NAND Flash Code Information(1/3)

Last Updated : August 2009

K9XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

1. Memory (K) 6. Technology

0 : Normal (x8) 1 : Normal (x16)
2. NAND Flash : 9 C : Catridge SIP D : DDR
M : moviNAND N : moviNAND FAB
3. Small Classification P : moviMCP T : Premium eSSD
Z : SSD
(SLC : Single Level Cell, MLC : Multi Level Cell,
SM : SmartMedia, S/B : Small Block) 7. Organization
1 : SLC 1 Chip XD Card 0 : NONE 8 : x8
2 : SLC 2 Chip XD Card 6 : x16
3 : 4bit MLC Mono
4 : SLC 4 Chip XD Card
8. Vcc
5 : MLC 1 Chip XD Card
A : 1.65V~3.6V B : 2.7V (2.5V~2.9V)
6 : MLC 2 Chip XD Card
C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V ~ 2.9V)
7 : SLC moviNAND
E : 2.3V~3.6V R : 1.8V (1.65V~1.95V)
8 : MLC moviNAND
Q : 1.8V (1.7V ~ 1.95V) T : 2.4V~3.0V
9 : 4bit MLC ODP
S : 3.3V (3V~3.6V/ VccQ1.8V (1.65V~1.95V)
A : 3bit MLC MONO
U : 2.7V~3.6V V : 3.3V (3.0V~3.6V)
B : 3bit MLC DDP
W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE
C : 3bit MLC QDP
F : SLC Normal
9. Mode
G : MLC Normal
H : MLC QDP 0 : Normal
K : SLC Die Stack 1 : Dual nCE & Dual R/nB
L : MLC DDP 3 : Tri /CE & Tri R/B
M : MLC DSP 4 : Quad nCE & Single R/nB
N : SLC DSP 5 : Quad nCE & Quad R/nB
O : 3bit MLC ODP 6 : 6 nCE & 2 RnB
P : MLC ODP 7 : 8 nCE & 4 RnB
Q : SLC ODP 8 : 8 nCE & 2 RnB
R : MLC 12-die stack 9 : 1st block OTP
S : MLC 6 Die Stack A : Mask Option 1
T : SLC SINGLE (S/B) L : Low grade
U : MLC 16 Die Stack
W : SLC 4 Die Stack 10. Generation
M : 1st Generation
A : 2nd Generation
4~5. Density
B : 3rd Generation
12 : 512M 16 : 16M 28 : 128M
C : 4th Generation
32 : 32M 40 : 4M 56 : 256M
D : 5th Generation
64 : 64M 80 : 8M 1G : 1G
E : 6th Generation
2G : 2G 4G : 4G 8G : 8G
Y : 25th Generation
AG : 16G BG : 32G CG : 64G
Z : 26th Generation
DG : 128G EG : 256G FG : 256G
GG : 384G HG : 512G LG : 24G
NG : 96G ZG : 48G 00 : NONE

-1- Part Number Decoder

NAND Flash Code Information(2/3)
Last Updated : August 2009

K9XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

11. "─" 14. Customer Bad Block

B : Include Bad Block
12. Package D : Daisychain Sample
8 : TSOP1 (Lead-Free, Halogen-Free, CU) K : Special Handling
9 : 56TSOP1 (Lead-Free, Halogen-Free, CU) L : 1~5 Bad Block
A : COB N : ini. 0 blk, add. 10 blk
B : FBGA (Halogen-Free, Lead-Free) S : All Good Block
D : 63-TBGA 0 : NONE (Containing Wafer, CHIP, BIZ, Exception
E : ISM (Lead-Free, Halogen-Free) handling code)
F : WSOP (Lead-Free) G : FBGA
H : BGA (Lead-Free, Halogen-Free)
15. Pre-Program Version
I : ULGA (Lead-Free) (12*17)
0 : None
J : FBGA (Lead-Free)
Serial (1~9, A~Z)
K : ULGA (Lead-Free, Halogen-Free) (12*17)
L : ULGA (Lead-Free, Halogen-Free) (14*18)
M : 52-ULGA (Lead-Free, Halogen-Free) (13*18)
P : TSOP1 (Lead-Free)
Q : TSOP2 (Lead-Free)
R : 56-TSOP1 (Lead-Free, Halogen-Free)
S : TSOP1 (Lead-Free, Halogen-Free)
T : WSOP (Lead-Free, Halogen-Free)
U : COB (MMC)
V : WSOP W : Wafer
Y : TSOP1 Z : WELP (Lead-Free)

13. Temp
C : Commercial I : Industrial
S : SmartMedia
B : SmartMedia BLUE
0 : NONE (Containing Wafer, CHIP, BIZ, Exception
handling code)

-2- Part Number Decoder

NAND Flash Code Information(3/3)
Last Updated : August 2009

K9XXXXXXXX - XXXXXXX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

16. Packing Type

- Common to all products, except of Mask ROM
- Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately)

Divide Packing Type New Marking

TAPE & REEL T
Component Other ( Tray, Tube, Jar ) 0 ( Number)
Stack S
MODULE TAPE & REEL P
Module
MODULE Other Packing M

17~18. Customer "Customer List Reference"

-3- Part Number Decoder