The ANSYS MEMS Initiative

Dr. Paul Lethbridge Electronics Industry Product Manager

ANSYS MEMS 7.0 10/10/02

Topics Covered

ANSYS/Multiphysics: The Big - Picture Overview Selected Physics:

Structural & thermal Electrostatics & Capacitance Charged Particle Tracing Electrostatic-structural coupling Electro-thermal-structural coupling FLOTRAN CFD

Micro fluidics Conjugate heat transfer Fluid structural Interaction Fluid Structural Damping

Reduced Order Macro- modeling & Circuit Coupling Piezoelectrics HF Electromagnetics Probabilistic Design Customization
ANSYS MEMS 7.0 10/10/02

The ANSYS 6.1 Family of Products

ANSYS/Multiphysics ANSYS/Mechanical ANSYS/FLOTRAN ANSYS/EMAG ANSYS/Professional ANSYS/ED
Extreme functionality The whole enchilada! High performance mechanical & Thermal Powerful tools for the specialist

Ease of use for the generalist Educational/Non Commercial Use Products

ANSYS MCAD & ECAD Connection products

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics
Unique in the Analysis Industry

ANSYS invented the Multiphysics philosophy 10 years ago. No other analysis tool provides as many physics under one roof! Greatest breadth and technical depth of physics. Allows extremely sophisticated analysis capability. Fully parametric models across physics, geometry, materials, loads. Perform Design Optimization across physics, geometry, materials and loads. Seamless integration with ANSYS Probabilistic Design System (PDS).

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics
Factoring in more than one physics gets you closer to reality!
Magnetic

Fluid Electrostatic Structural Thermal Electrical HF EMAG

ANSYS MEMS 7.0 10/10/02

Some MEMS Related Features

Advanced Electrostatic Adaptive P- elements Electrostatic - Structural Coupling ESSOLV , TRANS109 Morphed meshing for electrostatic - structural Flexible meshing with Brick,wedge, pyramid, tetrahedral shapes Particle tracing post processing - applicable to ion optics devices. Trefftz domain (hybrid Boundary Element) Automated capacitance calculations- CMATRIX Full anisotropic material models Multiple material beam cross sections High Frequency Electromagnetics Multi-domain reduced order elements that couple with circuit elements. Morphed ALE meshing for Fluidic-Structural domains.

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS Device Applications

Inertial Devices Comb & thermal Actuators Pressure Transducers
Fluid Electromagnetic

Electrostatic Structural

RF Filters - Resonators
Thermal

Lab-on-a-chip Ink Jet printer technology Micromirror technology

Electrical

ANSYS MEMS 7.0 10/10/02

Market / Industry Overview

ANSYS MEMS 7.0 10/10/02

MEMS Industry Areas

Automotive

Information Technology

Analytical Chemistry

Aerospace

Biotechnology

Defense Telecommunications

Pharmaceutical

ANSYS MEMS 7.0 10/10/02

Technology & Applications

Microfluidics Inertial Measurement Pressure Measurement Optical MEMS
Ink jet nozzles Lab on chip Accelerometers Gyroscopes MAP sensors Barometric sensors TIP displays DLP projectors Switching High Q inductors Fractal antennas R/W drive heads Micro-engines Burst disc actuators Electronic nose
ANSYS MEMS 7.0 10/10/02

Radio Frequency MEMS

Other Technology

Applications & Companies

Ink jet nozzles Accelerometers Gyroscopes MAP sensors Barometric sensors

Hewlett Packard Seiko Epson Delphi - Delco SensoNor Vaisala Lucas Novasensor TI, Nortel, JDS Uniphase,Lucent Siemens MEMSCAP

Micromirrors

RF Components High Q inductors R/W hard drives > 10Gbit/in2

Seagate

ANSYS MEMS 7.0 10/10/02

ANSYS/MEMS Training Course:

Available Now!

5 day training course. Two parts: 2 days introduction, 3 days intermediate level. Covers:

Use of ANSYS/Multiphysics product for coupled field MEMS analysis. Classic MEMS technology such as electro thermal actuators,
electrostatic structural devices, and piezo-electrics.

Geometry import, connection products and interfaces with front end

MEMS EDA tools.

Initial stress Pre-stressed modal analysis Sub-structuring, reduced order macro modeling and lumped parameter
extraction for system level modeling.

ANSYS MEMS 7.0 10/10/02

The ANSYS MEMS Website

www.ansys.com/ansys/mems/index.htm

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics Selected Physics & MEMS Analysis Features

ANSYS MEMS 7.0 10/10/02

MEMS Analysis Requirements

MEMS have unique requirements!

Devices are inherently Multiphysics. Unique Material properties. Meshing of high aspect ratio devices & features Lumped Parameter Extraction (into SPICE, VHDL-A/MS) Reduced Order Macro Modeling (ROM2) Capability to model large Field domains associated with electromagnetics & CFD. Need a system of units applicable to small scale.
ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS STRUCTURAL

ANSYS MEMS 7.0 10/10/02

STRUCTURAL CAPABILITIES
Types of Analysis: Static, Modal, Harmonic, Spectrum, Transient.
Geometric non-linearities, such as stress stiffening and large strain, etc. Nonlinear material properties, such as plasticity, hyperelasticity, creep, swelling, etc. Modal analysis, including pre-stressed modal Dynamic analyses, including harmonic, random vibration, and nonlinear transient, etc. Contact problems, including surface to surface, node to surface, and node to node contact

ANSYS MEMS 7.0 10/10/02

Composite Beams:
Arbitrary Cross Sections & multiple Materials. e.g. Polysilicon & oxide layers

ANSYS MEMS 7.0 10/10/02

Composite Beams:
Arbitrary Cross Sections & multiple Materials. e.g. Polysilicon & oxide layers

ANSYS MEMS 7.0 10/10/02

Composite Beams:
Arbitrary Cross Sections & multiple Materials. e.g. Polysilicon & oxide layers

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Linear Resonator Modal Analysis

Images courtesy of Russell DeAnna, NASA. ANSYS MEMS 7.0 10/10/02

Analysis Example:
Inertial Sensor - Accelerometer

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Torsional Resonator - Gyroscope

ANSYS MEMS 7.0 10/10/02

Initial Stress
ISTRESS

MEMS devices after fabrication typically posses significant residual stresses. The initial stress function has been enhanced to allow specification of a constant state of residual stress. Applicable to beam, shell, and solid structural elements.

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS THERMAL

ANSYS MEMS 7.0 10/10/02

Thermal Analysis Overview

Thermal analyses are used to determine the temperature distribution, thermal gradient, heat flow, and other such thermal quantities in a structure. A thermal analysis can be steady-state or transient.
Steady-state implies that the loading conditions have settled down to a steady level, with little or no time dependency. Example: An iron that has already reached the desired temperature setting. Transient implies conditions that are changing with time. Example: A casting in the process of cooling down from molten metal to solid.

Image courtesy of PADT Inc. ANSYS MEMS 7.0 10/10/02

Thermal Analysis Loads

Prescribed Temperatures DOF constraints for a thermal analysis Solution > -Loads-Apply > Temperature Or the D family of commands (DA, DL, D) Convection These are surface loads Solution > -Loads-Apply > Convection Or the SF family of commands (SFA, SFL, SF, SFE) Heat Generation These are volumetric loads Solution > -Loads-Apply > Heat Generation Or the BF family of commands (BFL,BFA,BFV,BFK,BF,BFE,BFUNIF)
Image courtesy of PADT Inc. ANSYS MEMS 7.0 10/10/02

Thermal Analysis Results

Image courtesy of PADT Inc. ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS THERMAL - MECHANICAL

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Electro-thermal actuator

SEM Image courtesy of Victor Bright, U Col. Boulder. ANSYS MEMS 7.0 10/10/02

Analysis Example:
Electro-thermal actuator

Voltage contours & displacement

SEM Image courtesy of Victor Bright, U Col. Boulder. ANSYS MEMS 7.0 10/10/02

Thermal Mechanical Simulation of Intel Pentium II Module

Image courtesy of PADT Inc. ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS PACKAGE THERMAL MANAGEMENT

ANSYS MEMS 7.0 10/10/02

Thermal analysis of SMD IC package (J lead)

ANSYS MEMS 7.0 10/10/02

BGA Package
Thermal Mechanical Fatigue Simulation Differential thermal expansion

Image courtesy of MCR. ANSYS MEMS 7.0 10/10/02

ANSYS/Mechanical PCB Thermal Strain Reduction

144 Pin, Quad Flat Pack, 17% reduction

Images courtesy of Allen Miller, Nortel Networks ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS ELECTROSTATICS

ANSYS MEMS 7.0 10/10/02

Electrostatic Capability Overview

Steady state or time tranisent H (1st & 2nd order) and Adaptive 3D P elements 2D (triangle, or quadrilateral) 3D, brick/hex, tetrahedral, pyramid, wedge Shell & Contact (Link) elements Infinite element boundary or Trefftz hybrid BEA/FEA approaches Electric field contour plots, electrostatic force and capacitance calculations. Multiple dielectrics, isotropic, orthortropic material properties.
Image courtesy of PADT Inc. ANSYS MEMS 7.0 10/10/02

3D Electrostatics Adaptive P-elements

3D P-element technology for electrostatics SOLID128 Brick/Wedge element SOLID127 Tetrahedral element Polynomial order of element increased automatically to satisfy convergence to a prescribed degree of accuracy P-order may extend from level 2 - 8. Supports all electrostatics boundary conditions and loads Supports node coupling and constraint equations Works with Trefftz Domain & CMATRIX.

ANSYS MEMS 7.0 10/10/02

3D Electrostatics
Adaptive P-element study on comb drive structure

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Accelerometer Comb Drive

Images courtesy of Kionix Inc. ANSYS MEMS 7.0 10/10/02

Analysis Example:
Model of Single Tooth of Comb

Half model along symmetry plane

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Electrostatic Potential Solution of Single Tooth of Comb

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Torsional Resonator - Gyroscope

ANSYS MEMS 7.0 10/10/02

Analysis Example 3:
Torsional Resonator / Gyroscope

ANSYS MEMS 7.0 10/10/02

Electrostatics: 3D Trefftz Domain

Hybrid FEA - BEA technology

Spheres with individual finite element meshes connected by a Trefftz domain.

ANSYS MEMS 7.0 10/10/02

Trefftz Example:
Capacitance of a sphere in free-space

Analytical Solution: 111.3 pF ANSYS Solution: 110.2 pF

ANSYS MEMS 7.0 10/10/02

Trefftz Convergence Characteristics

Infinite Elements vs Trefftz Domain

9 8

% Error (Capacitance)

7 6 5 4 3 2 1 0 1 2 3 4 5 6

Infinte Elements Trefftz Domain

10

Mesh Refinement Parameter

ANSYS MEMS 7.0 10/10/02

Automated Capacitance Calculations

CMATRIX Macro

Automated computation of capacitance matrix Applicable to any number of conductors Computes self and mutual capacitance Computes ground and lumped matrices Useful for extracting lumped capacitance for use in system level circuit-simulation

P12 P11 P22

ANSYS MEMS 7.0 10/10/02

CMATRIX Example Output

ANSYS MEMS 7.0 10/10/02

Electrostatics
Parasitic Capacitance Calculation using CMATRIX

ANSYS MEMS 7.0 10/10/02

Electrostatics
Parasitic capacitance calculation using CMATRIX

ANSYS MEMS 7.0 10/10/02

1 Gbit DRAM Electric field strength in dielectrics

of trench capacitor unit cell.

150 nm minimum feature size 9x9 Capacitance Matrix extraction

Image courtesy of Andreas Hieke, Siemens Microelectronics. ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS CHARGED PARTICLE TRACING

ANSYS MEMS 7.0 10/10/02

CHARGED PARTICLE TRACING

Ion Optics & Field Emission Displays

ANSYS MEMS 7.0 10/10/02

CHARGED PARTICLE TRACING

Ion Optics

ANSYS MEMS 7.0 10/10/02

CHARGED PARTICLE TRACING

Ion Optics

ANSYS MEMS 7.0 10/10/02

CHARGED PARTICLE TRACING

Ion Optics

ANSYS MEMS 7.0 10/10/02

CHARGED PARTICLE TRACING

Ion Optics

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS ELECTROSTATIC STRUCTURAL COUPLING

ANSYS MEMS 7.0 10/10/02

Electrostatic-Structural Overview

2D & 3D Sequential coupled physics via ESSOLV 2D & 3D Directly coupled physics via 1D transducer
lumped element. Steady state or time transient

2D Fully coupled physics via TRANS109. Steady state

or time transient

Image courtesy of PADT Inc. ANSYS MEMS 7.0 10/10/02

Electrostatic-Structural Coupling
ESSOLV Command Macro

Solves coupled electrostatic-structural static analysis Useful for obtaining pull-in voltage (voltage at which structure snaps through), deflections, fields, forces, etc. Requires Electrostatic & Structural Physics Environments. Macro automates a sequential solution process:
1 2 3 4 Electrostatic solution Structural solution (LDREAD of forces from electrostatics) Mesh Morphing of electrostatic mesh Convergence monitoring

ANSYS MEMS 7.0 10/10/02

Electrostatic-Structural Coupling
ESSOLV GUI

Morphing Options for field mesh follows DAMORPH, DVMORPH, DEMORPH.

ANSYS MEMS 7.0 10/10/02

Electrostatic-Structural Coupling
Automated Mesh Morphing

ANSYS MEMS 7.0 10/10/02

Electrostatic-Structural Coupling
Pull in simulation of MEMS Switch
0.7 0.6 0.5 Displacement 0.4 0.3 0.2 0.1 0 0 5 10 Voltage 15 20 25

Gilbert et. al. ANSYS

Hysterisis simulation using finite element based electromechanical coupling

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Electrostatic Micro Mirror

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Linear resonator / RF Filter Electrostatic Structural Analysis

ANSYS MEMS 7.0 10/10/02

2-D Fully Coupled electrostaticstructural analysis

TRANS109 element:
Three degrees of freedom per node (UX,UY,VOLT) Virtual-work force principles Analytic integration of matrices

Applicable to coupled solutions:

Static analysis Pre-stressed Modal analysis Pre-stressed harmonic analysis Time-transient analysis
UY, FY i VOLT, CHRG UX, FX j

ANSYS MEMS 7.0 10/10/02

2D Fully Coupled electrostaticstructural analysis

Comb Drive Example

Overlap 0.1 L 0.5 L 0.8 L

Driving force (Target value = 8.5E-5 N) 8.38E-05 N 8.39E-05 N 8.57E-05 N

ANSYS MEMS 7.0 10/10/02

2D Fully Coupled electrostaticstructural analysis

Comb Drive Example

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS ELECTRO-THERMALSTRUCTURAL COUPLING

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics
Coupled Electro-thermal simulation.
Detail of Integrated Circuit via & aluminum trace
Current Density Electrical Power Thermal Stress

Geometric size is submicron

Images courtesy of Atila Mertol, LSI Logic.

ANSYS MEMS 7.0 10/10/02

Sub-Micron Interconnect Reliability

Simulating the effect of voiding
Current Density Electro-Thermal Stress

Voids

Images courtesy of Seung Kang, Lucent. ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS REDUCED ORDER MACRO MODELING

ANSYS MEMS 7.0 10/10/02

Reduced Order Macro Modeling

Concept

Reduced order macro modeling enables rapid prototyping of complex MEMS structures in a fast and efficient manner Reduced order models are simplified representations complex models derived from: Approximations of mechanical device response:

Springs, lumped mass, dampers

Coupled-field finite element simulations:

Transducers
Accurate condensation of multi-degree of freedom systems:

Substructures
Electrical feed characterization:

Resistors, capacitors, inductors, sources, etc.

ANSYS MEMS 7.0 10/10/02

Reduced Order Macro Modeling

ANSYS implementation

Finite element based Lumped elements for single physics Transducer elements for coupled physics Substructures for reducing complex FEA systems

Comb-drive resonator Physical Model

Comb-drive resonator Lumped Model

ANSYS MEMS 7.0 10/10/02

Reduced Order Macro Modeling

Levels of Abstraction Provided
Reduced order models can take on many different levels of abstraction including lumped elements, substructures, and full FE models.
Mechanical COMB14, COMB39, MASS21 Electrical CIRCU124

Substructures or FE Solid model

Transducer TRANS126

ANSYS MEMS 7.0 10/10/02

TRANS126 Electromechanical Transducer Element

Electrostatic-structural Coupling

Fully coupled macro element for electrostatic-structural simulation. Uni-directional structural DOF and voltage potential DOF. Can combine EMT elements to represent up to 3 structural DOFs with voltage coupling. Characterized by Capacitance vs. Displacement curve Couples directly to: FEA Solid models (solid elements, shell elements, beams) Reduced Order models:

Mechanical models (spring, mass, dampers) Electro-mechanical models (spring, mass, damper, resistor, capacitors, inductors,

FEA Substructure models

ANSYS MEMS 7.0 10/10/02

TRANS126 Transducer Element

Simulation Capability

Static analysis: Pull-in simulation, force, voltage, displacement, current excitation. Modal analysis: Pre-stressed eigenvalue analysis (due to dc bias voltage excitation), damped and undamped systems) Pre-stressed small-signal Harmonic analysis (due to dc bias voltage or mechanical excitation) Time Transient excitation analysis. Applicable to many MEMS devices: Comb drives Cantilever actuators Pressure sensors RF Switches

ANSYS MEMS 7.0 10/10/02

TRANS126 Transducer Element

Process

Comb Drive Finite Element Model 250K DOFs Electrostatic simulation

Capacitance vs Deflection Curve

TRANS126 Finite Element 2 Nodes with structural and voltage DOFs

ANSYS MEMS 7.0 10/10/02

TRANS126 Coupling to FE Model

A Mechanical RF Filter

Both comb drives are efficiently replaced by two TRANS126 elements

ANSYS MEMS 7.0 10/10/02

Reduced Order Modeling with Sub-structures

1/2 symmetry FEA 18,260 DOFs

1/2 symmetry substructure 200 DOFs

The mass and spring system FE mesh is replaced by a substructure with 200 DOFs.

ANSYS MEMS 7.0 10/10/02

Reduced order Modeling with Sub-structures

Connecting TRANS126 elements to substructure
The ROM elements attach to the substructure at Master DOF locations.

Substructure ensures accurate 3-D representation of the dynamic response of the structure is preserved for the modes that are excited.

ANSYS MEMS 7.0 10/10/02

Completely Reduced!
Reduced Order Macro Modeling
MASS

SPRING

DAMPER

Electromechanical element Spring element Mass element Damper Element Couples with Circuit Elements
ANSYS MEMS 7.0 10/10/02

Reduced Order Macro Modeling

GUI Menu Example
Menu Path:
ANSYS Main > Preprocessor> -Modeling- > Create > Circuit

ANSYS MEMS 7.0 10/10/02

Voltage Pre-Stress Using TRANS126

Attach the TRANS126 element(s) to the finite element model of the device. i.e. It will bridge the gap(s) between the electrodes. More than one TRANS126 element can be used to better represent the distributed electro-static force.
Finite element model of a MEMS structure. (filter, resonator, etc.). Here a simple beam is used to demonstrate the coupling to a comb drive

Here is the TRANS126 element. The DC voltage is applied as a load and it will move, applying a force to the finite element model.
ANSYS MEMS 7.0 10/10/02

Voltage Pre-Stress Using TRANS126

Perform a structural modal analysis with the DC bias still applied to the TRANS126 element.

ANSYS MEMS 7.0 10/10/02

Voltage Pre-stress Eigenfrequency Results

Here are the results showing how the pre-stress shifts the resonant frequency of the device.

Mode 1 2 3

NoPre-stress Case Pre-stress Case Analytic ANSYS Analytic ANSYS 343.1 343.1 351.7 351.7 1372.5 1372.1 1381.2 1380.8 3088.1 3086.2 3096.8 3094.9

ANSYS MEMS 7.0 10/10/02

ROM144
six degree of freedom, n-port fluidic, electrostatic-structural & fluidic damping reduced order macro model element Modal ports Nodal ports
EMF1 EMF2 EMF3

ROM144
Electrostatic - structural domain

u21 u22 u23

V11 V12 V13

Voltage ports

+ -

CIRCU124

ANSYS MEMS 7.0 10/10/02

ROM144 Step 1: Generation Pass

Uses Modal Superposition & PDS to build response surface

ANSYS MEMS 7.0 10/10/02

ROM144 Step 2: Assemble ROM

Define n-excitation and n-output ports

ANSYS MEMS 7.0 10/10/02

ROM144 Step 3: System Simulation

Either build system within ANSYS/Multiphysics or export a VHDL model

ANSYS MEMS 7.0 10/10/02

ROM144 Results

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS CIRCUIT COUPLING

ANSYS MEMS 7.0 10/10/02

Circuit Simulation & Coupling

Analog FE circuit elements. Couples to stranded and massive conductors in the finite element domain, 2D & 3D. Complete arbitrary circuit arrangements. Static, Harmonic and Transient analysis. Calculates circuit parameters (V, I, Power).

ANSYS MEMS 7.0 10/10/02

Circuit Simulation & Coupling

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS PIEZOELECTRICS

ANSYS MEMS 7.0 10/10/02

Piezoelectric Capabilities

Geometric non-linearities: Large deflections (large rotations) Stress stiffening Pre-stressed modal and harmonic analyses Accurately accounts for changes in the electromechanical field in bending motion. Direct input of the piezoelectric strain matrix [d] Calculation of the correction to the permittivity matrix [epsT]-[epsS]

ANSYS MEMS 7.0 10/10/02

Piezoelectric Matrix Material Properties

ANSYS MEMS 7.0 10/10/02

Piezoelectric Beam Steering Device

The objective of the analysis is to calculate the first four fundamental frequencies and mode shapes of the assembly.

0.002 m

Solid geometry imported into ANSYS from MEMS Pro.

ANSYS MEMS 7.0 10/10/02

Finite Element Model

Piezoelectric Ceramic Z-Polarization

Silicon

The finite element model consists of 7,194 nodes and 4,176 eight-node brick elements.

Piezoelectric Ceramic Z-Polarization

ANSYS MEMS 7.0 10/10/02

Initial Pre-stress Solution, Displacement

ANSYS MEMS 7.0 10/10/02

Initial Pre-stress Solution, von Mises Stress

ANSYS MEMS 7.0 10/10/02

First Pre-stressed Mode, 94.5 Hz

ANSYS MEMS 7.0 10/10/02

Pre-stressed Modes Overlaid

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics FLOTRAN CFD

ANSYS MEMS 7.0 10/10/02

CFD Capability Overview

2D & 3D flow, pressure & temperature distributions in a single phase viscous fluid are computed using the conservation of mass, momentum, and energy. Classes of CFD analysis supported: Laminar or turbulent Thermal or adiabatic Free surface Compressible or incompressible Newtonian or Non-Newtonian Multiple species transport Note, these types of analyses are not mutually exclusive. For example, a laminar analysis can be thermal or adiabatic. A turbulent analysis can be compressible or incompressible.
ANSYS MEMS 7.0 10/10/02

Functionality
Some Recent FLOTRAN Enhancements Changes to ANSYS/FLOTRAN default settings
User Experience has shown that several input parameters are routinely modified in order to achieve convergence.

New Velocity-Pressure Coupling Algorithm

Accelerates convergence of problems where velocity-pressure coupling is especially important

Additional Advection algorithm available

Collocated Galerkin approach to the advection terms leads to extremely accurate energy balances

Mesh Morphing Upgrades

5.7: Laplacian based morpher 6.0: Elasticity based morpher

ANSYS MEMS 7.0 10/10/02

Functionality
FLOTRAN Default Changes for SUPG Advection Algorithm Streamline Upwind Petrov Galerkin
more accurate (especially for energy equation!) eliminates solution stall (leveling of convergence monitors) in many cases becomes default choice for momentum, turbulence and energy

Pressure Equation Convergence Criterion

New value 1.0E-12 All 3D Problems with non-hexagonal shaped elements always required tightening the convergence criterion for pressure

Temperature Equation Solver

Original default was an approximate solver PGMR (Preconditioned Generalized Minimum Residual Method) becomes default (more robust than TDMA) PGMR convergence criterion default now 1.0E-12

ANSYS MEMS 7.0 10/10/02

Functionality
FLOTRAN Convergence Monitors
A typical case with tetrahedral elements

Previous Defaults

New Defaults at 6.0

ANSYS MEMS 7.0 10/10/02

Functionality
FLOTRAN ALE Mesh Morphing Algorithm

The Elasticity based morphing algorithm has replaced the Laplacian algorithm for FLOTRAN analyses where the boundary of the fluid region moves. The algorithm is in effect for a FLOTRAN analysis when the ALE formulation is invoked The new algorithm provides a much smoother internal mesh motion.

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MICRO FLUIDICS

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Microfluidic Channel - Non Newtonian flow

120 m

ANSYS MEMS 7.0 10/10/02

Analysis Example:
Microfluidic Valve / Oscillator

ANSYS MEMS 7.0 10/10/02

Free Surface CFD with Surface Tension

VOF technology applicable for modeling time transient problems involving moving liquids with a free surface.
ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics Conjugate Heat Transfer Thermal-Fluidic Coupling

ANSYS MEMS 7.0 10/10/02

ANSYS CONJUGATE HEAT TRANSFER

Forced Air Flow
Fujitsu 408 CPGA package
Air Flow

Package temperatures
Images courtesy of Fujitsu. ANSYS MEMS 7.0 10/10/02

Coupled CFD-Thermal Simulation

Vertical Heat sink

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics FLUID-STRUCTURAL INTERACTION

ANSYS MEMS 7.0 10/10/02

What is FSI?
Fluid-Solid interaction (FSI) scenarios are those that involve the coupling of fluid mechanics and structural/ thermal/ coupled field mechanics Deformations/temperature of a given solid are computed simultaneously with the flow and heattransfer variables of a fluid that surrounds the solid FSI plays an important role in many different types of real-world situations and industrial applications:
Automotive, Biomedical, Material Processing, MEMS etc..

Fluid Mechanics

Solid Mechanics Structural/Thermal/Coupled Field

ANSYS MEMS 7.0 10/10/02

Features of FSI Algorithm

Weak coupling between ANSYS Structural/ Thermal & Coupled Field elements with FLOTRAN elements Multiple FSI interfaces for fluid and thermal load and displacement/ temperature transfer. Dissimilar mesh interface between fluid and solid region for lower and higher order elements. Support of 3D/ 2D & Axis-symmetric elements . Pressure, shear stress & heat flux transfer from fluid side. Displacement, velocity and temperature transfer from solid side. Conservative & Non Conservative interpolation for load transfer. ALE mesh morphing using elasticity based morpher. Works with any ANSYS Solid multiphysics element.

ANSYS MEMS 7.0 10/10/02

Fluid Structural Interaction

Fluid Flow through an elastic artery

ANSYS MEMS 7.0 10/10/02

Fluid Structural Interaction

Piezoelectric Micropump
Cylindrical Axis PZT layer Silicon Membrane

Pump outlet Fluid Region

ANSYS MEMS 7.0 10/10/02

Piezoelectric Micropump
Dissimilar meshes

Pressure on Silicon Membrane derived from Piezo electric actuation

Fluid-Structure Interface

ANSYS MEMS 7.0 10/10/02

Piezoelectric Micropump
Displacements at FSI Interface

ANSYS MEMS 7.0 10/10/02

Piezoelectric Micropump
Fluid Velocity Vectors

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS FLUID-STRUCTURAL DAMPING

ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

The structural response of MEMS devices can be severely damped by the surrounding fluid media Damping is typically characterized as:
Squeeze-film damping (vertical motion) Couette Damping (lateral motion)

Squeeze-Film

Couette
ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

ANSYS/FLOTRAN has Arbitrary Lagrangian Eulerian (ALE) formulation that allows for modeling of moving structures. Can solve time transient problems with imposed motion on structure. Both lift and drag forces can be computed. Equivalent reduced order resistance and damping terms can be extracted. Uses elasticity based mesh morphing.

ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

The ALE formulation important for MEMS because: Typically in a MEMS device a solid body oscillates in air. In order to extract the fluid forces acting on the body we need to model the deforming fluid domain ( thus the ALE formulation). These fluid forces are then used to compute the damping on the body (discussed later)

ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

End view of rotating mirror

Top view of comb drive

ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

ANSYS/MULTIPHYSICS (FLOTRAN) can be used to compute the damping forces on an oscillating structure. The damping force and phase angle of the response can be used to compute an equivalent reduced order model containing a spring and damper. The spring represents the compressible fluid effects. The damper represents the displacement effects Both components are frequency dependent, usually characterized by a squeeze film number
ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

At low frequencies (in general), the air can escape out of the air gap, hence damping is the dominant effect. At higher frequencies, the air cannot escape, and it therefore must compress like a spring.

Spring dominant @ higher frequencies

damping dominant @ low frequencies

ANSYS MEMS 7.0 10/10/02

Damping Characterization Procedure

Typical Procedure with ALE formulation for moving bodies - Mesh the fluid region - Apply displacement/velocity/pressure bc - Specify fluid properties, body forces etc - Specify algorithmic parameters - Solve the NS eqs for velocity & pressure - Extract secondary variables( forces on obstacles) Displacement and velocity boundary conditions on the moving part must be fully prescribed. They will generally be a function of time and can most easily be defined using the ANSYS equation builder; Utility Menu > Parameters > Function)
For oscillating structures, a time-harmonic function must be used to describe the motion. For a transient analysis, several periods must be run until start-up transient effects dissipate.
ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

Rigid Body Translation - Comb Drive

ANSYS MEMS 7.0 10/10/02

ROM Parameter Extraction for Linear Motion

F0 cos d M X+ X 0

F0 sin d X + X 0

X = Fnonfluid

Spring constant K

Damping Coefficient C

ANSYS MEMS 7.0 10/10/02

ROM Parameter Extraction for Linear Motion Imposed Displacement d Pressure Force

The integrated pressure force on the body can be obtained Using the INTSRF command in Post1 for each time point
ANSYS MEMS 7.0 10/10/02

ROM Parameter Extraction for Angular Motion

Prescribed motion

= 0 sin t
Oscillating plate Pivot

= 0 cos t = 0 2 sin t

h0

Air

Stationary plate

ANSYS MEMS 7.0 10/10/02

Fluid Structural Damping Characterization

Torsional Micro-Mirror Oscillation

ANSYS MEMS 7.0 10/10/02

ROM Parameter Extraction for Linear Motion

T0 sin J+ 0

T0 cos + 0

= Tnonfluid

Torsional damping coeff

Torsional spring constant

T p = T0 sin (t + )

Plot T p and against t and get T0 , such that

ANSYS MEMS 7.0 10/10/02

ROM Parameter Extraction for Angular Motion Imposed Rotation Torque

The integrated torque (moment) on the body can be obtained Using the INTSRF command in Post1 for each time point
ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS OPTICAL & RF MEMS HIGH FREQUENCY EMAG

ANSYS MEMS 7.0 10/10/02

HF Electromagnetics for RF MEMS

HF Electromagnetics: Full wave, frequency domain solvers allow RF MEMS devices to be more easily analyzed. Perfectly Matched Layer/absorber (PML) for open boundaries, Near and far field postprocessing tools are some of the highlights.

ANSYS MEMS 7.0 10/10/02

Broad Classification of ANSYS HF EMAG Phenomena & Applications

Interior Phenomena: Electromagnetic wave propagates or resonates within a closed structure. Cavity - microwave oven RF/Microwave passive components and circuits High-speed electronic digital circuits Exterior Phenomena: Electromagnetic wave propagates in open domain. Electromagnetic wave radiation (radio, optical) Object identification - (Radar Cross Section- RCS) Electromagnetic interference (EMI) Electromagnetic compatibility (EMC) Biomedical applications - CAT / NMR scans
ANSYS MEMS 7.0 10/10/02

Analysis Applications
The Electromagnetic Spectrum

ANSYS MEMS 7.0 10/10/02

Analysis Applications
Problem Size Limits Inherent in HF FEA
Problem size is limited by physical RAM & disk space. First & second order elements are available. First order elements are fine for most applications. 160,000 elements require approximately 1-1.5 Gbyte of RAM 300,000 elements require approximately 2-3 Gbyte of RAM 10 15 elements are required per wavelength for accuracy For a 1 Gbyte RAM system: 1 MHz represents 300m wavelength. Each element can be 30m! i.e. Can mesh a cube of 1630m 1 GHz represents 30 cm wavelength. Each element can be 3cm ! i.e. Can mesh a cube of 1.63 m Now to put the optical problem into perspective, red light is approx 600 nm (or 5E14 Hz!). Each element can be 60 nm ! i.e. At this frequency we can only mesh a 3.25 um cube. This is what we call an electrically large problem. Making use of symmetry and PMA goes a long way to reduce problem sizes, but realistically, you cannot use FEA technology for the analysis of large objects/systems at very high frequencies.
ANSYS MEMS 7.0 10/10/02

HF EMAG Simulation Domain

Showing boundaries & sources
Finite element mesh Surface 0 enclosing FEA domain
Plane wave Einc

PEC or PMC

Feeding aperture f

Dielectric volume (enclosed by d )

Resistive or impedance surface r

Current volume s

ANSYS MEMS 7.0 10/10/02

HF EMAG Features
Material Properties & Boundary Conditions
Material Properties: Lossy/lossless isotropic material Lossy/lossless anisotropic material Boundary Conditions:

Perfect electric conductor (PEC) Perfect magnetic conductor (PMC) Impedance boundary conditions (IBC) NEW Perfectly matched layers (PMA) NEW

ANSYS MEMS 7.0 10/10/02

The Perfectly Matched Absorber

PMA Boundary Condition

PMA is a super absorbing boundary layer of artificial Finite Elements surrounding domain. PMA absorbs any kind of incoming electromagnetic waves (except grazing). PMA is appropriate for interior and exterior problems. Number of layers determines attenuation of radiation Attenuation rate per element can be defined

PMA face region Object

Source PMA corner region

ANSYS MEMS 7.0 10/10/02

PMA Example
Abrupt Waveguide Transition
PMA Elements

H sum

E sum
ANSYS MEMS 7.0 10/10/02

PMA Example
Abrupt Waveguide Transition Comparison of S11 Results with Integral Equation Method
0.55 Emag HF IE

0.5

0.45 |S11| 0.4 0.35 0.3 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Frequency (GHz)

ANSYS MEMS 7.0 10/10/02

Product Features
Near & Far Fields
Far Field Radiative Near Field Far Field

Reactive Near Field

Far Field Far Field

See http://www.eurisco.com/jack/anttool/regions-e.html
ANSYS MEMS 7.0 10/10/02

HF EMAG Features
Excitation Sources & Solvers
Excitation Sources: Waveguide modal source ENHANCED Plane wave source ENHANCED Surface, line electric field source NEW Surface magnetic field source NEW Volume, surface, line and point current density source NEW Solver: LANCZOS eigenvalue solver SPARSE direct solver FRONTAL direct solver ICCG iterative solver
ANSYS MEMS 7.0 10/10/02

HF EMAG Features
Post Processing

Electromagnetic field vector and contour plots Quality factor (Q-factor) S-parameters Voltage, current & characteristic impedance Near & far electromagnetic fields extension Radar cross section (RCS) Antenna patterns Coupling to ANSYS Thermal SOLUTION

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

Microstrip Low-pass Filter
Microstrip

Substrate

PMA

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

Microstrip Low-pass Filter Electric Field
E sum @ 5 GHz

E sum @ 7.5 GHz

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

Microstrip Low-pass Filter S11 and S21-Parameter Comparison
0 -10

|S11| (dB)

-20

-30

S11

Emag HF FDTD

0 -10

-40

|S21| (dB)

11

13

15

17

19

S21
-20 -30

Frequency (GHz)

Emag HF
-40 -50 1 3 5 7 9 11 13 15 17 19

FDTD

Frequency (GHz)

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

Coplanar Waveguide (CPW) to Microstrip Transition
Microstrip Metallic Via

PMA

Substrate

CPW

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

CPW to Microstrip Transition - Electric Field
E sum @ 40 GHz

E sum @ 40 GHz in substrate

via

Metallic Via

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

CPW to Microstrip Transition S11 & S21-Parameter Comparison
0 -5

S11: Emag S21: Emag S21: FDTD S11: FDTD

S21

Magnitude (dB)

-10 -15 -20 -25 -30 -35 -40 20 25

S11

30

35

40

45

50

55

60

Frequency (GHz)
ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Dipole Antenna
Half-Wavelength Dipole with current distribution

E sum

1/8 Symmetry model with PMA

ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Dipole Antenna - Far field Radiation Pattern
0 -5 Far-field (dB) -10 -15 -20 -25 -30 5 25 45 65 85 105 125 145 165 Angle Theta (Deg) Emag HF Analytic

E Field vectors

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

Microwave Coax-to-Waveguide
Waveguide Output Port

Coax Input Port

ANSYS MEMS 7.0 10/10/02

Wave Propagation Example

Microwave Coax-to-Waveguide

ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Microstrip Rectangular Patch Antenna 17.19 25.31 mm
PMA Region

Patch Microstrip

1/2 Symmetry model with PMA

Coax Feed

Substrate
ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Microstrip Rectangular Patch Antenna Reflection Loss

E sum iso-surfaces

Reflection Loss 7.1 Ghz peak

ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Microstrip Rectangular Patch Antenna Far field Radiation Pattern
= 90o

= 0o

ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Microstrip Rectangular Patch Antenna Electric Field at 3 Meters
E-Field on E- Plane

E-Field on H- Plane

ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

Signal Integrity / EMC of PC Cabinet 80 MHz E & H Fields

ANSYS MEMS 7.0 10/10/02

Wave Radiation Example

EMC Application: Cabinet Shielding

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

Metallic Plate Scattering
1/8 Symmetry model with PMA

Einc

Scattering Electric Field

Total Electric Field

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

Metallic Plate Radar Cross Section (RCS)

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

Dielectric Sphere Scattering
Einc
1/4 Symmetry model with PMA

Scattering Magnetic Field Scattering Electric Field

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

Dielectric Sphere Normalized Radar Cross Section

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

Plane Wave Incident on Antenna

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

EMC/RFI Shielding

Image courtesy of Bill Bulat, CSI.

ANSYS MEMS 7.0 10/10/02

Wave Scattering Example

EMC/RFI Shielding

ANSYS MEMS 7.0 10/10/02

Coupled HF EMAG to other Physics

Thermal Effects on Wave guide

Waveguide Bend Electric Field @ 20oC

Waveguide Displacement from 20- 60oC

Waveguide Bend Electric Field @ 60oC

20 oC : S11 = 0.1901, S12 = 0.9817 60 oC : S11 = 0.1895, S12 = 0.9819

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS Design Optimization & Probabilistic Design

ANSYS MEMS 7.0 10/10/02

Design Optimization & Probabilistic Design

Linear Resonator

ANSYS MEMS 7.0 10/10/02

Design Optimization & Probabilistic Design

ANSYS MEMS 7.0 10/10/02

Probabilistic Design Variables

Name mcthdl mcthdw mcspdw mcthdy scth1dl scth1dw scth1dy scth2dl scth2dw scth2dy scspdw gpdx poly_dt Z_GaPDZ Description Moving comb tooth delta length Moving comb tooth delta width Moving comb spine delta width Moving comb tooth delta y-position Static comb tooth 1 delta length Static comb tooth 1 delta width Static comb tooth 1 delta y-position Static comb tooth 2 delta length Static comb tooth 2 delta width Static comb tooth 2 delta y-position Static comb spine delta width Ground plane delta length Polysilicon delta thickness Polysilicon above nitride delta heigh Stand.dev. 0.125 0.125 0.125 0.125 0.125 0.125 0.125 0.125 0.125 0.125 0.125 0.125 0.01 0.01

ANSYS MEMS 7.0 10/10/02

Probabilistic Design Results

Three Most Sensitive Parameters

Microsoft Word Document

ANSYS MEMS 7.0 10/10/02

ANSYS/Multiphysics MEMS CUSTOMIZATION

ANSYS MEMS 7.0 10/10/02

Customization of ANSYS
Defining common processes and implementing best design practices

APDL *ASK command. /OPT Design Optimization PDS Probabilistic Design Studies UIDL (Weedull) Menu Customization. Tcl/Tk GUI. ANSYS Professional & ANSYS Mechanical Toolbar ANSYS HTML report generator

ANSYS MEMS 7.0 10/10/02

Customization of ANSYS
Defining common processes, implementing best design practices

ANSYS MEMS 7.0 10/10/02

ANSYS HTML Report Generator

Defining common processes, implementing best design practices

ANSYS MEMS 7.0 10/10/02

AnsPak: Automated Thermal Fatigue

Analysis of BGA and flip Chips
An intuitive GUI

Efficient generation of finite element model

ANSYS MEMS 7.0 10/10/02

Advanced Simulation using APDL

Moisture Diffusion Simulation
Moisture distribution in Lucent PBGA (1/4 model) after 168 hrs at 850C, 85%RH
Mold compound

Substrate

Cu plane

Solder resist

Die

Thermal vias

Images courtesy of Wong Ee Hua, IME. ANSYS MEMS 7.0 10/10/02

Advanced Simulation using APDL

Users are obtaining very good correlation with experimental data
Moisture Weight Gain (mg)
0.016

0.012

0.008

Experiment
0.004

FEA

0 0 200 400 600 800 1000

Time (hr)

Images courtesy of Wong Ee Hua, IME. ANSYS MEMS 7.0 10/10/02

Advanced Simulation using APDL

Hygroscopic Swelling & Stress Modeling 35x35 PBGA
Die attach

Mold Compound
Solder Mask

Solid Model

Die Cu

Moisture profile

Y Displacement

Images courtesy of Wong Ee Hua, IME. ANSYS MEMS 7.0 10/10/02

MEMSCAP - ANSYS A Total MEMS EDA Solution

ANSYS MEMS 7.0 10/10/02

ANSYS & MEMSCAP Enhanced Solution Partnership

MEMS Xplorer & MEMS Pro Multiple Platform Solutions Windows and Unix based Products couple with ANSYS via APDL / file transfer.
Press release: www.ansys.com/corporate/press_releases/archives/pr040599.htm www.memscap.com ANSYS MEMS 7.0 10/10/02

MEMS Xplorer - ANSYS/Multiphysics

High Level Product Model
TOTAL MEMS DESIGN SOLUTION

EDA platform:

Mentor Graphics Cadence Tanner EDA

MEMS Xplorer

ANSYS
Multiphysics

MEMS Foundries

ANSYS MEMS 7.0 10/10/02

The Windows NT/2000 Configuration is MEMS Pro

TOTAL MEMS DESIGN SOLUTION MEMS Pro V3.0
Layout Process emulation System simulation

ANSYS
Multiphysics

Fabrication

ANSYS MEMS 7.0 10/10/02

MEMS Xplorer-ANSYS/Multiphysics
Layout Import/Export
CIF,GDSII DXF

Design flow.

MEMS Xplorer
Layout Process Emulation Macro Models VHDL-A/MS SPICE Mentor Cadence Tanner

ANSYS ANF INPUT File or ACIS SAT

ANSYS Multiphysics

CIF File

ANSYS Database

Powerful bi-directional associativity

ANSYS MEMS 7.0 10/10/02

MEMS Geometry Transfer From MEMS Pro into ANSYS/Multiphysics

ANSYS MEMS 7.0 10/10/02

MEMSCAP ANSYS Interface

Transferring Geometry to ANSYS
MEMS Geometry Transfer via ACIS SAT File
Industry standard ACIS SAT solid model file

Imported Geometry Becomes ANSYS Native

Can be cut up and simplified Can be modified and moved around Boundary conditions can be placed on the geometry

ANSYS MEMS 7.0 10/10/02

MEMSCAP ANSYS Interface

Transferring Geometry to ANSYS

ANSYS MEMS 7.0 10/10/02

Sending Data from ANSYS to MEMS Pro

3D Geometry Can be Sent Back to MEMS Pro ROM2 Models can be Exported to MEMS Pro

ANSYS MEMS 7.0 10/10/02

MEMS Application Focus

ANSYS MEMS 7.0 10/10/02

Application Focus: Inertial Devices

Accelerometers for Automobile Airbag Deployment

Inertial Mass Folded spring to provide restoring force Acceleration produces deflection Deflection measured via change in capacitance of combs.

ANSYS MEMS 7.0 10/10/02

Application Focus: Inertial Devices

MEMS Inertial Measurement Units (IMUs)
MEMS JET / ROCKET ENGINE MEMS lock arming system

MEMS Gyroscopes

RF MEMS Telecomms

ANSYS MEMS 7.0 10/10/02

Application Focus: Micromirrors

Texas Instruments Digital Light Processor

Micro Array of Mirrors Electrostatically actuated Each mirror is a Pixel of a display

ANSYS MEMS 7.0 10/10/02

Application Focus: TIPS

Field Emission Flat Panel Display

Array of very sharp micro tips Each tip is a micro-electron gun Each tip is a Pixel of a display

ANSYS MEMS 7.0 10/10/02

Application Focus: LabCD

Blood analysis while you wait!

Loading & Metering structures Blood separation Valving structures Mixing Electro-chemical Analysis High density assays Clinical diagnostics DNA analysis
www.tecan.com www.acs.ohio-state.edu/units/research/archive/labcdvid.htm
ANSYS MEMS 7.0 10/10/02

/FINISH

ANSYS MEMS 7.0 10/10/02