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A KD V: ECE449-Microdevices and Micromachining Technology Spring 2016

This document discusses the design of a microdevice actuator. It includes calculating the spring constant of the actuator given design parameters such as snap-down voltage and beam dimensions. It also calculates the minimum separation between etch holes needed during the release process. A layout is then designed that incorporates the calculated dimensions. Finally, the resonant frequency of the out-of-plane undamped actuator is calculated.

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ShashankRajoria
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25 views

A KD V: ECE449-Microdevices and Micromachining Technology Spring 2016

This document discusses the design of a microdevice actuator. It includes calculating the spring constant of the actuator given design parameters such as snap-down voltage and beam dimensions. It also calculates the minimum separation between etch holes needed during the release process. A layout is then designed that incorporates the calculated dimensions. Finally, the resonant frequency of the out-of-plane undamped actuator is calculated.

Uploaded by

ShashankRajoria
Copyright
© © All Rights Reserved
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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ECE449- Microdevices and Micromachining Technology

Spring 2016

a) Snap-down Voltage:

Ved

8 kd 3
27 A

Now, we know snap-down voltage= 12 V

d 1m
A 100 m 100 m 10 8 m 2

8.854 10 12
k

F/m

27 A 2
Ved
8 d3

Then,

27 8.85 10 12 10 8 2
k
12
8
10 6 3
k 43.011

Or,
N/m
Now,
Spring constant of equivalent cantilever beam

k eq 4 k sin gle
4

12 EI
L3

12 E t 3 w
L3 12

43.011 4

12 160 10 9 1.5 10
12
10 12

w 43.011

6 3

(Since,

10 12
12
9
4 12 160 10 1.5 10 6

t 3w
12

w=19.91
m

b) [20 points] Hydrofluoric Acid (HF) will be used to release the fabricated structure. Assume an
etchrate of 3 m/min. Given a safety factor of 2, calculate the minimum separation between etch
holes if the HF immersion is to be limited to a maximum of 10 min. Maximum distance between
etch holes;

Shashank Rajoria

Page 2

ECE449- Microdevices and Micromachining Technology


Spring 2016

2 Re t e

2 3 10 6 (10 60)
2

2 3 10 6 (10)
2

a 30 10 6

a =30 m
m
Maximum separation,
Minimum separation between etch holes, is 2m.
c) [20 points] Draw a layout design of the actuator that conforms to the design parameters calculated
in a) and b) and parameters and process from Figs. 1 and 2. You are welcome to use L-Edit or
Power Point
All dimensions are in micro meters
Anchor Hole: 5m x 5m
Overlaps: 3m

d) [10 points] Due to processing constraints, positive photoresist will be used when patterning SiO2.
Draw the mask layout for mask layer 1 (anchor etch), illustrating the chrome on the mask for that
layer.
Mask layer 1 (anchor etch) with positive photoresist:

Shashank Rajoria

Page 3

ECE449- Microdevices and Micromachining Technology


Spring 2016

e) [20 G.C.] Calculate the out-of-plane undamped resonant frequency of the actuator. Neglect the
mass of the beams, as well as the effects of the etch release holes.

fr

1
2

k
m

Resonant frequency,

m V wA
Mass of actuator,

m 2000 10 6 10 8 kg
m 2 10 11 kg

fr

1
2

43.011
2 10 11

Then,
fr =233.4kHz
fr =233.4kHz

Shashank Rajoria

Page 4

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