Mc12022A Mc12022B Consider Mc12052A For New Designs 1.1Ghz Dual Modulus Prescaler
Mc12022A Mc12022B Consider Mc12052A For New Designs 1.1Ghz Dual Modulus Prescaler
MC12022A
MC12022B
8
1
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO8)
FUNCTIONAL TABLE
SW
MC
Divide Ratio
64
65
128
129
8
1
P SUFFIX
PLASTIC PACKAGE
CASE 626
NOTES: 1. SW: H = VCC, L = Open. A logic L can also be applied by grouunding this pin,
but this is not recommended due to increased power soncumption.
2. MC: H = 2.0 V to VCC, L = GND to 0.8 V.
QB
QB
C M
PIN CONNECTIONS
IN
VCC
SW
OUT
Q
C
QB
In
In
IN
NC
MC
Gnd
(Top View)
MC
ORDERING INFORMATION
D
D
C
QB
QB
E
C
F
Q
QB
G
QB
QB
Device
H
Q
SW
C S Q
Out
Operating
Temperature Range
Package
MC12022AD
SO8
MC12022AP
Plastic
MC12022BD
TA = 40 to +85C
MC12022BP
SO8
Plastic
Rev 3
MC12022A MC12022B
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC
0.5 to + 7.0
Vdc
TA
40 to +85
Tstg
65 to +150
NOTE;
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = 40C to 85C, unless otherwise noted.)
Characteristic
Toggle Frequency (Sine Wave Input)
Symbol
Min
Typ
Max
Unit
ft
0.1
1.6
1.1
GHz
ICC
7.5
10
mA
VIH1
2.0
VCC
VIL1
0.8
VIH2
VCC
VCC
VCC
Vdc
VIL2
Open
Open
Open
Vout
1.0
1.6
Vpp
tset
11
16
ns
Vin
100
400
1500
1500
mVpp
IO
1.5
4.0
mA
500 m
20 ns
500 m
20 ns
MC12022A MC12022B
Figure 3. Modulus Setup Time
Prop. Delay
In
Out
MC Setup
MC
MC Release
Modulus setup time MC to out is the MC
setup or MC release plus the prop delay.
VCC
SW
IN
50
OUT
C2
RL
IN
MC
GND
CL
EXTERNAL COMPONETS
C1 = C2 = 1000 pF
C3 = 0.1 F
CL = 12 pF (Including Scope
and jig capacitance)
RL = 2.2 k
MC Input
MC12022A MC12022B
+15.0
+1257.40
+10.0
+707.11
+5.0
+397.64
+223.61
5.0
+125.74
10.0
+70.71
15.0
+39.76
20.0
+22.36
25.0
+12.57
30.0
+7.07
35.0
+3.98
40.0
+2.24
45.0
+1.26
50.0
0
250
500
750
1000
1250
1500
1750
2000
mVrms
AMPLITUDE (dBm)
+0.71
2250
FREQUENCY (MHz)
1200
800
mVpp
1600
400
0
250
500
750
1000
1250
1500
1750
2000
0
2250
FREQUENCY (MHz)
MC12022A MC12022B
Figure 7. Typical Input Impedance versus Input Frequency
1000
900
800
700
600
R
500
400
300
200
GHz
OHMS
100
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
100
200
jX
300
400
500
600
MC12022A MC12022B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 62605
ISSUE K
B
1
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
A
NOTE 2
C
J
T
N
SEATING
PLANE
0.13 (0.005)
T A
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
10_
0.76
1.01
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
10_
0.030
0.040
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 75106
(SO8)
ISSUE T
D
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
1
4
h
B
X 45 _
SEATING
PLANE
L
0.10
A1
B
0.25
C B
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MC12022A MC12022B
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specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
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MC12022A MC12022B
MC12022A/D
MOTOROLA RF/IF DEVICE
DATA