INTEGRATED CIRCUITS

DATA SHEET

SAA1064
4-digit LED-driver with I2C-Bus
interface
Product specification
File under Integrated Circuits, IC01

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

GENERAL DESCRIPTION
The LED-driver is a bipolar integrated circuit made in an
I2L compatible 18 volts process. The circuit is especially
designed to drive four 7-segment LED displays with
decimal point by means of multiplexing between two pairs
of digits. It features an I2C-Bus slave transceiver interface
with the possibility to program four different SLAVE
ADDRESSES, a POWER RESET flag, 16 current sink
OUTPUTS, controllable by software up to 21 mA, two
multiplex drive outputs for common anode segments, an
on-chip multiplex oscillator, control bits to select static,
dynamic and blank mode, and one bit for segment test.
QUICK REFERENCE DATA
PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Supply voltage

VEE = 0 V

VCC

4.5

15

Supply current all outputs OFF

VCC = 5 V

ICC(1)

9.5

14

mA

24-lead DIL (SOT101B)

Ptot

1000

mW

24-lead DIL SO (SOT137A)

Ptot

500

mW

Tamb

40

+85

Total power dissipation

Operating ambient
temperature range
Note
1. The positive current is defined as the conventional current flow into a device (sink current).
PACKAGE OUTLINE
SAA1064: 24-lead DIL; plastic with internal heat spreader (SOT101B); SOT101-1; 1996 August 30.
SAA1064T: 24-lead mini-pack; plastic (SO-24; SOT137A); SOT137-1; 1996 August 30.

February 1991

Philips Semiconductors

Product specification

SAA1064

Fig.1 Block diagram.

4-digit LED-driver with I2C-Bus interface

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

PINNING
SYMBOL

PIN

DESCRIPTION

ADR

I2C-Bus

CEXT

external control

P8 to P1

3-10

segment output

MX1

11

multiplex output

VEE

12

ground

VCC

13

positive supply

MX2

14

multiplex output

P9 to P16

15-22

segment output

SDA

23

I2C-Bus serial data line

SCL

24

I2C-Bus serial clock line

slave address input

Fig.2 Pinning diagram.

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

FUNCTIONAL DESCRIPTION

a. READ mode.

b. WRITE mode.

S = start condition

A1, A0

= programmable address bits

P = stop condition

SC SB SA

= subaddress bits

A = acknowledge

C6 to C0

= control bits

X = dont care

PR

= POWER RESET flag

Fig.3 I2C-Bus format.

Address pin ADR

Four different slave addresses can be chosen by connecting ADR either to VEE, 3/8 VCC, 5/8 VCC or VCC. This results in
the corresponding valid addresses HEX 70, 72, 74 and 76 for writing and 71, 73, 75 and 77 for reading. All other
addresses cannot be acknowledged by the circuit.

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

Status byte
Only one bit is present in the status byte, the POWER RESET flag. A logic 1 indicates the occurence of a power failure
since the last time it was read out. After completion of the READ action this flag will be set to logic 0.
Subaddressing
The bits SC, SB and SA form a pointer and determine to which register the data byte following the instruction byte will
be written. All other bytes will then be stored in the registers with consecutive subaddresses. This feature is called
Auto-Increment (AI) of the subaddress and enables a quick initialization by the master.
The subaddress pointer will wrap around from 7 to 0.
The subaddresses are given as follows:
SC

SB

SA

SUB-ADDRESS

FUNCTION

00

control register

01

digit 1

02

digit 2

03

digit 3

04

digit 4

05

reserved, not used

06

reserved, not used

07

reserved, not used

Control bits (see Fig.4)

The control bits C0 to C6 have the following meaning:
C0 = 0

static mode, i.e. continuous display of digits 1 and 2

C0 = 1

dynamic mode, i.e. alternating display of digit 1 + 3 and 2 + 4

C1 = 0/1

digits 1 + 3 are blanked/not blanked

C2 = 0/1

digits 2 + 4 are blanked/not blanked

C3 = 1

all segment outputs are switched-on for segment test(1)

C4 = 1

adds 3 mA to segment output current

C5 = 1

adds 6 mA to segment output current

C6 = 1

adds 12 mA to segment output current

Note
1. At a current determined by C4, C5 and C6.
Data
A segment is switched ON if the corresponding data bit is logic 1. Data bits D17 to D10 correspond with digit 1, D27 to
D20 with digit 2, D37 to D30 with digit 3 and D47 to D40 with digit 4.
The MSBs correspond with the outputs P8 and P16, the LSBs with P1 and P9. Digit numbers 1 to 4 are equal to their
subaddresses (hex) 1 to 4.

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

SDA, SCL
The SDA and SCL I/O meet the I2C-Bus specification. For protection against positive voltage pulses on these inputs
voltage regulator diodes are connected to VEE. This means that normal line voltage should not exceed 5,5 volt. Data will
be latched on the positive-going edge of the acknowledge related clock pulse.
Power-on reset
The power-on reset signal is generated internally and sets all bits to zero, resulting in a completely blanked display. Only
the POWER RESET flag is set.
External Control (CEXT)
With a capacitor connected to pin 2 the multiplex frequency can be set (see Fig.5). When static this pin can be connected
to VEE or VCC or left floating since the oscillator will be switched off.
Segment outputs
The segment outputs P1 to P16 are controllable current-sink sources. They are switched on by the corresponding data
bits and their current is adjusted by control bits C4, C5 and C6.
Multiplex outputs
The multiplex outputs MX1 and MX2 are switched alternately in dynamic mode with a frequency derived from the
clock-oscillator. In static mode MX1 is switched on. The outputs consist of an emitter-follower, which can be used to drive
the common anodes of two displays directly provided that the total power dissipation of the circuit is not exceeded. If this
occurs external transistors should be connected to pins 11 and 14 as shown in Fig.5.

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage (pin 13)

CONDITIONS
VEE = 0 V

Supply current (pin 13)

SYMBOL

MIN.

MAX.

UNIT

VCC

0.5

18

ICC

50

200

mA

Total power dissipation

24-lead DIL (SOT101B)

Ptot

1000

mW

24-lead SO (SO137A)

Ptot

500

mW
V

SDA, SCL voltages

VEE = 0 V

V23, 24

0.5

5.9

Voltages ADR-MX1 and MX2-P16

VEE = 0 V

V1-11, V14-22

0.5

VCC + 0.5 V

Input/output current all pins

outputs OFF

II/O

10

mA

Tamb

40

+85

Tstg

55

+150

Operating ambient
temperature range
Storage temperature range
THERMAL RESISTANCE
From crystal to ambient
24-lead DIL

Rth j-a

35 K/W

24-lead SO (on ceramic substrate)

Rth j-a

75 K/W

24-lead SO (on printed circuit board)

Rth j-a

105 K/W

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

CHARACTERISTICS
VCC = 5 V; Tamb = 25 C; voltages are referenced to ground (VEE = 0 V); unless otherwise specified
PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Supply
VCC

4,5

5,0

15

VCC = 5 V

ICC

7,0

9,5

14,0

mA

all outputs OFF

Pd

50

mW

Input voltages

V23,24

5,5

Logic input voltage LOW

VIL(L)

1,5

Logic input voltage HIGH

VIH(L)

3,0

Supply voltage (pin 13)

Supply current
Power dissipation

all outputs OFF

SDA; SCL (pins 23 and 24)

Input current LOW

V23,24 = VEE

IIL

10

Input current HIGH

V23,24 = VCC

IIH

10

IO = 3 mA

VOL(L)

0,4

ISDA

mA

A0 = 0; A1 = 0

V1

VEE

3/16VCC

A0 = 1; A1 = 0

V1

5/16VCC

3/8VCC

7/16VCC

A0 = 0; A1 = 1

V1

9/16VCC

5/8VCC

11/16VCC

A0 = 1; A1 = 1

V1

13/16VCC

VCC

SDA
Logic output voltage LOW
Output sink current
Address input (pin 1)
Input voltage
programmable address bits:

Input current LOW

V1 = VEE

I1

10

Input current HIGH

V1 = VCC

I1

10

VIL

VCC3,3

External control (CEXT) pin 2

Switching level input
Input voltage LOW

VIH

VCC1,5

V2 = 2 V

I2

140

160

180

V2 = 4 V

I2

140

160

180

Input voltage HIGH

Input current

February 1991

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

PARAMETER

CONDITIONS

SAA1064

SYMBOL

MIN.

TYP.

MAX.

UNIT

Segment outputs
(P8 to P1; pins 3 to 10)
P9 to P16; pins 15 to 22)
Output voltages

IO = 15 mA

VO

0.5

Output leakage current HIGH

VO = VCC = 15 V ILO

10

VOL = 5 V

IOL

17.85

21

25.2

mA

control bit C4

IO

2.55

3.0

3.6

mA

control bit C5

IO

5.1

6.0

7.2

mA

control bit C6

IO

10.2

12.0

14.4

mA

IO

7.5

IMPX = 50 mA

VMPX

VCC1.5

VMPX = 2 V

IMPX

50

110

mA

VO = 2 V

+IMPX

50

70

110

CEXT = 2.7 nF

TMPX

10

ms

48.4

Output current LOW

All control bits (C4, C5
and C6) are HIGH
Contribution of:

Relative segment output

current accuracy
with respect to highest value
Multiplex 1 and 2 (pins 11
and 14)
Maximum output voltage
(when ON)
Maximum output current HIGH
(when ON)
Maximum output current LOW
(when OFF)
Multiplex output period
Multiplexed duty factor
* Value to be fixed.

February 1991

10

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

Fig.4 Timing diagram.

February 1991

11

SAA1064

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

APPLICATION INFORMATION

Fig.5 Dynamic mode application diagram.

February 1991

12

SAA1064

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

Fig.6 Static mode application diagram.

February 1991

13

SAA1064

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

POWER DISSIPATION
The total maximum power dissipation of the SAA1064 is made up by the following parts:
1. Maximum dissipation when none of the outputs are programmed (continuous line in Fig.7).
2. Maximum dissipation of each programmed output. The dashed line in Fig.7 visualises the dissipation when all the
segments are programmed (max. 16 in the static, and max. 32 in the dynamic mode). When less segments are
programmed one should take a proportional part of the maximum value.
3. Maximum dissipation of the programmed segment drivers which can be expressed as:
Padd = VO IO N.

Where:

Padd = The additional power dissipation of the segment drivers

VO

= The low state segment driver output voltage

IO

= The programmed segment output current

= The number of programmed segments in the static mode, or half the number of
programmed segment drivers in the dynamic mode.

Under no conditions the total maximum dissipation (500 mW for the SO and 1000 mW for the DIL package) should be
exceeded.

Example: VCC

= 5V

VO

= 0.25 V

IO

= 12 mA

24 programmed segments in dynamic mode

Ptot

= P1 + P2 + P3
= 75 mW + (50 * 24/32) mW + (0.25 * 12.103 * 12) mW
= 148.5 mW

February 1991

14

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

MEA104

750

handbook, full pagewidth

dissipation
(mW)
(1)

500

(2)
250

0
0

2.5

5.0

7.5

10.0

(1) All outputs programmed (no segment current sink).

(2) Outputs not programmed.

Fig.7 SAA1064 power dissipation as a function of supply voltage.

February 1991

15

12.5

VCC (V)

15.0

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

PACKAGE OUTLINES

seating plane

DIP24: plastic dual in-line package; 24 leads (600 mil)

SOT101-1

ME

A2

A1
c
e

b1

w M
(e 1)

b
MH

13

24

pin 1 index
E

12

10 mm

scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT

A
max.

A1
min.

A2
max.

b1

D (1)

E (1)

e1

ME

MH

Z (1)
max.

mm

5.1

0.51

4.0

1.7
1.3

0.53
0.38

0.32
0.23

32.0
31.4

14.1
13.7

2.54

15.24

3.9
3.4

15.80
15.24

17.15
15.90

0.25

2.2

inches

0.20

0.020

0.16

0.066
0.051

0.021
0.015

0.013
0.009

1.26
1.24

0.56
0.54

0.10

0.60

0.15
0.13

0.62
0.60

0.68
0.63

0.01

0.087

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES

OUTLINE
VERSION

IEC

JEDEC

SOT101-1

051G02

MO-015AD

February 1991

EIAJ

EUROPEAN
PROJECTION

ISSUE DATE
92-11-17
95-01-23

16

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

A
X

c
HE

v M A

Z
13

24

Q
A2

(A 3)

A1
pin 1 index

Lp
L

12
e

detail X

w M

bp

10 mm

scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT

A
max.

A1

A2

A3

bp

D (1)

E (1)

HE

Lp

mm

2.65

0.30
0.10

2.45
2.25

0.25

0.49
0.36

0.32
0.23

15.6
15.2

7.6
7.4

1.27

10.65
10.00

1.4

1.1
0.4

1.1
1.0

0.25

0.25

0.1

0.10

0.012 0.096
0.004 0.089

0.01

0.019 0.013
0.014 0.009

0.61
0.60

0.30
0.29

0.419
0.043
0.050
0.055
0.394
0.016

inches

0.043
0.039

0.01

0.01

(1)

0.9
0.4

0.035
0.004
0.016

8o
0o

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES

OUTLINE
VERSION

IEC

JEDEC

SOT137-1

075E05

MS-013AD

February 1991

EIAJ

EUROPEAN
PROJECTION

ISSUE DATE
95-01-24
97-05-22

17

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 C.

SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at
45 C.
WAVE SOLDERING

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in
our IC Package Databook (order code 9398 652 90011).

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

DIP
SOLDERING BY DIPPING OR BY WAVE

The longitudinal axis of the package footprint must be

parallel to the solder flow.

The maximum permissible temperature of the solder is

260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The package footprint must incorporate solder thieves at

the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Maximum permissible solder temperature is 260 C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 C within
6 seconds. Typical dwell time is 4 seconds at 250 C.

REPAIRING SOLDERED JOINTS

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.

REPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 C.

SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

February 1991

SAA1064

18

Philips Semiconductors

Product specification

4-digit LED-driver with I2C-Bus interface

SAA1064

DEFINITIONS
Data sheet status
Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

February 1991

19