ESD9B, SZESD9B
Transient Voltage
Suppressors
MicroPackaged Diodes for ESD Protection
The ESD9B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
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Specification Features
Low Capacitance 15 pF
Low Clamping Voltage
Small Body Outline Dimensions: 0.039 x 0.024 (1.0mm x 0.60mm)
Low Body Height: 0.016 (0.4 mm)
Standoff Voltage: 3.3 V, 5 V
Low Leakage
Response Time is < 1 ns
IEC6100042 Level 4 ESD Protection
AECQ101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
This is a PbFree Device
SOD923
CASE 514AB
MARKING DIAGRAM
XM
X
M
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
ORDERING INFORMATION
Device
QUALIFIED MAX REFLOW TEMPERATURE: 260C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
IEC 6100042 (ESD)
Symbol
Contact
Air
IEC 6100044 (EFT)
Package
Shipping
ESD9B3.3ST5G
SOD923 8000/Tape & Reel
(PbFree)
ESD9B5.0ST5G
SOD923 8000/Tape & Reel
(PbFree)
SOD923 8000/Tape & Reel
(PbFree)
Value
Unit
18
18
kV
SZESD9B5.0ST5G
40
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR5 Board
(Note 1) @ TA = 25C
Thermal Resistance, JunctiontoAmbient
PD
300
mW
RqJA
400
C/W
Junction and Storage Temperature Range
TJ, Tstg
55 to +150
TL
260
Lead Solder Temperature Maximum
(10 Second Duration)
= Specific Device Code
Date Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR5 = 1.0 x 0.75 x 0.62 in.
Semiconductor Components Industries, LLC, 2011
December, 2011 Rev. 2
Publication Order Number:
ESD9B/D
ESD9B, SZESD9B
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted)
Symbol
IPP
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
IT
VC VBR VRWM IR
IR VRWM VBR VC
IT
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
VBR
IT
Breakdown Voltage @ IT
IPP
Test Current
BiDirectional TVS
Capacitance @ VR = 0 V and f = 1.0 MHz
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
VRWM
(V)
IR (mA)
@ VRWM
VBR (V) @ IT
(Note 2)
IT
C (pF)
VC
VC (V) @ IPP = 1 A
Per IEC6100042
(Note 3)
Max Per 8 x 20 ms
(Note 4)
Device
Marking
Max
Max
Min
Max
mA
Typ
ESD9B3.3ST5G
2*
3.3
1.0
5.0
7.0
1.0
15
Figures 1 and 2
See Below
10.5
ESD9B5.0ST5G,
SZESD9B5.0ST5G
5.0
1.0
5.8
7.8
1.0
15
Figures 1 and 2
See Below
12.5
Device
* Rotated 270.
2. VBR is measured with a pulse test current IT at an ambient temperature of 25C.
3. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
4. Surge current waveforms per Figure 5.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC6100042
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC6100042
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2
ESD9B, SZESD9B
IEC6100042 Waveform
IEC 6100042 Spec.
Ipeak
Level
Test
Voltage
(kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
7.5
15
22.5
12
30
16
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 3. IEC6100042 Spec
ESD Gun
Oscilloscope
TVS
50 W
Cable
50 W
Figure 4. Diagram of ESD Test Setup
The following is taken from Application Note
AND8308/D Interpretation of Datasheet Parameters
for ESD Devices.
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC6100042 waveform. Since the
IEC6100042 was written as a pass/fail spec for larger
% OF PEAK PULSE CURRENT
100
PEAK VALUE IRSM @ 8 ms
tr
90
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
20
40
t, TIME (ms)
60
Figure 5. 8 X 20 ms Pulse Waveform
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3
80
ESD9B, SZESD9B
PACKAGE DIMENSIONS
SOD923
CASE 514AB01
ISSUE B
X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
Y
E
1
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
L
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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Sales Representative
ESD9B/D
