PowerEdge R610

Technical Guide

Inspired by customer feedback, the Dell PowerEdge R610 server is engineered to simplify data center operations, improve energy efficiency, and lower total cost of ownership.

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This document is for informational purposes only. Dell reserves the right to make changes without further notice to any products herein. The content provided is as is and without express or implied warranties of any kind. Dell, the Dell logo, PowerEdge, and ReadyRails are trademarks of Dell, Inc. Citrix and XenServer are registered trademarks of Citrix Systems, Inc. and/or one or more of its subsidiaries, and may be registered in the United States Patent and Trademark Office and in other countries. Intel and Xeon are registered trademarks of Intel Corporation in the U.S. and other countries. Broadcom and NetXtreme are registered trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Matrox is a registered trademark of Matrox Electronic Systems Ltd. Microsoft, Windows, Windows Server, SQL Server, and BitLocker, and Hyper-V are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Red Hat is a registered trademark of Red Hat, Inc. in the United States and other countries. Linux is a registered trademark of Linus Torvalds. VMware and vSphere are registered trademarks and ESX and ESXi are trademarks of VMware, Inc. in the United States and/or other jurisdictions. Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell disclaims proprietary interest in the marks and names of others. Copyright 2012 Dell Inc. All rights reserved. Reproduction or translation of any part of this work beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful and strictly forbidden. December 2012 | Version 4.0 PowerEdge R610 Technical Guide ii

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Table of Contents
1 Product Comparison ........................................................................................... 7 1.1 Overview .................................................................................................. 7 1.1.1 Strong IT Foundation............................................................................... 7 1.1.2 Purposeful Design .................................................................................. 7 1.1.3 Enhanced Virtualization ........................................................................... 7 1.1.4 Energy-Optimized Technologies .................................................................. 7 1.1.5 Simplified Systems Management ................................................................. 8 1.1.6 Dell Services ........................................................................................ 8 1.2 Comparison ............................................................................................... 8 Key Technologies............................................................................................. 11 2.1 Overview ................................................................................................ 11 2.2 Detailed Information .................................................................................. 11 System Overview ............................................................................................. 12 Mechanical .................................................................................................... 15 4.1 Chassis Description..................................................................................... 15 4.2 Dimensions and Weight ................................................................................ 15 4.3 Front Panel View and Features ...................................................................... 15 4.4 Back Panel View and Features ....................................................................... 16 4.5 Power Supply Indicators............................................................................... 16 4.6 NIC Indicators ........................................................................................... 17 4.7 Internal Chassis Views ................................................................................. 17 4.8 Rails and Cable Management ......................................................................... 18 4.8.1 ReadyRails Sliding Rails ......................................................................... 18 4.8.2 ReadyRails Static Rails .......................................................................... 18 4.9 Fans ...................................................................................................... 18 4.10 LCD Control Panel ...................................................................................... 18 4.11 Security .................................................................................................. 19 4.11.1 Cover Latch ....................................................................................... 19 4.11.2 Bezel ............................................................................................... 19 4.11.3 Hard Drive ......................................................................................... 19 4.11.4 TPM ................................................................................................. 19 4.11.5 Power Off Security ............................................................................... 20 4.11.6 Intrusion Alert .................................................................................... 20 4.11.7 Secure Mode ...................................................................................... 20 4.12 USB Key .................................................................................................. 20 4.13 Battery................................................................................................... 20 4.14 Field Replaceable Units (FRU)........................................................................ 20 4.15 User Accessible Jumpers, Sockets, and Connectors ............................................... 20 Power, Thermal, Acoustic .................................................................................. 21 5.1 Power Efficiencies ..................................................................................... 21 5.2 Main Power Supply ..................................................................................... 21 5.3 Power Supply Specifications .......................................................................... 22 5.4 Heat Dissipation ........................................................................................ 22 5.5 Environmental Specifications......................................................................... 22 5.6 Power Consumption Testing .......................................................................... 23 5.7 Energy Smart Enablement ............................................................................ 24 5.8 Energy Star Compliance ............................................................................... 24 iii

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Dell 5.9 Acoustics ................................................................................................ 24 Processors ..................................................................................................... 25 6.1 Overview ................................................................................................ 25 6.2 Features ................................................................................................. 26 6.3 Supported Processors .................................................................................. 26 6.4 Processor Configurations .............................................................................. 27 6.4.1 Single Processor Configuration ................................................................. 27 6.4.2 Processor Power Voltage Regulation Modules (EVRD 11.1) ................................. 27 6.5 Processor Installation .................................................................................. 27 7 Memory ........................................................................................................ 28 7.1 Overview ................................................................................................ 28 7.2 DIMMs Supported ....................................................................................... 28 7.2.1 Memory Modes .................................................................................... 28 7.2.2 DIMM Population Rules .......................................................................... 29 7.3 Speed .................................................................................................... 29 7.4 DIMM Slots ............................................................................................... 30 7.5 Low Voltage DIMMs ..................................................................................... 30 7.6 Mirroring ................................................................................................. 30 7.7 Sparing ................................................................................................... 30 7.8 Memory Scrubbing...................................................................................... 31 7.9 Advanced ECC (Lockstep) Mode ...................................................................... 31 7.10 Optimizer (Independent Channel) Mode ............................................................ 31 7.11 Supported Configurations ............................................................................. 31 8 Chipset ........................................................................................................ 32 8.1 Intel I/O Hub (IOH) .................................................................................... 32 8.2 IOH QuickPath Interconnect (QPI) ................................................................... 32 8.3 IOH PCI Express ......................................................................................... 32 8.4 Intel I/O Controller Hub 9 (ICH9) .................................................................... 32 9 BIOS ............................................................................................................ 34 9.1 Overview ................................................................................................ 34 9.2 Supported ACPI States ................................................................................. 34 9.3 I2C (Inter-Integrated Circuit) ......................................................................... 34 10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 36 11 PCI Slots ....................................................................................................... 37 11.1 Overview ................................................................................................ 37 11.2 PCI Riser Restrictions .................................................................................. 37 11.3 Quantities and Priorities .............................................................................. 37 11.4 PCI Card Dimensions ................................................................................... 37 12 Storage ........................................................................................................ 38 12.1 Overview ................................................................................................ 38 12.2 Internal Hard Disk Drives .............................................................................. 38 12.2.1 Hard Disk Drive Carriers ......................................................................... 38 12.2.2 Empty Drive Bays ................................................................................. 39 12.2.3 Diskless Configuration Support ................................................................. 39 12.2.4 Hard Drive LED Indicators ....................................................................... 39 12.3 RAID Configurations .................................................................................... 39 12.4 Storage Controllers .................................................................................... 41 12.4.1 SAS 6/iR ........................................................................................... 41 12.4.2 PERC 6/i ........................................................................................... 42 12.4.3 PERC H200 ......................................................................................... 42 6 PowerEdge R610 Technical Guide iv

Dell 12.4.4 PERC H700 ......................................................................................... 42 12.5 Optical Drives ........................................................................................... 43 12.6 Tape Drives ............................................................................................. 43 12.7 External Storage Support ............................................................................. 43 13 Video ........................................................................................................... 44 14 Rack Information ............................................................................................. 45 14.1 Overview ................................................................................................ 45 14.2 Rails ...................................................................................................... 45 14.3 Cable Management Arm (CMA) ....................................................................... 47 14.4 Rack View ............................................................................................... 47 15 Operating Systems ........................................................................................... 50 16 Systems Management ........................................................................................ 51 16.1 Overview ................................................................................................ 51 16.2 Server Management .................................................................................... 51 16.3 Embedded Server Management ...................................................................... 52 16.4 Dell Lifecycle Controller and Unified Server Configurator ....................................... 52 16.5 Integrated Dell Remote Access Controller.......................................................... 52 16.6 iDRAC6 Express ......................................................................................... 53 16.7 iDRAC6 Enterprise ...................................................................................... 53 16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ............................................. 53 17 Peripherals .................................................................................................... 56 Appendix A. Certifications ..................................................................................... 57 A.1 Regulatory Certifications ............................................................................. 57 A.2 Product Safety Certifications ......................................................................... 57 A.3 Electromagnetic Compatibility ....................................................................... 58 A.4 Ergonomics, Acoustics and Hygienics ............................................................... 59 Appendix B. Additional Information and Options ........................................................... 60

Tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Product Comparison to PowerEdge R510 and R710 .............................................. 8 Product Features Summary ........................................................................ 12 Power Supply Status ................................................................................ 16 Power Supply Specifications ....................................................................... 22 Environmental Specifications ...................................................................... 22 Power Consumption Testing ....................................................................... 23 Acoustical Performance ............................................................................ 24 Intel Xeon 5500 and 5600 Processor Series Features ........................................... 25 Supported Processors ............................................................................... 26 Supported Hard Drives.............................................................................. 38 Factory RAID Configurations ....................................................................... 39 Storage Card Support Matrix....................................................................... 42 Graphics Video Modes .............................................................................. 44 Supported Racks ..................................................................................... 46 Rail Adjustability Ranges and Depth ............................................................. 47 Unified Server Configurator Features and Description......................................... 52 Features List for Base Management Functionality, iDRAC, and vFlash ...................... 54 Product Safety Certifications ...................................................................... 57 Electromagnetic Compatibility Certifications ................................................... 58 v

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Dell Table 20. Table 21. Ergonomics, Acoustics and Hygienics............................................................. 59 Industry Standards .................................................................................. 60

Figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Chassis Dimensions .................................................................................. 15 Front View ........................................................................................... 16 Front View (With Optional Bezel) ................................................................. 16 Back View ............................................................................................ 16 Internal Chassis View ............................................................................... 17 Control Panel ........................................................................................ 19 Power Supplies ...................................................................................... 21 Dell 2.5 Hard Drive Carrier ....................................................................... 39 R610 Sliding Rails with Optional CMA ............................................................ 45 R610 Static Rails.................................................................................. 46 R610 Mounted in the A1 Sliding Rails .......................................................... 48 R610 Mounted in the B1 Sliding Rails with the CMA ......................................... 48 R610 Mounted in the A2 Static Rails (2-post Center Mount Configuration) .............. 49

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Product Comparison

1.1 Overview
The Dell PowerEdge R610 is a 2-socket 1U rack server that offers simplified management, purposeful design, and energy efficiency that can help you better manage your enterprise IT environment.

1.1.1

Strong IT Foundation

The Dell PowerEdge R610 is a key building block for todays data center. Designed for versatility and high performance, it provides many of the virtualization, system management, and energy-efficiency features you need now and the scalability necessary to change as your business grows. This general purpose Intel processor-based server is ideal for corporate data centers and remote sites that require a dense, highly available single- or dual-processor server at an excellent value.

1.1.2

Purposeful Design

The PowerEdge R610 follows the 11th generation PowerEdge portfolio specifications and features the same system design commonality and reliability true to the entire portfolio. All 11th generation servers are designed to make the experience easier. We put all external ports, power supplies, LCD screens, and LED lights in the same location for familiar experience as well as easy installation and deployment. Robust, metal hard drive carriers and organized cabling are designed to help improve component access and airflow across the server. The PowerEdge R610 provides an interactive LCD screen or LED display positioned on the front of the server for ease of monitoring and troubleshooting condition of the server.

1.1.3

Enhanced Virtualization

Featuring Intel Xeon processors, embedded hypervisors, and expanded memory footprint and I/O, the Dell PowerEdge R610 delivers exceptional overall system performance and significant virtual machine-per-server capacity. With optional factory-integrated virtualization capabilities, you get tailored solutionsbuilt with the latest technologies from Dell and our trusted partnerswhich allow you to streamline deployment and simplify virtual infrastructures. Choose your hypervisor from market leaders such as VMware, Citrix, and Microsoft, and enable virtualization with a few mouse clicks.

1.1.4

Energy-Optimized Technologies

Dells advanced thermal control helps optimize performance while minimizing system power consumption, ultimately driving energy efficiency across our latest core data center servers. These enhancements, over previous generations, include efficient power supply units right-sized for system requirements, improved system-level design efficiency, policy-driven power and thermal management, and highly efficient standards-based Energy Smart components. Dells advanced thermal control is designed to deliver optimal performance at minimum system and fan power consumption resulting in our quietest mainstream 1U servers to date.

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1.1.5

Simplified Systems Management

With the optional advanced embedded systems management capabilities of Lifecycle Controller, Dell provides comprehensive enterprise class manageability already on the motherboard. Lifecycle Controller is delivered as part of the optional iDRAC Express or iDRAC Enterprise in the PowerEdge R610. The Lifecycle Controller helps to simplify administrator tasks by performing a comprehensive set of provisioning functions such as system deployment, system updates, hardware configuration and diagnostics from a single intuitive interface called Unified Server Configurator (USC) in a pre-OS environment. This helps eliminate the need to use and maintain multiple pieces of disparate CD/DVD media. Also part of the Dell OpenManage portfolio is the Dell Management Console which is included with every Dell server and provides IT administrators with a consolidated console view of their IT infrastructure.

1.1.6

Dell Services

Dell Services can help reduce IT complexity, lower costs, and eliminate inefficiencies by making IT and business solutions work harder for you. The Dell Services team takes a holistic view of your needs and designs solutions for your environment and business objectives while leveraging proven delivery methods, local talent, and in-depth domain knowledge for the lowest total cost of ownership (TCO).

1.2 Comparison
Table 1.
Feature Processor Form Factor Front Side Bus # Sockets # Cores L2/L3 Cache Chipset DIMMs Min/Max RAM R510 Intel Xeon processor 5500 and 5600 series 2U rack Intel QuickPath Interconnect (QPI) 6.4GT/s 2 2, 4, or 6 4MB, 8MB, and 12BM Intel 5500 8 DDR3 1GB/128GB 4 x 3.5, or 8 x 3.5 or 2.5, or 12 x 3.5 or 2.5 + 2 x internal 2.5 SAS, SATA, and SSD

Product Comparison to PowerEdge R510 and R710

R610 Intel Xeon processor 5500 and 5600 series 1U rack Intel QuickPath Interconnect (QPI) 6.4GT/s 2 2, 4, or 6 4MB, 8MB, and 12MB Intel 5520 12 DDR3 1GB/192GB

R710 Intel Xeon processor 5500 and 5600 series 2U rack Intel QuickPath Interconnect (QPI) 6.4GT/s 2 2, 4, or 6 4MB, 8MB, and 12MB Intel 5520 18 DDR3 1GB/288GB 4 x 3.5" with optional flex bay, 6 x 3.5" without flex bay, or 8 x 2.5 Hot-plug SAS and SATA, nearline SAS and SSD

Drive Bays

6 x 2.5

Hard Drive Types

Hot-plug SAS and SATA, nearline SAS and SSD

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Feature R510 Four- and eight-drive chassis: optional internal SATA slimline optical drives such as DVD-ROM or DVD+RW Twelve-drive chassis: N/A PERC 6/i, SAS 6/iR, PERC H200, PERC H700, PERC S100, PERC S300 Non-RAID: SAS 5/E LSI 2032 (for tape backup unit only) 6Gps SAS HBA RAID: SAS 6/iR PERC 6/i PERC 6/E PERC H200 PERC H700 PERC H800 Software RAID: PERC S100 (4-drive chassis only) PERC S300 (4- and 8drive chassis only) R610 Optional internal SATA slimline optical drives such as DVD-ROM or DVD+RW R710

External Drive Bay(s)

Optional flex bay expansion to support half-height tape backup unit

Embedded Hard Drive Controller

PERC 6/i, SAS 6/iR, PERC H200, PERC H700

PERC 6/i, SAS 6/iR, PERC H200, PERC H700

Optional Storage Controller

Non-RAID: SAS 5/E LSI 2032 (for tape backup unit only) 6Gps SAS HBA RAID: SAS 6/iR PERC 6/i PERC 6/E PERC H200 PERC H700 PERC H800

Non-RAID: SAS 5/E LSI 2032 (for tape backup unit only) 6Gps SAS HBA RAID: SAS 6/iR PERC 6/i PERC 6/E PERC H200 PERC H700 PERC H800

Availability

Hot-plug hard drives, redundant power, quad-pack LED diagnostic or LCD (with hot-plug hard drive chassis), memory mirroring

Hot-plug hard drives, hot-plug redundant power and cooling, ECC memory, Single Device Data Correction (SDDC), memory demand and patrol scrubbing, high-availability failover cluster iDRAC6 Express, BMC, IPMI 2.0, Dell OpenManage Optional: iDRAC6 Enterprise, vFlash

Hot-plug hard drives, hot-plug redundant power and cooling, ECC memory, Single Device Data Correction (SDDC), memory demand and patrol scrubbing, high-availability failover cluster iDRAC6 Express, BMC, IPMI 2.0, Dell OpenManage Optional: iDRAC6 Enterprise, vFlash 2 PCIe x8 + 2 PCIe x4 G2 or 1 x PCIe x16 + 2 PCIe x4 G2

Server Management

BMC, IPMI 2.0, Dell OpenManage Optional: iDRAC6 Express, iDRAC 6 Enterprise, vFlash 3 PCIe + 1 storage slot or 1 PCIe + 1 storage slot

I/O Slots

2 PCIe x8 G2

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Feature R510 SAS 6/iR and PERC H200: RAID 0, 1 PERC 6/i and PERC H700: RAID 0, 1, 5, 6, 10, 50, 60 PERC S100: 0, 1, 5, 10 PERC S300: 0, 1, 5, 10 Broadcom BCM5716 2 x iSCSI TOE Optional: various NICs available 2 front, 2 back, 2 internal Four-drive chassis: non-redundant, 480W Eight-drive and twelvedrive chassis: hot-plug redundant 750W Four-drive chassis: four non-redundant, non-hotpluggable fans Eight-drive chassis: five non-redundant, non-hotpluggable fans Twelve-drive chassis: five redundant, non-hotpluggable, dual-rotor fans R610 SAS 6/iR and PERC H200: RAID 0, 1 PERC 6/i and PERC H700: RAID 0, 1, 5, 6, 10, 50, 60 Broadcom BCM5709C 4 x iSCSI TOE Optional: various NICs available 2 front, 2 back, 1 internal Two redundant hot-plug high efficiency 502W or two redundant hot-plug high output 717W R710 SAS 6/iR and PERC H200: RAID 0, 1 PERC 6/i and PERC H700: RAID 0, 1, 5, 6, 10, 50, 60 Broadcom BCM5709C 4 x iSCSI TOE Optional: various NICs available 2 front, 2 back, 1 internal Two redundant hot-plug high efficiency 570W or two redundant hot-plug high output 870W

RAID

NIC/LOM

USB

Power Supplies

Fans

Six dual-rotor fans (dual processor configuration) or five dual-rotor fans (single processor configuration)

Five hot-plug fans (default processor configuration) or four hot-plug fans (single processor configuration)

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Key Technologies

2.1 Overview
Key features of the PowerEdge R610 include dual Intel Xeon 5500 and 5600 series quad-core and six-core processors, Intel 5500 chipset I/O Hub (IOH) with QuickPath Architecture, DDR3 memory, DIMM thermal sensors, PCI Express Generation 2, iDRAC with integrated video controller, dual-port embedded Gigabit Ethernet controllers, Internal SD Module, iDRAC6 Express, and optional iDRAC6 Enterprise.

2.2 Detailed Information

The Intel Xeon processor 5500 and 5600 series is designed specifically for servers and workstation applications. The processor features quad-core and six-core processing to maximize performance and performance/watt for data center infrastructures and highly dense deployments. The processor also features the Intel Core micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and operating systems. See section 6 for more information.

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System Overview
Table 2.
Feature Form Factor Processors Processor Sockets Front Side Bus or HyperTransport Cache Chipset Memory1 I/O Slots

For the latest information on supported features for the PowerEdge R610, visit Dell.com. Product Features Summary

Technical Specification 1U rack Dual-core, quad-core, or six-core Intel Xeon processors 5500 and 5600 series 2 Intel QuickPath Interconnect (QPI) Up to 12MB Intel 5520 Up to 192GB (12 DIMM slots): 1GB/2GB/4GB/8GB/16GB DDR3 800MT/s, 1066MT/s, or 1333MT/s Two PCIe x8 Gen2 + 1 x4 storage slot Internal Controllers: PERC H200 (6Gb/s) PERC H700 (6Gb/s) (nonvolatile battery-backed cache: 512MB, 1GB) SAS 6/iR PERC 6/i (battery-backed cache: 256MB) External Controllers: PERC H800 (6Gb/s) (non-volatile battery-backed cache: 512MB, 1G) PERC 6/E (battery-backed cache: 256MB, 512MB) External HBAs (non-RAID): 6Gb/s SAS HBA SAS 5/E HBA LSI2032 PCIe SCSI HBA

RAID Controller

Drive Bays Maximum Internal Storage

Internal hard drive bay and hot-plug backplane, up to six 2.5 SAS, SATA, or SSD Drives Up to 12TB 2.5 SAS (15,000 rpm): 73GB, 146GB 2.5 SAS (10,000 rpm): 146GB, 300GB, 600GB 2.5 nearline SAS (7,200 rpm): 500GB, 1TB 2.5 SATA (7,200 rpm): 250GB, 500GB 2.5 SATA SSD: 50GB, 100GB 2.5 SAS SSD: 149GB

Hard Drives1

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Feature Technical Specification Two dual port embedded Broadcom NetXtreme II 5709c Gigabit Ethernet NIC with failover and load balancing. Optional 1GBe and 10GBe add-in NICs: Broadcom NetXtreme II 57711 Dual Port Direct Attach 10Gb Ethernet PCI-Express Network Interface Card with TOE and iSCSI Offload Intel Gigabit ET Dual Port Server Adapter and Intel Gigabit ET Quad Port Server Adapter Dual Port 10GB Enhanced Intel Ethernet Server Adapter X520-DA2 (FCoE Ready for Future Enablement) Brocade CNA Dual-port adapter Emulex CNA iSCSI HBA stand up adapter OCE10102-IX-D Emulex OCE10102-IX-DCNA iSCSI HBA stand-up adapter Optional add-in HBAs: Brocade 8 GB HBAs One or two hot-plug high-efficiency 502W Energy Smart power supplies or One or two hot-plug 717W high-output power supplies DDR3 memory, ECC, hot-plug hard drives, optional hot-plug redundant power supplies, dual embedded NICs with failover and load balancing support, optional PERC6/i integrated daughtercard controller with battery-backed cache (or other controllers with battery-backed cache or non-volatile cache), hot-plug redundant cooling, tool-less chassis, fibre and SAS cluster support, validated for Dell/EMC SAN Integrated Matrox G200 (8MB shared video memory) iDRAC6 Enterprise (optional) Dell OpenManage ReadyRails sliding rails with optional cable management arm for 4post racks (optional adapter brackets required for threaded hole racks) ReadyRails static rails for 2-post and 4-post racks Microsoft Windows Server 2012 Microsoft Windows Small Business Server 2011 Microsoft Windows Small Business Server 2008 Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Microsoft Windows Server 2008 R2, x64 (includes Hyper-V v2) Microsoft Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux Oracle Solaris

Communications

Power Supply

Availability

Video Remote Management Systems Management

Rack Support

Operating Systems

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Feature Technical Specification Optional Embedded Hypervisors: Citrix XenServer VMware vSphere including ESX and ESXi Red Hat Enterprise Virtualization For more information on the specific versions and additions, visit Dell.com/OSsupport. Featured Database Applications
1

Operating Systems

Microsoft SQL Server solutions (see Dell.com/SQL) Oracle database solutions (see Dell.com/Oracle)

GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating environment and will be less.

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Mechanical

4.1 Chassis Description

The PowerEdge R610 is a 1U rack-mount design that supports the following features: New LCD control panel, bezel, and hard-drive carriers Tool-less rack latches Pull-out tray for customer labels Embedded NIC 1 and iDRAC MAC addresses Support for persistent storage: o Internal USB and SD card slot o One external vFlash media slot (on optional iDRAC6 Enterprise card) Updated power supplies and removal process

4.2 Dimensions and Weight

Figure 1 details the dimensions and weight for the PowerEdge R610.

Xa

Xb

Za (With Bezel) 35.0 mm

Za (Without Bezel) 21.0 mm

Zb

Zc

Max Weight 17.69 kg

482.44 mm

424.0 mm

42.6 mm

737.3 mm

772.0 mm

Figure 1.

Chassis Dimensions

4.3 Front Panel View and Features

Figure 2 and Figure 3 show the front views of the PowerEdge R610.

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Figure 2.

Front View

Figure 3.

Front View (With Optional Bezel)

See the Front-Panel Features and Indicators section in the About Your System chapter of the PowerEdge R610 Hardware Owners Manual on Support.Dell.com for more information.

4.4 Back Panel View and Features

Figure 4 shows the back view of the PowerEdge R610.

Figure 4.

Back View

See the Back-Panel Features and Indicators section in the About Your System chapter of the PowerEdge R610 Hardware Owners Manual on Support.Dell.com for more information.

4.5 Power Supply Indicators

The PowerEdge R610 redundant power supplies have one status bi-color LED: green for AC power present and amber for a fault as detailed in Table 3. Table 3.
LED

Power Supply Status

Power Supply Status AC Power is not present AC Power is present Fault of any kind is detected DC Power is applied to the system

Redundant power supply mismatch (when hot-plugged/swapped)

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Dell See the Power Indicator Codes section in the About Your System chapter of the PowerEdge R610 Hardware Owners Manual on Support.Dell.com for more information.

4.6 NIC Indicators

See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge R610 Hardware Owners Manual on Support.Dell.com for more information.

4.7 Internal Chassis Views

Figure 5 shows the internal view of the PowerEdge R610 server.

Figure 5.

Internal Chassis View

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4.8 Rails and Cable Management

4.8.1

ReadyRails Sliding Rails

Tool-less installation in 19 EIA-310-E compliant square or unthreaded round hole 4-post racks including all generations of Dell racks Full extension of the system out of the rack to allow serviceability of key internal components Optional cable management arm (CMA) except on racks less than 1m in depth, including Dell 4200 and 2400 racks Threaded 4-post racks require the ReadyRails static rails listed below or third-party offerings available through Dell Software and Peripherals

ReadyRailsTM Sliding Rails for 4-post racks support the following:

4.8.2

ReadyRails Static Rails

Tool-less installation in 19 EIA-310-E compliant square or unthreaded round hole 4-post racks including all generations of Dell racks Tooled installation in 19 EIA-310-E compliant threaded hole 4-post and 2-post racks

ReadyRailsTM Static Rails for 4-post and 2-post racks support the following:

See section 14 for more details.

4.9 Fans
Six dual-rotor 40 mm fans are mounted in a fan assembly that is located in the chassis between the hard drive bay and the processors. Only five fans are populated in systems with a single processor configuration. Each fan has a connector that plugs directly into the planar. The R610 fans cannot be hot-swapped. There are six fan zones in the R610, with one zone for each system fan. The Embedded Server Management logic in the system controls and monitors the speed of the fans. A fan failure or over-temperature in the system results in a notification from iDRAC6. The R610 Power Supply Units do not have any integrated fans; they are cooled by the system fans in front of them. The system requires a power-supply blank (metal cover) in place of the empty power supply slot. System fan speed is pulse-width modulated. Redundant cooling is supported. To provide cooling when the system is off, both rotors in FAN_MOD1 run off Vaux power at a low speed setting when the ambient air temperature in the power supply passes a pre-defined threshold. The iDRAC controls the fan in AutoCool mode.

4.10 LCD Control Panel

The LCD control panel is located on the front of the system chassis to provide user access to buttons, display, and I/O interfaces. See Figure 6. The control panel includes the following features: ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6) 128x20 pixel LCD with controls: o Two navigation buttons o Select button o System ID button Non-maskable Interrupt (NMI) button (recessed) Ambient temperature sensor 18

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Figure 6.

Control Panel

The LCD panel is a graphics display controlled by the iDRAC6. Both iDRAC6 and BIOS can send error codes and messages to the display. The system's LCD panel provides system information and status messages to signify when the system is operating correctly or when the system needs attention. BIOS has the ability to enter a secure mode through Setup, which locks the Power and NMI buttons. When in this mode, the power button can still be used to turn on the server even when the power button is disabled in System Setup. For more information on the LCD panel, see the LCD Panel Features section in the About Your System chapter in the PowerEdge R610 Hardware Owners Manual on Support.Dell.com.

4.11 Security
For additional information regarding the following security features, see the PowerEdge R610 Hardware Owners Manual on Support.Dell.com.

4.11.1 Cover Latch

The PowerEdge R610 comes with a coin lock entry latch on the top cover of the unit and provides security for the entire system. The lock provides for tool-less access to the chassis.

4.11.2 Bezel
A metal bezel is mounted to the chassis. A lock on the bezel is used to protect un-authorized access to system peripherals and the control panel. System status on the LCD is viewable even when the bezel is installed.

4.11.3 Hard Drive

The optional front bezel of the system contains a lock which secures the system hard drives. Some hard drives can still be unplugged from the backplane with the bezel present, but they cannot be removed from the chassis.

4.11.4 TPM
The TPM is used to generate and store keys, protect and authenticate passwords, and create and store digital certificates. The TPM can also be used to store Microsoft BitLocker keys for hard drive PowerEdge R610 Technical Guide 19

Dell encryption features in Microsoft Windows Server 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding.

4.11.5 Power Off Security

The control panel is designed so the power switch cannot be accidentally activated. The lock on the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that disables the power button function.

4.11.6 Intrusion Alert

A switch mounted on Riser 2 is used to detect chassis intrusion. When the cover is opened, the switch circuit closes and indicates intrusion to the iDRAC6. When enabled, the software can provide notification that the cover has been opened.

4.11.7 Secure Mode

BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to lock out the power and NMI switches on the control panel or set up a system password.

4.12 USB Key

The port on the control panel is for an optional USB key and is located inside the chassis. Some possible applications of the USB key are listed as follows: User custom boot and pre-boot OS for ease of deployment or diskless environments USB license keys for software applications like eToken or Sentinel Hardware Keys Storage of custom logs or scratch pads for portable user defined information (not hotswappable)

4.13 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the Real-Time Clock and CMOS RAM on the ICH9 chip.

4.14 Field Replaceable Units (FRU)

The planar contains a serial EEPROM to contain FRU information including Dell part number, part revision level, and serial number. The backplane storage enclosure processor (SEP) and the power supply microcontrollers are also used to store FRU data.

4.15 User Accessible Jumpers, Sockets, and Connectors

See the Jumpers and Connectors chapter in the PowerEdge R610 Hardware Owners Manual on Support.Dell.com.

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Power, Thermal, Acoustic

5.1 Power Efficiencies

One of the main features of the 11G family of servers is enhanced power efficiency. The R610 achieves higher power efficiency by implementing the following features: User-selectable power cap (subsystems throttle to maintain the specified power cap) Improved power budgeting Power-supply and voltage-regulator (VR) efficiency improvements Use of switching regulators instead of linear regulators Closed-loop thermal throttling Increased rear venting and 3D venting Pulse-width modulated (PWM) fans with an increased number of fan zones and configurationdependent fan speeds Use of DDR3 memory (lower voltage compared to DDR2, UDIMM) Processor VR dynamic phase shedding Memory VR static phase shedding Random time interval for system start Ability for an entire rack to power on without exceeding the available power BIOS Power/Performance options page Active Power Controller (BIOS-based CPU P-state manager) Ability to power down or throttle memory Ability to disable a processor core Ability to turn off embedded NICs or PCIe lanes when not being used Option to run PCIe at Gen1 speeds instead of Gen2

5.2 Main Power Supply

The base redundant R610 system consists of two hot-plug 502W Energy Smart (energy efficient) power supplies in a 1+1 configuration. A 717W high-output power supply is also available. The power supplies connect directly to the planar. There is a power cable to connect between the planar and the backplane. The R610 power supplies do not have embedded cooling fans; they are cooled only by the system cooling fans. Field replaceable unit (FRU) data is stored in the memory of the power supply microcontroller. Additionally, the power supply firmware can be updated by the iDRAC over the PMBus. In a single power supply configuration, the power supply is installed in PS1 location and a power supply blank (metal cover) is installed in PS2 location for proper system cooling.

Figure 7. PowerEdge R610 Technical Guide

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5.3 Power Supply Specifications

Table 4.
Feature Wattage Voltage Maximum inrush current Specification 717 Watt (high output) 502 Watt (Energy Smart) 90-264 VAC, autoranging, 47-63 Hz Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 55A per power supply for 10ms or less.

Power Supply Specifications

5.4 Heat Dissipation

High output (717W) power supply: 2446.5 BTU/hr maximum Energy Smart (502W) power supply: 1712.9 BTU/hr maximum

5.5 Environmental Specifications

Table 5. Environmental Specifications
Fresh Air: temperature, humidity, altitude de-rating When operating in the expanded temperature range, system performance may be impacted, and ambient temperature warnings may be reported on the LCD and in the System Event Log. 10% of annual operating hours: 5C to 10C and 35C to 40C (with no direct sunlight on the equipment) at 5% to 85% relative humidity with 26C dew point (maximum wet bulb temperature). Outside the standard operating temperature (10C to 35C), the system can operate down to 5C or up to 40C for a maximum of 10% of its annual operating hours. For temperatures between 35C and 40C (95F to 104F), de-rate maximum allowable dry bulb temperature by 1C per 175m above 950m (1F per 319 ft above 3117 ft). 1% of annual operating hours: 5C to 5C and 40C to 45C (with no direct sunlight on the equipment) at 5% to 90% relative humidity with 26C dew point (maximum wet bulb temperature). Outside the standard operating temperature (10C to 35C), the system can operate down to 5C or up to 45C for a maximum of 1% of its annual operating hours. For temperatures between 40C and 45C (104F to 113F), de-rate maximum allowable dry bulb temperature by 1C per 125m above 950m (1F per 228 ft above 3117 ft). Expanded operation restrictions: No cold startup below 5C Maximum altitude for the operating temperature must be 3050m (10,000ft) Expanded operation Temperature Operating Storage Operating Storage See Fresh Air for temperature information -40 to 65C (-40 to 149F) with a maximum temperature gradation of 20C per hour See Fresh Air for humidity information 5% to 95% at a maximum wet bulb temperature of 33C (91F); atmosphere must be condensing at all times -40 to 65C (-40 to 149F) with a maximum temperature gradation of 20C per hour

Continuous operation

Relative Humidity

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Maximum Vibration Operating Storage Maximum Shock Operating Storage Altitude Operating Storage -16 to 3048m (-50 to 10,000ft) Note: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1F/550ft -16 to 10,600m (-50 to 35,000ft) Half sine shock in all operational orientations of 31 G 5% with a pulse duration of 2.6ms 10% Half sine shock on all six sides of 71G 5% with a pulse duration of 2ms 10% Square wave shock on all six sides of 27G with velocity change @ 235 in/sec or greater 0.26 Grms at 5350Hz for 5 minutes in operational orientations 1.54 Grms at 10250Hz for 10 minutes in all orientations

Airborne contaminant level Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels measured at 50% relative humidity)

5.6 Power Consumption Testing

Table 6.
Feature Dimensions Status Indicators Integrated Fans Fixed Input Plug AC Cord Rating Input Voltage Auto-ranging Line Frequency Maximum Inrush Current Hot-Swap Capability Output Power Maximum Heat Dissipation Efficiency (20% 100% Load)
1

Power Consumption Testing

Energy Smart Power Supply
1

High Output Power Supply

L-249 mm x W-65.5 mm x H-38.2 mm 1 x bi-color Light Emitting Diode None IEC-C14

15 Amps @ 120 VAC, 10 Amps @ 240 VAC 90264 VAC Yes 4763 Hertz 55 Amps per supply for 10 ms or less Yes 502 Watts 1712.9 BTU per hour 86.590% @ 115 VAC 8892% @ 230 VAC 717 Watts 2446.5 BTU per hour 8588.5% @ 115 VAC 86.590.5% @ 230 VAC

Does not include the power supply handle or ejection tab

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5.7 Energy Smart Enablement

The 11G family of PowerEdge servers implements aspects of Dells Energy Smart strategy. This strategy offers the following: Energy Smart components on a portfolio level, such as high-capacity and Energy Smart power supplies Systems with either a lowest power footprint configuration or a best performance per watt configuration Energy Smart components (such as DIMMs or hard drives) selected without cherry picking or screening individual manufacturers components based on energy consumption

5.8 Energy Star Compliance

ENERGY STAR qualified configurations can be accessed from the ENERGY STAR Compliance results landing page on Dell.com.

5.9 Acoustics
The acoustical design of the PowerEdge R610 reflects adherence to Dells high sound quality standards. Sound quality is different from sound power level and sound pressure level in that it describes how humans respond to annoyances in sound, like whistles, hums, etc. One of the sound quality metrics in the Dell specification is prominence ratio of a tone as shown in Table 7. Table 7.
Typical Configuration @ 23 2 C CPUs 2 HDDs 4 Power Supplies 2 Optical Drive 1 Operating Mode Idle Stressed

Acoustical Performance
LWA-UL (Bels) 5.3 5.3 LpA (dBA) 35 35 Prominent tones None None

The acoustical specification for the R610 is Category II-D. Definitions Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity. Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6. The software SPECPower_ssj2008 is utilized to stress the processors. SPECPower is set to 50% loading. LwA UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in accordance to ISO 7779 (1999). LpA: Average bystander A-Weighted sound pressure level. The system is placed in a rack with its bottom at 25 cm from the floor. The acoustic transducers are at the four bystander positions, ref ISO7779 (1999) Section 8.6.2. Prominent tone: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if discrete tones are prominent. The system is placed in a rack with its bottom at 75 cm from the floor. The acoustic transducer is at front bystander position, ref ISO7779 (1999) Section 8.6.2.

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Processors

6.1 Overview
The Intel Xeon processor 5500 and 5600 series 2S is the microprocessor designed specifically for servers and workstation applications. The Intel Xeon processor 5500 series features quad-core processing to maximize performance and performance/watt for datacenter infrastructures and highly dense deployments. The Intel 5600 series features six-core processing, offering enhanced systemlevel performance, virtualization, and energy efficiency. The Intel Xeon processor 5500 and 5600 series also feature Intels Core micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and operating systems. The Intel Xeon processor 5500 and 5600 series uses a 1366-contact Flip-Chip Land Grid Array (FCLGA) package that plugs into a surface mount socket. The PowerEdge R610 provides support for up to two processors. Table 8.
Feature # Cores Last Level Cache Multi-processor support

Intel Xeon 5500 and 5600 Processor Series Features

5500 Series 4 8MB shared 12 Processors 5600 Series 6 12MB shared 1-2 Processors

Front Side Bus (FSB) (MT/s)/ Link Frequency (GT/s) Max Thermal Design Power (TDP) Max Frequency Memory Controller

Up to 6.4 GT/s

Up to 6.4 GT/s

130W (workstation) 95W (server) >3GHz Integrated 3-channel DDR3

130W (workstation) 95W (server) >3GHz Integrated 3-channel DDR3

Process Technology Intel Trusted Execution Technology Intel Advanced Encryption Security- New Instructions

45nm No

32nm Yes

No

Yes

Intel Virtualization Technology Intel 64

Yes

Yes

Yes

Yes

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Feature Intel Hyper-Threading Technology Socket 5500 Series Yes 5600 Series Yes

LGA1366

LGA1366

6.2 Features
Key features of the Intel Xeon processor 5500 and 5600 series include: Two, four, or six cores per processor Two point-to-point QuickPath Interconnect links at 6.4 GT/s 1366-pin FC-LGA package 32 nm and 45 nm process technology No termination required for non-populated processors (must populate CPU socket 1 first) Integrated QuickPath DDR3 memory controller 64-byte cache line size RISC/CISC hybrid architecture Compatible with existing x86 code base MMX supportExecute Disable Bit Intel Wide Dynamic Execution Ability to executes up to four instructions per clock cycle Simultaneous Multi-Threading (SMT) capability Support for CPU Turbo Mode (on certain processors)increases processor frequency if operating below thermal, power, and current limits for streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4 Intel 64 Technology Intel VT-x and VT-d Technology for virtualization support Enhanced Intel SpeedStep Technology Demand-based switching for active processor power management as well as support for ACPI P-States, C-States and T-States Support for DDR3L, 1.35v DIMMs for even lower system power (5600 series) Support for memory sparing (5600 series) AES-NI (hardware encryption assist) for more efficient encryption for uses such as online transactions SSL (5600 series) Intel TXT (Trusted Execution Technology) provides hardware assisted protection against emerging software attacks (5600 series)

6.3 Supported Processors

For the latest information on supported processors for the PowerEdge R610, visit Dell.com. Table 9.
Model X5680 X5670 X5660 X5650 L5640 Speed 3.33GHz 2.93GHz 2.80GHz 2.66GHz 2.26GHz

Supported Processors
Power 130W 95W 95W 95W 60W Cache 12M 12M 12M 12M 12M Cores 6 6 6 6 6 QPI Speed 6.4GT/s 6.4GT/s 6.4GT/s 6.4GT/s 5.86GT/s

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Model X5677 X5667 E5640 E5630 L5630 E5620 L5609 X5560 E5530 L5520 E5507 E5506 E5503 Speed 3.46GHz 3.06GHz 2.66GHz 2.53GHz 2.13GHz 2.40GHz 1.86GHz 2.80GHz 2.40GHz 2.26GHz 2.26GHz 2.13GHz 2.00GHz Power 130W 95W 80W 80W 40W 80W 40W 95W 80W 60W 80W 80W 80W Cache 12M 12M 12M 12M 12M 12M 12M 8M 8M 8M 4M 4M 4M Cores 4 4 4 4 4 4 4 4 4 4 4 4 2 QPI Speed 6.4GT/s 6.4GT/s 5.86GT/s 5.86GT/s 5.86GT/s 5.86GT/s 4.8GT/s 6.4GT/s 5.86GT/s 5.86GT/s 4.8GT/s 4.8GT/s 4.8GT/s

6.4 Processor Configurations

6.4.1 Single Processor Configuration
The PowerEdge R610 is designed so that a single processor placed in the CPU1 socket functions normally. The system will halt during power-on self-test (POST) if a single processor is placed in the CPU2 socket. If using a single processor, the R610 requires a heatsink blank in the CPU2 socket for thermal reasons.

6.4.2

Processor Power Voltage Regulation Modules (EVRD 11.1)

Voltage regulation to the Intel Xeon processor 5500 and 5600 series 2S is provided by EVRD (Enterprise Voltage Regulator-Down). EVRDs are embedded on the planar. Processor core voltage is not shared between processors. EVRDs support static phase shedding and power management via the PMBus.

6.5 Processor Installation

Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge R610 Systems Hardware Owners Manual on Support.dell.com for processor installation and removal instructions.

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Memory

7.1 Overview
The PowerEdge R610 uses DDR3 memory, providing a high-performance, high-speed memory interface capable of low latency response and high throughput. The R610 supports Registered ECC DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM). The system contains 12 memory sockets split into two sets of six sockets, one set per each processor. Each six-socket set is organized into three channels of two memory sockets per channel. Key features of the PowerEdge R610 memory system include: Registered (RDIMM) and Unbuffered (UDIMM) ECC DDR3 technology Support for up to 192 GB of RDIMM memory (twelve 16 GB RDIMMs) Support for up to 24 GB of UDIMM memory (twelve 2 GB UDIMMs) 64 data and eight ECC bits per channel Support for 1066/1333 MT/s single- and dual- rank DIMMs Support for 1066 MT/s quad-rank DIMMs Support for 1.35V low voltage (LV) DIMMs with 5600 series processors Support for single DIMM configuration (DIMM in socket A1 only) Support for ODT (On Die Termination) clock gating (CKE) to conserve power when DIMMs are not accessed (DIMMs enter a low power self-refresh mode) I2C access to SPD EEPROM for access to RDIMM thermal sensors Single Bit Error Correction SDDC (Single Device Data Correction, x4 or x8 devices) Support for Closed Loop Thermal Management on RDIMMs and UDIMMs Multi Bit Error Detection Support for Memory Optimized Mode Support for Advanced ECC mode Support for Memory Mirroring Support for Memory Sparing with 5600 series processors

7.2 DIMMs Supported

The DDR3 memory interface consists of three channels with up to two RDIMMs or UDIMMs per channel for single or dual rank and up to two RDIMMs per channel for quad rank. The interface uses 2 GB, 4 GB, 8 GB, or 16 GB RDIMMs. Also supported are 1 GB or 2 GB UDIMMs.

7.2.1

Memory Modes

The memory mode is dependent on how the memory is populated in the system, according to the following configurations: Three channels per processor populated identically Dual-processor configuration with the memory configurations for each processor being identical o Typically, the system will be set to run in Memory Optimized (Independent Channel) mode in this configuration. o This mode offers the most DIMM population flexibility and system memory capacity, but offers the least number of RAS (reliability, availability, service) features. o Memory modules are installed in numeric order for the sockets beginning with A1 or B1. PowerEdge R610 Technical Guide 28

Dell The first two channels per processor populated identically with the third channel unused o Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by having the cache line split across both channels. o This mode provides improved RAS features (SDDC support for x8-based memory). o For memory mirroring, two channels operate as mirrors of each other (writes go to both channels and reads alternate between the two channels). o For Memory Mirroring or Advanced ECC Mode, the three sockets farthest from the processor are unused and memory modules are installed beginning with socket A2 or B2, proceeding in the following order: A2, A3, A5, and A6. One channel per processor populated o This is a simple Memory Optimized mode. o Mirroring is not supported.

7.2.2

DIMM Population Rules

If DIMMs of different speeds are mixed, all channels will operate at the fastest common frequency. RDIMMs and UDIMMs cannot be mixed. If memory mirroring is enabled, identical DIMMs must be installed in the same slots across both channels. The third channel of each processor is unavailable for memory mirroring. The R610 supports up to 12 DIMMs. DIMMs must be installed in each channel starting with the DIMM slot farthest from the processor. Population order is identified by the silkscreen designator and the System Information Label (SIL) located on the chassis cover. DIMM slot population for each memory mode is listed as follows: o Memory Optimized: [1, 2, 3], [4, 5, 6] o Advanced ECC or Mirrored: [2, 3], [5, 6] o Quad Rank or UDIMM: [1, 2, 3], [4, 5, 6]

The following DIMM population rules apply:

7.3 Speed
The memory frequency is determined by a variety of inputs: Speed of the DIMMs Speed supported by the processor Configuration of the DIMMs For single- or dual-rank memory modules: o One memory module per channel supports up to 1333 MT/s o Two memory modules per channel supports up to 1066 MT/s For quad-rank memory modules: o One memory module per channel supports up to 1066 MT/s o Two memory modules per channel are limited to 800 MT/s, regardless of memory module speed

The memory speed of each channel depends on the memory configuration:

If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s). For quad-rank DIMMs mixed with single- or dual-rank DIMMs, the quad-rank DIMM must be installed in the slot with the white ejection tabs (the first DIMM slot in each channel). There is no requirement for the order of single- and dual-rank DIMMs. PowerEdge R610 Technical Guide 29

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7.4 DIMM Slots

The PowerEdge R610 has 12 DIMM slots for memory. It does not have any riser cards for DIMM population. The first DIMM slot in each channel is color-coded with white ejection tabs for ease of installation. The DIMM sockets are placed 450 mils (11.43 mm) apart, center-to-center to provide enough space for sufficient airflow to cool stacked DIMMs.

7.5 Low Voltage DIMMs

With the introduction of the Intel Xeon processor 5600 series, low voltage (LV) DIMMs have been added for selected memory configurations for the PowerEdge R610. Only this processor series supports operating DIMMs at the lower voltage (1.35V, also referred to as DDR3L). The Intel Xeon 5500 processor series does not support low voltage operation. However, due to the backwardscompatible nature of low voltage DIMMs, they can be operated at 1.5V. Therefore, DDR3L DIMMs can be used in systems with either processor series, and the platform will automatically choose the appropriate operating voltage based on the processor populated. DDR3L DIMMs will be qualified and available for use with Intel Xeon 5500 processor series mid-year 2011. Contact your Dell Sales Representative or visit Dell.com for more information. LV DIMMs operate at 1.35V, creating power savings vs. standard memory which operates at 1.5V. In order to achieve power savings, all DIMMs in the system must be of the LV type. If the system detects a mixture of standard and LV DIMMs, the BIOS will operate all memory at 1.5V. When operating at the lower voltage, additional frequency and population restrictions can take effect. For example, 3 DIMMs per channel operation is not supported at low voltage. The DDR3L standard is completely backwards-compatible at standard voltage. DDR3L DIMMs can operate at 1.5V without any limitations beyond standard voltage DDR3 DIMMs. As part of the addition of LV DIMMs, the platform has certain default behaviors. Whenever possible, if there is no performance degradation, the platform will default to 1.35V operation when using DDR3L DIMMs. In certain cases, where a configuration is populated that cannot support 1.35V or a performance degradation would result, the platform defaults to 1.5V operation. There are also options to override default voltage within allowed limits.

7.6 Mirroring
The R610 system supports memory mirroring if identical memory modules are installed in the two channels closest to the processor (memory not installed in the farthest channel). Mirroring must be enabled in the System Setup program. In a mirrored configuration, the total available system memory is one-half of the total installed physical memory.

7.7 Sparing
Systems with the Intel Xeon processor 5600 series support memory sparing. Sparing requires identical memory installed in all three channels. One of the three channels is considered the Spare Channel, and two-thirds of the total installed memory is usable and is the amount reported during POST and in BIOS setup.

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7.8 Memory Scrubbing

The R610 memory interface supports memory demand and patrol scrubbing, single-bit correction and multi-bit error detection. Correction of a x4 or x8 device failure is also possible with SDDC in the Advanced ECC mode. Additionally, correction of a x4 device failure is possible in the Memory Optimized mode.

7.9 Advanced ECC (Lockstep) Mode

In this configuration, the two channels closest to the processor are combined to form one 128-bit channel. This mode supports Single Device Data Correction (SDDC) for both x4- and x8-based memory modules. Memory modules must be identical in size, speed and technology in corresponding slots.

7.10 Optimizer (Independent Channel) Mode

In Optimizer (Independent Channel) mode, all three channels are populated with identical memory modules. This mode permits a larger total memory capacity but does not support SDDC with x8-based memory modules. A minimal single-channel configuration of 1 GB memory modules per processor is also supported in this mode.

7.11 Supported Configurations

See the System Memory section in the Installing System Components chapter in the Dell PowerEdge R610 Systems Hardware Owner's Manual on Support.dell.com.

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Chipset

The PowerEdge R610 planar incorporates the Intel Xeon 5500 processor series chipset for I/O and processor interfacing. This chipset is designed to support the Intel Xeon 5500 and 5600 processor series family, QuickPath Interconnect, DDR3 memory technology, and PCI Express Generation 2. The chipset consists of the Intel 5500 chipset I/O Hub (IOH) and ICH9.

8.1 Intel I/O Hub (IOH)

The planar uses the Intel 5500 chipset IOH to provide a link between the Intel Xeon processor series 5500 and 5600 processor(s) and the I/O components. The main components of the IOH consist of two full-width QuickPath Interconnect links (one to each processor), 24 lanes of PCI Express Gen2, a x4 Direct Media Interface (DMI), and an integrated IOxAPIC.

8.2 IOH QuickPath Interconnect (QPI)

The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the IOH. The R610 has a total of three QuickPath Interconnect (QPI) linksone link connecting the processors, and multiple links connecting both processors with the IOH. Each link consists of 20 lanes (full-width) in each direction with a link speed of 6.4 GT/s. An additional lane is reserved for a forwarded clock. Data is sent over the QPI links as packets. The QuickPath Architecture implemented in the IOH and processors features four layers: Physical layerThis layer consists of the actual connection between components. It supports Polarity Inversion and Lane Reversal for optimizing component placement and routing. Link layerThis layer is responsible for flow control and the reliable transmission of data. Routing layerThis layer is responsible for the routing of QPI data packets. Protocol layerThis layer is responsible for high-level protocol communications, including the implementation of a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence protocol.

8.3 IOH PCI Express

PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Generation 2 doubles the signaling bit rate of Generation 1 from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards-compatible with Gen1 transfer rates. The IOH has 24 PCI Express lanes. The lanes are partitioned as two x2 PCI Express Gen2 ports and eight x4 PCI Express Gen2 ports. The x2 ports can be combined as a x4 link; however, this x4 link cannot be combined with any of the other x4 ports. Two neighboring x4 ports can be combined as a x8 link and both resulting x8 links can combine to form a x16 link.

8.4 Intel I/O Controller Hub 9 (ICH9)

ICH9 is a highly integrated I/O controller, supporting the following functions: Six x1 PCI Express Gen1 ports, with the capability of combining ports 1-4 as a x4 link (R610 uses the x4 link for storage, the other two x1 lanes go unused) PCI Bus 32-bit Interface Rev 2.3 running at 33 MT/s Up to six Serial ATA (SATA) ports with transfer rates up to 300 MB/s (R610 supports one SATA port for an optional internal optical drive) Six UHCI and two EHCI (high-speed 2.0) USB host controllers, with up to 12 USB ports Four external USB ports and one internal USB port 32

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BIOS

9.1 Overview
The R610 BIOS is based on the Dell BIOS core and supports the following features: Intel Xeon 5500 and 5600 processor series 2S support Simultaneous Multi-Threading (SMT) support Processor Turbo Mode support PCI 2.3 compliant Plug and Play 1.0a compliant MP (Multiprocessor) 1.4 compliant Ability to boot from hard drive, optical drive, iSCSI drive, USB key, and SD card ACPI support Direct Media Interface (DMI) support PXE and WOL support for on-board NICs Memory mirroring support SETUP access through <F2> key at end of POST USB 2.0 (USB boot code is 1.1 compliant) F1/F2 error logging in CMOS Virtual KVM, CD, and floppy support UEFI 2.1 support Power management support, including DBS, Power Inventory, and multiple power profiles Intel TXT (5600 series) Intel AESNI (5600 series) BIOS language localization BIOS recovery after bad flash (can be recovered from iDRAC6 Express)

The R610 BIOS does not support the following:

9.2 Supported ACPI States

The Advanced Configuration and Power Interface is a standard interface for enabling the operating system to direct configuration and power management. The Intel Xeon processor 5500 and 5600 series supports the following C-States: C0, C1, C1E, C3, and C6. The R610 supports all of the available C-States.

9.3 I2C (Inter-Integrated Circuit)

I2C is a simple bi-directional two-wire bus for efficient inter-integrated circuit control. All I2C-bus compatible devices incorporate an on-chip interface which allows them to communicate directly with each other via the I2C bus. This design concept solves the many interfacing problems encountered when designing digital control circuits. These I2C devices perform communication functions between intelligent control devices (e.g., microcontrollers), general-purpose circuits (e.g., LCD drivers, remote I/O ports, memories) and application-oriented circuits.

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10 Embedded NICs/LAN on Motherboard (LOM)

The PowerEdge R610 has embedded Gigabit Ethernet Controllers with TCP Offload Engine (TOE) support. Two embedded Broadcom 5709C dual-port LAN controllers are on the R610 planar as independent Gigabit Ethernet interface devices. The following information details the features of the LAN devices: x4 PCI Express Gen2 capable interface (controller operated at Gen1 speed) Integrated MAC and PHY 3072x18 Byte context memory 64 KB receive buffer TOE (TCP Offload Engine) iSCSI controller (enabled through an optional hardware key) RDMA controller (RNIC) (enabled post-RTS through an optional hardware key) NC-SI (Network Controller-Sideband Interface) connection for manageability Wake-On-LAN (WOL) PXE 2.0 remote boot iSCSI boot IPv4 and IPv6 support Bare metal deployment support

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11 PCI Slots
11.1 Overview
The R610 has two PCI Express risers. The two PCIe risers provide two PCI Express expansion slots, which are detailed as follows: Two x8 PCIe Gen2 slots connected to the IOH One x4 PCIe Gen1 slot for dedicated for the integrated storage controller card on the Riser 1 connected to the ICH9 Support for full-height, half-length (6.6 max length) PCIe cards

To ensure proper cooling, only one of the two expansion cards can have a power consumption of greater than 15W (up to 25W maximum), not including the integrated storage controller. The system does not support hot-plug or hot-removal of PCI Express cards. For more information on installing expansion cards and expansion-card priority, see the Expansion Cards and Expansion-Card Risers section in the Installing System Components chapter of the Dell PowerEdge R610 Systems Hardware Owners Manual on Support.dell.com.

11.2 PCI Riser Restrictions

The following PCI riser restrictions apply for the R610: The riser connectors on the planar do not support plugging in a standard PCI Express card. Two R610 risers must be installed or the system will not power up.

11.3 Quantities and Priorities

Refer to the Expansion Cards and Expansion-Card Risers section in the Installing System Components chapter of the Dell PowerEdge R610 Systems Hardware Owners Manual on Support.dell.com.

11.4 PCI Card Dimensions

For information about PCIe slots and card dimensions, see the Expansion Cards and Expansion-Card Risers section in the Installing System Components chapter in the Dell PowerEdge R610 Systems Hardware Owners Manual on Support.Dell.com.

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12 Storage
12.1 Overview
The PowerEdge R610 has a single six-drive backplane that supports 2.5 drives. There are six hotswap capable Serial Attached SCSI (SAS) or Serial ATA (SATA) slots with two LED indicators per slot, two Mini-SAS cable connectors for connecting the backplane to the integrated storage controller, and a 14-pin power connector. Mixing SAS and SATA drives is supported.

12.2 Internal Hard Disk Drives

The R610 system supports up to six 2.5 hard disk drives. See Table 10 for information on supported hard drives. For the most up-to-date information on supported hard drives, visit Dell.com. Table 10.
Form Factor 2.5 2.5 2.5 2.5 2.5 2.5 Capacity 80GB, 160GB, 250GB, 500GB 500GB, 1TB 146GB, 300GB, 600GB 73GB, 146GB 50GB, 100GB 149GB

Supported Hard Drives

Speed 7.2K 7.2K 10K 15K N/A N/A Type SATA NL SAS SAS SAS SATA SSD SAS SSD

The following additional guidelines apply for hard-drive configurations: Hard drives require the 2.5 hard-drive carrier Up to six SAS or up to six SATA drives are supported For SAS and SATA mixing: o Two SAS and up to four SATA drives are allowed o Two SAS hard drives must be installed in slots 0 and 1 Limited SAS and SSD mixing is supported SSDs require the PERC 6/i or PERC H700 integrated storage controller card and cannot be mixed with any other type of hard drive

12.2.1 Hard Disk Drive Carriers

Hard drives must use the Dell 2.5 drive carrier. See Figure 8.

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Figure 8.

Dell 2.5 Hard Drive Carrier

12.2.2 Empty Drive Bays

For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling, maintain a uniform appearance to the unit, and provide EMI shielding.

12.2.3 Diskless Configuration Support

The system supports diskless configuration with no storage controller (SAS 6/iR, PERC 6i, PERC H200, or PERC H700) installed in the system. A 2.5 hard drive backplane is still installed in this configuration.

12.2.4 Hard Drive LED Indicators

Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the storage enclosure processor (SEP) device on the backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller. For more information, see the Hard-Drive Indicator Patterns section in the About Your System chapter in the Dell PowerEdge R610 Systems Hardware Owners Manual on Support.Dell.com.

12.3 RAID Configurations

See Table 11 for information on factory RAID configurations. For information on additional configurations, visit Dell.com. Table 11. Factory RAID Configurations
Non-Mixed Drives All SATA, all SAS, or all SSD All 2.5 Drives Config Type No HDD SAS or SATANo RAID Configs 0 1 NZC MSS Description No controller/No hard drive Integrated SAS/SATA (SAS 6/iR, PERC H200), No RAID Min HDD 0 1 Max HDD 0 6

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Non-Mixed Drives All SATA, all SAS, or all SSD All 2.5 Drives Config Type Configs 2 MSSR0 Description Integrated SAS/SATA RAID 0 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700) Integrated SAS/SATA RAID 1 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700) Integrated SAS/SATA RAID 5 (PERC 6/i, PERC H700) Integrated SAS/SATA RAID 10 (PERC 6/i, PERC H700) Integrated SAS/SATA RAID 0/RAID 0 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700) Integrated SAS/SATA RAID 1/RAID 1 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700) Integrated SAS/SATA RAID 1/RAID 5 (PERC 6/i, PERC H700) Integrated SAS/SATA RAID 1/RAID 10 (PERC 6/i, PERC H700) Integrated SAS/SATA RAID 6 (PERC 6/i, H700) Integrated SSD RAID 1 (PERC 6/i, PERC H200, H700) (SAS SSD with PERC H200, PERC H700 only) Integrated SSD RAID 5 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only) Integrated SSD RAID 10 (PERC 6/i, PERC H200, PERC H700) (SAS SSD with PERC H200, PERC H700 only) Integrated SATA SSD, No RAID (PERC H200) Min HDD 1 Max HDD 6

MSSR1

4 5 SAS or SATA RAID

MSSR5 MSSR10

3 4

6 6

MSSR0/R0

1+1

MSSR1/R1

2+2

2+2

8 9 10

MSSR1/R5 MSSR1/R10 MSSR6

2+3 2+4 4

2+4 2+4 6

16 SAS or SATA SSDs RAID

MSSR1

17

MSSR5

18 SATA SSDNo RAID

MSSR10

19

MSS

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Mixed SATA + SAS Min 2xSAS + 1xSATA Max 2xSAS + 4xSATA All 2.5 Drives Config Type SAS + SATANo RAID Configs 11 MSS-X Description Integrated SAS/SATA (SAS 6/iR), No RAID Integrated SAS/SATA RAID 0/RAID 0 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700) Integrated SAS/SATA RAID 1/RAID 1 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700) Integrated SAS/SATA RAID 1/RAID 5 (PERC 6/i, PERC H700) Integrated SAS/SATA RAID 1/RAID 10 (PERC 6/i, PERC H700) Min HDD Max HDD

12

MSSR0/R0-X

2+1

2+4

SAS + SATA RAID

13 14 15

MSSR1/R1-X MSSR1/R5-X MSSR1/R10-X

2+2 2+3 2+4

2+2 2+4 2+4

Mixed SATA SSD + SAS Min 2xSATA SSD + 2xSAS Max 2xSATA SSD + 4xSAS All 2.5 Drives Config Type Configs 20 SATA SSD + SAS RAID MSSR1/R1-X Description Integrated SSD/SAS RAID 1/RAID 1 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only) Integrated SSD/SAS RAID 1/RAID 5 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only) Integrated SSD/SAS RAID 1/RAID 10 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only) Min HDD Max HDD

2+2

2+2

21

MSSR1/R5-X

2+3

2+4

22

MSSR1/R10-X

2+4

2+4

12.4 Storage Controllers

12.4.1 SAS 6/iR
The R610 internal SAS 6/iR HBA is an expansion card that plugs into a dedicated PCI Express x8 slot (four lanes wired). It incorporates two four-channel SAS IOCs for connection to SAS or SATA hard disk drives. It is designed in a form factor that allows the same card to be used in the PowerEdge R610 and PowerEdge T610. PowerEdge R610 Technical Guide 41

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12.4.2

PERC 6/i

If you want an internal RAID solution, select the PERC 6/i or PERC H700. The PERC 6/i uses the LSI 1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory. A battery is also available for backup.

12.4.3

PERC H200

The H200 SAS HBA is an expansion card that plugs into the dedicated internal SAS slot on Riser1. It incorporates two four-channel 6 Gb/s SAS IOCs for connection to SAS hard disk drives. It is designed in a form factor that allows the same card to be used in other 11G 2U rack-form factor platforms.

12.4.4

PERC H700

If you want an internal RAID solution, select the PERC H700 or PERC 6/i. The PERC H700 card has its own processor with a PCI Express Gen2 host interface and DDR2 memory and installs into the dedicated internal SAS slot on Riser1. A battery is also available for backup. It supports the internal 6 Gb/s backplane interface for internal storage options (SAS, SATA, or SSD HDD). The PowerEdge R610 supports both 256MB and 512MB cache options on the internal H700. Table 12.
Product Usage Internal Backplane Storage RAID (HDD, SDD)

Storage Card Support Matrix

PowerEdge R610 Support Slot PCI Con PCI Bracket IO Con X4 int X4 int RAID Battery Backup

PERC 6/i Integrated (PERC H700)

YesMax 1

Storage slot

X8

No

0, 1, 5, 6, 10, 50, 60

Yes

PERC SAS/ SATA

PERC 6/E Adapter (PERC H800)

External SAS/SATA Storage

YesMax 1 PERC 6/E: (MD1000 and MD1120) PERC H800: (MD1200 and MD1220) YesMax 1 (MD1000)

PCIe slot

X8

Yes

X4 ext X4 ext

0, 1, 5, 6, 10, 50, 60

Yes

PERC 5/E Adapter

Legacy External storage Internal Backplane Storage (No tape or SSD support) External SAS (DAS, tape)

PCIe slot

X8

Yes

X4 ext X4 ext X4 int X4 int X4 ext X4 ext

0, 1, 5, 10, 50

Yes

SAS HBA SAS/ SATA

SAS 6/iR Integrated (PERC H200) SAS 5/E Adapter (SAS 6G HBA)

YesMax 1

Storage slot

X8

No

0, 1

No

Yes Max 1

PCIe slot

X8

Yes

None

No

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Product Usage Internal slimline SATA Optical (no HDD) External SCSI Tape/ Legacy External storage PowerEdge R610 Support Yes1 port for Optical YesMax 2 (No internal tape backup support) Slot PCI Con PCI Bracket IO Con RAID Battery Backup

ICH9

On planar via chipset

N/A

N/A

N/A

1x int

N/A

N/A

LSI 2032 SCSI

LSI 2032 Adapter

PCIe slot

X4

Yes

1x int 1x ext

N/A

N/A

12.5 Optical Drives

Optical drives are optional in all PowerEdge R610 systems and connect to the planar through the SATA interface. The following internal slimline drives are available on the PowerEdge R610: DVD-ROM DVD+RW

If an optical drive is not ordered with the system, a blank is installed in its place.

12.6 Tape Drives

External tape drives and tape libraries are supported. For more information on supported tape drives and tape libraries, see http://www.dell.com/storage.

12.7 External Storage Support

External storage devices are supported. For more information, see http://www.dell.com/storage.

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13 Video
The PowerEdge R610 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an integrated video subsystem, connected to the 32-bit PCI interface of the ICH9. This logic is based on the Matrox G200. The device only supports 2D graphics. The video device outputs are multiplexed between the front and rear video ports. If a monitor is connected to the front video connector, it will take precedence over the rear connection, thereby removing the display from the rear connection. The integrated video core shares its video memory with the iDRAC6s 128 MB DDR2 application space memory. This memory is also used for the KVM buffer. The resolutions supported are listed in Table 13. Table 13.
Resolution 640 x 480 800 x 600 1024 x 768 1152 x 864 1280 x 1024 1280 x 1024

Graphics Video Modes

Refresh Rate (Hz) 60, 72, 75, 85 56, 60, 72, 75, 85 60, 72, 75, 85 75 60, 75, 85 60 Color Depth (bit) 8, 16, 32 8, 16, 32 8, 16, 32 8, 16, 32 8, 16 32

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14 Rack Information
14.1 Overview
The ReadyRails sliding and static rail systems for the R610 provide tool-less support for racks with square or unthreaded round mounting holes including all generations of Dell racks. The static rails also offer tooled mounting support for 4-post threaded and 2-post (Telco) racks for added versatility. The optional cable management arm (CMA) can be mounted on either the left or right side of the sliding rails without the use of tools for fast and easy deployment. The R610 is not compatible with any other Dell rails including previous generation rails, but it does use the same static rails as the R710. The CMA is not supported on racks that are less than 1 m in depth, including Dells 4200 and 2400 racks.

14.2 Rails
The rail offerings for the R610 consist of two types: sliding and static. The sliding rails allow the system to be fully extended out of the rack for service and are available with or without the optional cable management arm (CMA).

Figure 9.

R610 Sliding Rails with Optional CMA

The static rails support a wider variety of racks than the sliding rails but do not support serviceability in the rack and are thus not compatible with the CMA.

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Figure 10. R610 Static Rails One key factor in selecting the proper rails is identifying the type of rack in which they will be installed. Both the sliding rails and the static rails support tool-less mounting in 19-wide, EIA-310-E compliant square hole and unthreaded round hole racks via the ReadyRails mounting interface, but only the static rails, as the more generic or universal solution, support mounting in threaded hole and 2-post (Telco) racks. Table 14.
Product Rail ID A1 A2 Mounting Interface

Supported Racks
Rail Type Sliding Static Rack Types Supported 4-Post Square Round Thread 2-Post Flush Center

R610

ReadyRails ReadyRails/Generic

Screws are not included in the static rail kit because the threaded racks are offered with a variety of thread designations. Users must provide their own screws when mounting the static rails in threaded or 2-post racks. Other key factors governing proper rail selection include the spacing between the front and rear mounting flanges of the rack, the type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs), and the overall depth of the rack. See Table 15. Due to their reduced complexity and lack of need for CMA support, the static rails offer a greater adjustability range and an overall smaller footprint than the sliding rails.

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Product Rail ID A1 R610 A2 Mounting Interface ReadyRails ReadyRails/ Generic

Rail Adjustability Ranges and Depth

Rail Type Sliding Static Rail Adjustability Range (mm) Square Min 692 588 Max 756 828 Round Min 678 574 Max 749 821 Threaded Min 592 Max 846 Rail Depth (mm) Without CMA 768 608 With CMA 887

The adjustment range of the rails is a function of the type of rack in which they are being mounted. The min-max values listed above represent the allowable distance between the front and rear mounting flanges in the rack. Rail depth represents the minimum depth of the rail as measured from the rack front mounting flanges when the rail rear bracket is positioned all the way forward.

14.3 Cable Management Arm (CMA)

The optional cable management arm (CMA) for the R610 organizes and secures the cords and cables exiting the back of the server and unfolds to allow the server to extend out of the rack without having to detach the cables. Some key features of the R610 CMA include: Large U-shaped baskets support dense cable loads. An open vent pattern allows for optimal airflow. The CMA mounting is fully-reversible (can be mounted on either side) with no conversion required. Hook-and-loop straps are used rather than plastic tie wraps to eliminate the risk of cable damage during cycling. A low-profile fixed tray is provided to both support and retain the CMA in its fully closed position. The CMA and the tray mount without the use of tools using simple and intuitive snap-in designs.

14.4 Rack View

The R610 sliding rails are a drop-in design, meaning that the system is installed vertically into the rails by inserting the shoulder nuts on the sides of the system into the J-slots in the inner rail members with the rails in the fully extended position. See Figure 11.

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Figure 11. R610 Mounted in the A1 Sliding Rails The CMA can be mounted to either side of the rails without the use of tools or the need for conversion, but it is recommended that it be mounted on the side opposite the power supplies to allow easier access to the power supplies for service or replacement. See Figure 12.

Figure 12. R610 Mounted in the B1 Sliding Rails with the CMA The R610 static rails essentially behave like a fixed shelf. The system is installed by first resting the back of the system on the inner ledges of the rail front brackets, then pushing the system forward while ensuring that the shoulder nuts on the sides of the system are properly engaged in the horizontal slots on the rails. See Figure 13.

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Figure 13. R610 Mounted in the A2 Static Rails (2-post Center Mount Configuration)

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15 Operating Systems
For detailed information, see the following:

Operating System Support Matrix for Dell PowerEdge Systems on www.Dell.com Dell PowerEdge R610 Systems Getting Started With Your System guide on Support.Dell.com

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16 Systems Management
16.1 Overview
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell developed systems management solutions gives you choice and flexibility, so you can simplify and save in IT environments of any size. To help you meet your server management demands, Dell offers Dell OpenManage systems management solutions for: Deployment of one or many servers from a single console Monitoring of server and storage health and maintenance Update of system, operating system, and application software Dell offers IT management solutions for organizations of all sizespriced and sized appropriately and supported comprehensively.

16.2 Server Management

A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included with the product. ISO images are also available. A brief description of available content:

Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in OS install and pre-OS hardware configuration and updates. Server Update Utility (SUU): This DVD has an inventory tool for managing updates to firmware, BIOS, and drivers for either Linux or Microsoft Windows varieties. OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool provides a comprehensive, one-to-one (one console to one server) systems management solution, designed for system administrators to manage systems locally and remotely over a network. OMSA allows system administrators to focus on managing their entire network. Management Console: Dell IT Assistant (ITA) is also included, as well as tools to allow access to our remote management products. These tools are Remote Access Service for iDRAC and the Baseboard Management Controller (BMC) Utility. Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension snap-in to the Microsoft Active Directory. This allows you to manage Dell specific Active Directory objects. The Dell-specific schema class definitions and their installation are also included on the DVD. Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update your system. eDocs: The section includes PDF files for PowerEdge systems, storage peripherals, and OpenManage software. Dell Management Console (DMC): The Dell Management Console is a systems management console that enables systems administrators to discover and inventory devices on your network. It provides functions such as health and performance monitoring of networked devices, and patch management capabilities for Dell systems. DMC differs from the IT Assistant management console (described above) in that with DMC, value-add plug-ins that enable advanced functionality can be purchased and added to the base DMC product.

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16.3 Embedded Server Management

The PowerEdge R610 implements circuitry for the next generation of Embedded Server Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC (Integrated Dell Remote Access Controller) is responsible for acting as an interface between the host system and its management software and the periphery devices. iDRAC6 provides features for managing the server remotely or in data center lights-out environments. Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.

16.4 Dell Lifecycle Controller and Unified Server Configurator

Embedded management is comprised of interdependent pieces:

Dell Lifecycle Controller Unified Server Configurator iDRAC6

Dell Lifecycle Controller powers the embedded management features. It is integrated and tamperproof storage for system-management tools and enablement utilities (firmware, drivers, etc.). Lifecycle Controller enables pre-OS server deployment, OS installation, platform updates, platform configuration, and diagnostics capabilities. Dell Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key within 10 seconds of the Dell logos appearance during the system boot process. Current functionality enabled by the Unified Server Configurator includes those shown in Table 16. Table 16.
Feature Faster O/S Installation Faster System Updates

Unified Server Configurator Features and Description

Description Drivers and the installation utility are embedded on system, so no need to scour Dell.com Integration with Dell support automatically directed to latest versions of the Unified Server Configurator, iDRAC, RAID, BIOS, NIC, and Power Supply Ability to recover to previous known good state for all updatable components Diagnostic utilities are embedded on system Detects RAID controller and allows user to configure virtual disk and choose virtual disk as boot device, eliminating the need to launch a separate utility. Also provides configuration for iDRAC, BIOS, and NIC/LOM.

Update Rollback More Comprehensive Diagnostics Simplified Hardware Configuration

16.5 Integrated Dell Remote Access Controller

The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet straightforward management of remote servers, by delivering as if you are there presence and control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s), whether that server is located in a different room, a different building, a different city, or in a PowerEdge R610 Technical Guide 52

Dell different country. iDRAC6 is a purchasable option and is available as three offerings: iDRAC6 Express, iDRAC6 Enterprise, and Virtual Flash (vFlash) media:

iDRAC6 Express is most appropriate for SMB customers with limited remote management needs. iDRAC6 Enterprise is appropriate for large data center customers with distributed servers. iDRAC6 with vFlash Media is provided for large enterprise customers with requirements for system management automation.

16.6 iDRAC6 Express

The iDRAC6 Express is standard on the PowerEdge R610. In addition to providing a Lifecycle Controller, the iDRAC6 Express offers the following key features: Standard-based interfaces Server Sensor monitoring and fault alerting Secure operation of remote access functions including authentication, authorization, and encryption Power control and management with the ability to limit server power consumption and remotely control server power states Advanced troubleshooting capabilities For more information on iDRAC6 Express features see Table 17.

Graphical web interface

16.7 iDRAC6 Enterprise

The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6 Enterprise connects directly to the R610 planar and is mounted parallel to the planar with stand-offs. Key features for the iDRAC6 Enterprise include: Scripting capability with Dells racadm command line Remote video, keyboard, and mouse control with Virtual Console Remote media access with Virtual Media Dedicated network interface

16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media

The iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is an 8GB Dell branded SD card that enables a persistent 256 MB virtual flash partition. The vFlash Media delivers the following key features: Support for 8GB SD storage media

Can be used as a repository for a pre-OS image, eliminating the need to maintain a network infrastructure for OS deployment Can also be used for permanent diagnostics image for use after system failures, or permanent failsafe image for periodic configuration changes

A more detailed feature list for iDRAC6 Express, iDRAC6 Enterprise, and vFlash Media is shown in Table 17.

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Base Management Functionality iDRAC6 Express iDRAC6 Enterprise vFlash Media Feature

Interface and Standards Support IPMI 2.0 Web-based GUI SNMP WSMAN SMASH-CLP Racadm commandline Conductivity Shared/Failover Network Modes IPv4 VLAN Tagging IPv6 Dynamic DNS Dedicated NIC Security and Authentication Role-based Authority Local Users Active Directory SSL Encryption Remote Management and Remediation Remote Firmware Update Server power control Serial-over-LAN (with proxy) Serial-over-LAN (no proxy) Power capping Last crash screen capture Boot capture

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Feature Base Management Functionality iDRAC6 Express iDRAC6 Enterprise vFlash Media

Serial-over-LAN Virtual media Virtual console Virtual console sharing Virtual flash Monitoring Sensor Monitoring and Alerting Real-time Power Monitoring Real-time Power Graphing Historical Power Counters Logging Features System Event Log RAC Log Trace Log

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17 Peripherals
The R610 supports the following USB devices:

DVD (bootable; requires two USB ports) USB key (bootable) Keyboard (only one USB keyboard is supported) Mouse (only one USB mouse is supported)

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Appendix A.

Certifications

A.1 Regulatory Certifications

Regulatory compliance certificates can be located at the following sites: http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance /dec_conform?c=us&l=en&s=corp

A.2 Product Safety Certifications

The product has been certified and bears the Mark, as applicable, of the Product Safety authorities as indicated in Table 18. Table 18. Product Safety Certifications
Authority or Mark
IRAM BELLIS SCC CNCA or CCC KONCAR CE TUV IECEE CB SII OTAN CKT KEBS KUCAS NYCE or NOM INSM SONCAP NEMKO GOST KSA ICCP NRCS BSMI UKRTEST or UKRSERTCOMPUTER NRTL STZ

Country/Region
Argentina Belarus Canada China Croatia European Union Germany IECEE Israel Kazakhstan Kenya Kuwait Mexico Moldova Nigeria Norway Russia Saudi Arabia South Africa Taiwan Ukraine United States Uzbekistan

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A.3 Electromagnetic Compatibility

The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated in Table 19. Table 19.
Country/Region
Australia/New Zealand Belarus Bosnia & Herzegovina, Montenegro, Serbia Canada China Croatia European Union Israel Japan Kazakhstan Moldova Norway Russia South Africa South Korea Taiwan Ukraine United States Uzbekistan Vietnam

Electromagnetic Compatibility Certifications

Authority or Mark
ACMA or C-Tick Class A BELLIS KVALITET ICES CNCA or CCC KONCAR CE SII VCCI OTAN CKT INSM NEMKO GOST SABS KCC BSMI UKRTEST or UKRSERTCOMPUTER FCC STZ ICT Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A Class A

Class

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A.4 Ergonomics, Acoustics and Hygienics

The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and Hygienics authorities as indicated in Table 20. Table 20. Ergonomics, Acoustics and Hygienics
Authority or Mark BELLIS GS GOST

Country/Region Belarus Germany Russia

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Appendix B.

Additional Information and Options

Table 21. Industry Standards

The PowerEdge R610 system conforms to the industry standards detailed in Table 21.

Standard ACPI Advance Configuration and Power Interface Specification, v2.0c Energy Star EPA Version 1.0 of the Computer Server specification Ethernet IEEE 802.3-2005 IPMI Intelligent Platform Management Interface, v2.0 DDR3 Memory DDR3 SDRAM Specification, Rev. 3A LPC Low Pin Count Interface Specification, Rev. 1.1 PCI Express PCI Express Base Specification Rev. 2.0 PMBus Power System Management Protocol Specification, v1.1 SAS Serial Attached SCSI, v1.1 SATA Serial ATA Rev. 2.6; SATA II, Extensions to SATA 1.0a, Rev. 1.2 SMBIOS System Management BIOS Reference Specification, v2.6 TPM Trusted Platform Module Specification, v1.2

URL for Information and Specifications http://www.acpi.info/

http://www.energystar.gov/index.cfm?c=archives.enterprise _servers http://standards.ieee.org/getieee802/802.3.html http://www.intel.com/design/servers/ipmi/

http://www.jedec.org/download/search/JESD79-3A.pdf

http://developer.intel.com/design/chipsets/industry/lpc.ht m http://www.pcisig.com/specifications/pciexpress/

http://pmbus.info/specs.html

http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf http://sata-io.org/

http://www.dmtf.org/standards/smbios/

http://www.trustedcomputinggroup.org/resources/tpm_mai n_specification

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Standard UEFI Unified Extensible Firmware Interface Specification, v2.1 USB Universal Serial Bus Specification, Rev. 2.0 Windows Logo Windows Logo Program System and Device Requirements, v3.10 URL for Information and Specifications http://www.uefi.org/specs/

http://www.usb.org/developers/docs/

http://www.microsoft.com/whdc/winlogo/hwrequirements. mspx

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