixture with the ability to locate the specimen position allows this test to be carried out simply and out simply and accurately. 40
accurately.
3 MICROELECTRONICS OVERVIEW
We will study the market change, and challenges in microelectronics
manufacturing process, and also the future trends in this field.

41
 MARKET CHANGE
Consumer wants more & more functionality
MEMs, Sensors & more.
Product Cost expectations are given
Smart Phone superseded PC as the Market
Driver
Dynamic consumer business is the new
players dominating

With the mobile and smart phone era, the

MEMS unit [14]
packaging industry is experiencing a
flowering of new packages and reinvention of
traditional packages
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[14] Source/Photo from : www.directindustry.com
43
44
 FUTURE TRENDS

Wafer Level System integration [15]

Thin film technologies,
Wafer thinning, Thin Wafer Handling
Through Silicon Via (TSV) Formation
Achieve higher yield with wafer level system integration High density metallization, redistribution
Interposer, assembly and interconnection
technologies

45

[15] Source/Photo from :http://www.dupont.com/products-and-services/electronic-electrical-materials/semiconductorfabrication-packaging-materials/brands/wafer-

level-packaging.html
 FUTURE TRENDS

Miniaturized Wafer
-Level-Camera [17]
Thin film technologies,
Wafer level integration of optics and camera electronics
Module size: 0.7 x 0.7 x 1.0 mm Wafer thinning, Thin Wafer Handling
Application: Medical Devices
Through Silicon Via (TSV) Formation
High density metallization, redistribution
Interposer, assembly and interconnection
technologies

46

[17] Source/Photo from :http://www.vision-systems.com/articles/2014/04/flir-to-showcase-miniature-lepton-thermal-imaging-camera-core-at-spie-dss-2014.html

 Credits and Special Thanks

Special thanks to all other sources and photos :

https://en.wikipedia.org/wiki/Flip_chip
http://www.hamamatsu.com/jp/en/community/SD/SD_outline/SD_comparison.html
http://dicingusa.com/wafer-dicing/
http://www.eetimes.com/document.asp?doc_id=1279750
http://www.hybond.com/pages/diebond-about.php
http://www.integratedhybridassembly.com/wire-bonding/

Thanks! 47