TDA2050

32W Hi-Fi AUDIO POWER AMPLIFIER

HIGH OUTPUT POWER
(50W MUSIC POWER IEC 268.3 RULES)
HIGH OPERATING SUPPLY VOLTAGE (50V)
SINGLE OR SPLIT SUPPLY OPERATIONS
VERY LOW DISTORTION
SHORT CIRCUIT PROTECTION (OUT TO
GND)
THERMAL SHUTDOWN
DESCRIPTION
The TDA 2050 is a monolithic integrated circuit in
Pentawatt package, intended for use as an audio
class AB audio amplifier. Thanks to its high power
capability the TDA2050 is able to provide up to
35W true rms power into 4 ohm load @ THD =
10%, VS = 18V, f = 1KHz and up to 32W into
8ohm load @ THD = 10%, VS = 22V, f = 1KHz.
Moreover, the TDA 2050 delivers typically 50W
music power into 4 ohm load over 1 sec at VS=
22.5V, f = 1KHz.

Pentawatt
ORDERING NUMBERS: TDA2050V
TDA2050H

The high power and very low harmonic and crossover distortion (THD = 0.05% typ, @ VS = 22V,
PO = 0.1 to 15W, RL=8ohm, f = 100Hz to 15KHz)
make the device most suitable for both HiFi and
high class TV sets.

TEST AND APPLICATION CIRCUIT

March 2002

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TDA2050
ABSOLUTE MAXIMUM RATINGS
Symbol

Parameter

Value

Unit
V

VS

Supply Voltage

25

Vi

Input Voltage

VS

Vi

Differential Input Voltage

15

IO

Output Peak Current (internally limited)

Power Dissipation TCASE = 75C

25

-40 to 150

Ptot
Tstg, Tj

Storage and Junction Temperature

PIN CONNECTION (Top view)

SCHEMATIC DIAGRAM

THERMAL DATA
Symbol
Rth j-case

Description
Thermal Resistance junction-case

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Max

Value

Unit

C/W

TDA2050
ELECTRICAL CHARACTERISTICS (Refer to the Test Circuit, VS = 18V, Tamb = 25C, f = 1 kHz; unless otherwise specified)
Symbol

Parameter

VS
Id

Supply Voltage Range

Quiescent Drain Current

Ib

Test Condition

Min.

Typ.

4.5
VS = 4.5V
VS = 25V

30
55
0.1

Max.

Unit

25

50
90

mA
mA

Input Bias Current

VS = 22V

0.5

VOS

Input Offset Voltage

VS = 22V

15

mV

IOS

Input Offset Current

VS = 22V

200

nA

PO

RMS Output Power

d = 0.5%
RL = 4
RL = 8
VS = 22V RL = 8
d = 10%
RL = 4
RL = 8
VS = 22V RL = 8

24
22

28
18
25

W
W
W

35
22
32

W
W
W

50

Music Power
IEC268.3 RULES

d = 10%; T = 1s
VS = 22.5V; RL = 4

Total Harmonic Distortion

RL = 4
f = 1kHz, PO = 0.1 to 24W
f = 100Hz to 10kHz, PO = 0.1 to 18W

0.03

VS = 22V RL = 8
f = 1kHz, PO = 0.1 to 20W
f = 100Hz to 10kHz, PO = 0.1 to 15W

0.02

SR

Slew Rate

GV
GV

Open Loop Voltage Gain

Closed Loop Voltage Gain

30

80
30.5

BW
eN

Power Bandwidth (-3dB)

Total Input Noise

Ri

Input Resistance (pin 1)

SVR

Tsd-j

RL = 4 Vi = 200mV
curve A
B = 22Hz to 22kHz
Rs = 22k; f = 100Hz;
Vripple = 0.5Vrms

Efficiency

PO = 28W; R L = 4
PO = 25W; R L = 8;
VS = 22V

Thermal Shut-down
Junction Temperature

%
%

0.5

%
%
V/s

31

dB
dB

20 to 80,000
4
5
10

Hz
V
V

500

Supply Voltage Rejection

0.5
0.5

k
45

dB

65

67

150

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TDA2050
Figure 1: Split Supply Typical Application Circuit

Figure 2: P.C. Board and Components Layout of the Circuit of Fig. 1 (1:1)

TDA2050

RL
R4
R3
+Vs
R2

C7
C5

C2

C3
R1
C4

C6

C1
-Vs

Vi

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TDA2050
SPLIT SUPPLY APPLICATION SUGGESTIONS
The recommended values of the external components are those shown on the application circuit

of fig. 2. Different values can be used. The following table can help the designer.

Larger than
Recommended Value

Smaller than
Recommended Value

Component

Recommended
Value

R1

22k

Input Impedance

R2

680

Feedback Resistor

R3

22k

R4

2.2

Frequency Stability

C1

1F

Input Decoupling DC

C2

22F

C3
C4

100nF

Inverting Input
DC Decoupling
Supply Voltage Bypass

C5
C6

220F

Supply Voltage Bypass

Danger of Oscillations

C7

0.47F

Frequency Stability

Danger of Oscillations

Purpose

Increase of Input
Impedance

Decrease of Input
Impedance

Decrease of Gain (*)

Increase of Gain

Increase of Gain

Decrease of Gain (*)

Danger of Oscillations
Higher Low-frequency
cut-off
Increase of Switch
ON/OFF Noise

Higher Low-frequency
cut-off
Danger of Oscillations

(*) The gain must be higher than 24dB

PRINTED CIRCUIT BOARD

The layout shown in fig. 2 should be adopted by
the designers. If different layouts are used, the

ground points of input 1 and input 2 must be well

decoupled from the ground return of the output in
which a high current flows.

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TDA2050
Figure 3: Single Supply Typical Application Circuit

Figure 4: P.C. Board and Components Layout of the Circuit of Fig. 3 (1:1)

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TDA2050
SINGLE SUPPLY APPLICATION SUGGESTIONS
The recommended values of the external components are those shown on the application circuit

Component

Recommended
Value

Purpose

of fig. 3. Different values can be used. The following table can help the designer.
Larger than
Recommended Value

Smaller than
Recommended Value

R1, R2, R3

22k

R4

680

Biasing Resistor

R5

22k

R6

2.2

Frequency Stability

C1

2.2F

Input Decoupling DC

C2

100F

Supply Voltage Rejection

C3

1000F

Supply Voltage Bypass

C4

22F

Inverting Input DC
Decoupling

C5

100nF

Supply Voltage Bypass

Danger of Oscillations

C6

0.47F

Frequency Stability

Danger of Oscillations

C7

1000F

Output DC Decoupling

Higher Low-frequency
cut-off

Feedback Resistors

Increase of Gain

Decrease of Gain (*)

Decrease of Gain (*)

Increase of Gain

Danger of Oscillations
Higher Low-frequency
cut-off
Worse Turn-off Transient
Worse Turn-on Delay
Danger of Oscillations
Worse of Turn-off
Transient
Increase of Switching
ON/OFF

Higher Low-frequency
cut-off

(*) The gain must be higher than 24dB

NOTE
If the supply voltage is lower than 40V and the
load is 8ohm (or more) a lower value of C2 can

be used (i.e. 22F).

C7 can be larger than 1000uF only if the supply
voltage does not exceed 40V.

TYPICAL CHARACTERISTICS (Split Supply Test Circuit unless otherwise specified)

Figure 5: Output Power vs. Supply Voltage

Figure 6: Distortion vs. Output Power

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TDA2050
Figure 7: Output Power vs. Supply Voltage

Figure 8: Distortion vs. Output Power

Figure. 9: Distortion vs. Frequency

Figure 10: Distortion vs. Frequency

Figure 11: Quiescent Current vs. Supply Voltage

Figure 12: Supply Voltage Rejection vs. Frequency

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TDA2050
Figure 13: Supply Voltage Rejection vs. Frequency (Single supply) for Different
values of C2 (circuit of fig. 3)

Figure 16: Total Power Dissipation and Efficiency vs. Output Power

Figure 14: Supply Voltage Rejection vs. Frequency (Single supply) for Different
values of C2 (circuit of fig. 3)
SHORT CIRCUIT PROTECTION
The TDA 2050 has an original circuit which limits
the current of the output transistors. The maximum output current is a function of the collector
emitter voltage; hence the output transistors work
within their safe operating area. This function can
therefore be considered as being peak power limiting rather than simple current limiting.
It reduces the possibility that the device gets
damaged during an accidental short circuit from
AC output to ground.

Figure 15: Total Power Dissipation and Efficiency vs. Output Power

THERMAL SHUTDOWN
The presence of a thermal limiting circuit offers
the following advantages:
1)An overload on the output (even if it is permanent), or an above limit ambient temperature
can be easily tolerated since the Tj cannot be
higher than 150C.
2)The heatsink can have a smaller factor of
safety compared with that of a conventional
circuit. There is no possibility of device damage due to high junction temperature. If for
any reason, the junction temperature increases up to 150C, the thermal shutdown
simply reduces the power dissipation and the
current consumption.
The maximum allowable power dissipation depends upon the thermal resistance junction-ambi9/13

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TDA2050
ent. Fig. 17 shows this dissipable power as a
function of ambient temperature for different thermal resistance.
Figure 17: Maximum Allowable Power Dissipation vs. Ambient Temperature

cient. Between the heatsink and the package is

better to insert a layer of silicon grease, to optimize the thermal contact; no electrical isolation is
needed between the two surfaces. Fig. 18 shows
an example of heatsink.
Dimension suggestion
The following table shows the length that the
heatsink in fig. 18 must have for several values
of Ptot and Rth.
Ptot (W)

12

Lenght of heatsink (mm)

60

40

30

Rth of heatsink (C/W)

4.2

6.2

8.3

Figure 18: Example of heat-sink

MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be removed by adding an external heatsink.
Thanks to the PENTAWATT package, the
heatsink mounting operation is very simple, a
screw or a compression spring (clip) being suffi-

APPENDIX A

A.1 - MUSIC POWER CONCEPT

MUSIC POWER is (according to the IEC clauses
n.268-3 of Jan 83) the maximum power which the
amplifier is capable of producing across the rated
load resistance (regardless of non linearity) 1 sec
after the application of a sinusoidal input signal of
frequency 1 KHz.
According to this definition our method of measurement comprises the following steps:
- Set the voltage supply at the maximum operating value;
- Apply a input signal in the form of a 1KHz tone
burst of 1 sec duration: the repetition period
of the signal pulses is 60 sec;
- The output voltage is measured 1 sec from the
start of the pulse;
- Increase the input voltage until the output signal shows a THD=10%;
- The music power is then V2out /RL, where
Vout is the output voltage measured in the
condition of point 4 and RL is the rated load
impedance;

The target of this method is to avoid excessive

dissipation in the amplifier.
A.2 - INSTANTANEOUS POWER
Another power measurement (MAXIMUM INSTANTANEOUS OUTPUT POWER) was proposed by IEC in 1988 (IEC publication 268-3 subclause 19.A).
We give here only a brief extract of the concept,
and a circuit useful for the measurement.
The supply voltage is set at the maximum operating value.
The test signal consists of a sinusoidal signal
whose frequency is 20 Hz, to which are added alternate positive and negative pulses of 50 s duration and 500 Hz repetition rate. The amplitude
of the 20 Hz signal is chosen to drive the amplifier
to its voltage clipping limits, while the amplitude of
the pulses takes the amplifier alternately into its
current-overload limits.

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TDA2050
A circuit for generating the test signal is given in
fig. 19.
The load network consists of a 40 F capacitor, in
series with a 1 ohm resistor. The capacitor limits
the current due to the 20 Hz signal to a low value,
whereas for he short pulses the effective load impedance is of the order of 1 ohm, and a high output current is produced.
Using this signal and load network the measurement may be made without causing excessive
dissipation in the amplifier. The dissipation in the
1 ohm resistor is much lower than a rated output

power of the amplifier, because the duty-cycle of

the high output current is low.
By feeding the amplifier output voltage to the Xplates of an oscilloscope, and the voltage across
the 1 ohm resistor (representing the output current) to the Y=plates, it is possible to read on the
display the value of the maximum instantaneous
output power.
The result of this test applied at the TDA 2050 is:
PEAK POWER = 100W typ

Figure 19: Test circuit for peak power measurement

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TDA2050
DIM.
A
C
D
D1
E
E1
F
F1
G
G1
H2
H3
L
L1
L2
L3
L4
L5
L6
L7
L9
L10
M
M1
V4
V5
Dia

MIN.

mm
TYP.

2.4
1.2
0.35
0.76
0.8
1.0
3.2
6.6

3.4
6.8

10.05
17.55
15.55
21.2
22.3

17.85
15.75
21.4
22.5

2.6
15.1
6.0
2.1
4.3
4.23
3.75

4.5
4.0

3.65

MAX. MIN.
4.8
1.37
2.8
0.094
1.35 0.047
0.55 0.014
1.19 0.030
1.05 0.031
1.4
0.039
3.6
0.126
7.0
0.260
10.4
10.4 0.396
18.15 0.691
15.95 0.612
21.6 0.831
22.7 0.878
1.29
3.0
0.102
15.8 0.594
6.6
0.236
2.7
0.008
4.8
0.17
4.75 0.167
4.25 0.148
40 (typ.)
90 (typ.)
3.85 0.144

inch
TYP.

0.134
0.268

0.703
0.620
0.843
0.886

0.178
0.157

MAX.
0.189
0.054
0.110
0.053
0.022
0.047
0.041
0.055
0.142
0.276
0.409
0.409
0.715
0.628
0.850
0.894
0.051
0.118
0.622
0.260
0.106
0.189
0.187
0.167

OUTLINE AND
MECHANICAL DATA

Weight: 2.00gr

Pentawatt V
0.152

L
L1

E
M1

A
M

C
D1
L5

V5

L2

H2

L3

F
E

E1

V4

H3

G G1
Dia.
F

F1

L9
L4

L10
L7
L6

H2
V4

RESIN BETWEEN
LEADS

PENTVME

0015981

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TDA2050

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2002 STMicroelectronics Printed in Italy All Rights Reserved
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