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Irf 830

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94 views

Irf 830

Uploaded by

Ehb Ergloc
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PDF, TXT or read online on Scribd
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IRF830

N - CHANNEL 500V - 1.35 - 4.5A - TO-220 PowerMESH MOSFET

TYPE IRF830
I I I I I

V DSS 500 V

R DS(on) < 1.5

ID 4.5 A

TYPICAL RDS(on) = 1.35 EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED VERY LOW INTRINSIC CAPACITANCES GATE CHARGE MINIMIZED
2 3

DESCRIPTION This power MOSFET is designed using the companys consolidated strip layout-based MESH OVERLAY process. This technology matches and improves the performances compared with standard parts from various sources. APPLICATIONS I HIGH CURRENT, HIGH SPEED SWITCHING I SWITH MODE POWER SUPPLIES (SMPS) I DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVER

TO-220

INTERNAL SCHEMATIC DIAGRAM

ABSOLUTE MAXIMUM RATINGS


Symbol V DS V DGR V GS ID ID IDM ( ) P t ot dv/dt( 1 ) T stg Tj Parameter Drain-source Voltage (V GS = 0) Drain- gate Voltage (R GS = 20 k ) Gate-source Voltage Drain Current (continuous) at Tc = 25 C Drain Current (continuous) at Tc = 100 C Drain Current (pulsed) Total Dissipation at Tc = 25 C Derating F actor Peak Diode Recovery voltage slope Storage T emperature Max. O perating Junction Temperature
o o o

Value 500 500 20 4.5 2.9 18 100 0.8 3.5 -65 to 150 150

Uni t V V V A A A W W/ C V/ ns
o o o

C C

() Pulse width limited by safe operating area (1) ISD 4.5A, di/dt 75 A/s, VDD V(BR)DSS, Tj TJMAX First Digit of the Datecode Being Z or K Identifies Silicon Characterized in this Datasheet

August 1998

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IRF830
THERMAL DATA
R t hj-ca se
Rthj -amb

R thc- si nk Tl

Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose

1.25 62.5 0.5 300

C/W oC/W o C/W o C

AVALANCHE CHARACTERISTICS
Symb ol I AR E AS Parameter Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) Single Pulse Avalanche Energy (starting Tj = 25 o C, I D = IAR , VDD = 50 V) Max Valu e 4.5 290 Unit A mJ

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF


Symb ol V (BR)DSS I DSS I GSS Parameter Drain-source Breakdown Voltage Test Cond ition s I D = 250 A V GS = 0 Min. 500 1 50 100 Typ . Max. Un it V A A nA

V DS = Max Rating Zero G ate Voltage Drain Current (VGS = 0) V DS = Max Rating Gate-body Leakage Current (V DS = 0) V GS = 20 V

T c = 125 C

ON ()
Symb ol V GS(th) R DS( on) ID(o n) Parameter Gate Threshold Voltage V DS = VGS Test Cond ition s ID = 250 A ID = 2.7 A 4.5 Min. 2 Typ . 3 1.35 Max. 4 1.5 Un it V A

Static Drain-source On V GS = 10V Resistance

On State Drain Current V DS > I D(on) x R DS(on) max V GS = 10 V

DYNAMIC
Symb ol g fs ( ) C iss C oss C rss Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse T ransfer Capacitance Test Cond ition s V DS > I D(on) x R DS(on) max V DS = 25 V f = 1 MHz I D = 2.7 A VGS = 0 Min. 2.5 610 120 10 Typ . Max. Un it S pF pF pF

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IRF830
ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON
Symb ol t d(on) tr Qg Q gs Q gd Parameter Turn-on Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Cond ition s V DD = 250 V I D = 2.9 A VGS = 10 V R G = 4.7 (see test circuit, figure 3) V DD = 400 V I D = 3 A V GS = 10 V Min. Typ . 11.5 8 22 7.2 8 30 Max. Un it ns ns nC nC nC

SWITCHING OFF
Symb ol t r(Vof f) tf tc Parameter Off-voltage Rise Time Fall Time Cross-over Time Test Cond ition s V DD = 400 V I D = 4.5 A R G = 4.7 V GS = 10 V (see test circuit, figure 5) Min. Typ . 7 5 15 Max. Un it ns ns ns

SOURCE DRAIN DIODE


Symb ol I SD I SDM ( ) V SD ( ) t rr Q rr I RRM Parameter Source-drain Current Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current I SD = 4.5 A V GS = 0 435 3.3 15 I SD = 4.5 A di/dt = 100 A/ s o T j = 150 C V DD = 100 V (see test circuit, figure 5) Test Cond ition s Min. Typ . Max. 4.5 18 1.6 Un it A A V ns C A

( ) Pulsed: Pulse duration = 300 s, duty cycle 1.5 % ( ) Pulse width limited by safe operating area

Safe Operating Area

Thermal Impedance

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IRF830
Output Characteristics Transfer Characteristics

Transconductance

Static Drain-source On Resistance

Gate Charge vs Gate-source Voltage

Capacitance Variations

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IRF830
Normalized Gate Threshold Voltage vs Temperature Normalized On Resistance vs Temperature

Source-drain Diode Forward Characteristics

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IRF830
Fig. 1: Unclamped Inductive Load Test Circuit Fig. 1: Unclamped Inductive Waveform

Fig. 3: Switching Times Test Circuits For Resistive Load

Fig. 4: Gate Charge test Circuit

Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times

6/8

IRF830

TO-220 MECHANICAL DATA


DIM. MIN. A C D D1 E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 DIA. 13.0 2.65 15.25 6.2 3.5 3.75 0.49 0.61 1.14 1.14 4.95 2.4 10.0 16.4 14.0 2.95 15.75 6.6 3.93 3.85 0.511 0.104 0.600 0.244 0.137 0.147
E

mm TYP. MAX. 4.60 1.32 2.72 1.27 0.70 0.88 1.70 1.70 5.15 2.7 10.40 0.019 0.024 0.044 0.044 0.194 0.094 0.393 MIN. 0.173 0.048 0.094 4.40 1.23 2.40

inch TYP. MAX. 0.181 0.051 0.107 0.050 0.027 0.034 0.067 0.067 0.203 0.106 0.409 0.645 0.551 0.116 0.620 0.260 0.154 0.151

D1

L2 F1

G1

Dia. F2 F

L5 L7 L6

L9

L4

H2

P011C

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IRF830

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics Printed in Italy All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. .

8/8

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.

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