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黃光

The document discusses the process and components of photolithography used in semiconductor manufacturing. It describes the steps involved including coating, exposure, and development of positive and negative photoresists using a mask and aligner. The photoresist is made up of polymer, solvent, sensitizer, and additives which control solubility changes during exposure to transfer the mask pattern onto the wafer.

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陳彥儒
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98 views

黃光

The document discusses the process and components of photolithography used in semiconductor manufacturing. It describes the steps involved including coating, exposure, and development of positive and negative photoresists using a mask and aligner. The photoresist is made up of polymer, solvent, sensitizer, and additives which control solubility changes during exposure to transfer the mask pattern onto the wafer.

Uploaded by

陳彥儒
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Lithography

Objectives

List the four components of the photoresist


Describe the difference between +PR and -PR
Describe a photolithography process sequence
List four alignment and exposure systems
Describe the wafer movement in a track-stepper
integrated system.
Explain relationships of resolution and depth of
focus to wavelength and numerical aperture.
Photolithography Requirements

High Resolution
High PR Sensitivity
Precision Alignment
Precise Process Parameters Control
Low Defect Density
Step of Lithography
Wafer clean
Pre-bake
Photoresist spin coating
Soft bake
Alignment and exposure
Post exposure bake(PEB)
Development
Hard bake
Pattern inspection
Negative and Positive Photoresists
Photoresist
Substrate

UV light
Mask/reticle

Photoresist
Exposure
Substrate

Negative
Photoresist
Substrate After
Positive Development
Photoresist
Substrate
Photoresist Composition

Polymer
Solvents
Sensitizers
Additives
Polymer
Solid organic material
Transfers designed pattern to wafer surface
Changes solubility due to photochemical reaction when
exposed to UV light.
Positive PR: from insoluble to soluble
Negative PR: from soluble to insoluble
Solvent
Dissolves polymers into liquid
Allow application of thin PR layers by spinning.

Sensitizers
Controls and/or modifies photochemical reaction of
resist during exposure.
Determines exposure time and intensity
Additives
Various added chemical to achieve desired process
results, such as dyes to reduce reflection.
Negative Photoresist

Disadvantages
Polymer absorbs the development solvent
Poor resolution due to PR swelling
Environmental and safety issues due to the main
solvents xylene.
Positive Photoresist

Exposed part dissolve in developer


solution
Image the same that on the mask until
130nm
Higher resolution
Commonly used in IC fabs
Positive Photoresist

Novolac resin polymer


Acetate type solvents
Sensitizer cross-linked within the resin
Energy from the light dissociates the sensitizer and
breaks down the cross-links
Resin becomes more soluble in base solution
Q&A
What about the difference between positive and negative photoresist?
Positive photoresist can achieve much higher resolution than negative
photoresist, why didnt people use it before the 1980s?
List the four components that make up the photoresist and their
function?
Why should the spin coating have two speed ?
What will happen if the soft bake is too long? too short?
What will happen if the PEB is too long? too short?
What will happen if the hard bake is too long? too short?

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