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Our approach is simple: from Design to Device! At LioniX International, our expertise in photonic integrated circuits spans from design to fabrication, assembly, packaging, and more. We often get asked about our packaging capabilities, which are fully customizable but only available for TriPleX® based #PICs. Here’s how that works: 🔹𝐏𝐈𝐂 𝐃𝐞𝐯𝐞𝐥𝐨𝐩𝐦𝐞𝐧𝐭: We design and fabricate cutting-edge PICs based on our proprietary silicon nitride technology TriPleX®, achieving minimal propagation losses and a broad wavelength band from 405 nm to 2350 nm 🔹𝐏𝐡𝐨𝐭𝐨𝐧𝐢𝐜 𝐈𝐂 𝐌𝐨𝐝𝐮𝐥𝐞𝐬: We design #photonic modules tailored to customer applications , ensuring everything fits seamlessly and scales effortlessly with their systems. And that’s where our packaging is key! 🔹𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐒𝐞𝐫𝐯𝐢𝐜𝐞𝐬: Our packaging magic is reserved for the modules we create in-house. It is part of full suite of #PIC development services, allowing us to design #SiliconNitride #chips with hybrid integration, packaging, electronics, and system compatibility in mind. We do not offer packaging services for externally produced chips.

Digital twins and Electronic Design Automation (EDA) are pushing the boundaries of semiconductor innovation! Learn how with Ron Press, Sr. Director of Technology Enablement and Marc Hutner, Director, Product Management, in their recent informative and exclusive interview with Advantest. As well as discussing how Chip Design can be advanced with Digital Twins and EDA, they explain why this matters to design and test. Their conversation also introduces pioneering digital twin technology to revolutionize semiconductor design and testing from Siemens EDA, and the transformative impact of these technologies on product quality, time-to-market, and sustainable manufacturing. Don't miss out on these industry expert insights into the future of semiconductor technology. Watch the full #AdvantestTalksSemi episode here. https://sie.ag/45SwPz #FutureofAI #DigitalTwin #AIchips #DFTmarketleader #Tessent #designfortest #TessentStreamingScanNetwork #TessentSSN #Semiconductor #SiemensEDA

X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology New IP combines Flash and EEPROM elements for enhanced data retention and best-in-class operational reliability X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has just announced a major innovation in NVM data storage which draws on the company’s best-in-class SONOS technology. #EmbeddedFlash #AutomotiveTech #BCDOnSOI #XFABTechnology X-FAB https://lnkd.in/ewWwQjgy

In today's rapidly evolving semiconductor landscape, flexibility is key. Our semi-automated #AOIsystems are designed to adapt seamlessly to your unique product needs. Whether you're working with wafer sizes from 2" to 12", different materials such as silicon, glass or compound semiconductors, or inspecting a variety of samples including ICs, MEMS and complex packages, our systems can inspect it all. Various chucks or holders can get mounted on a flexible adapter system, where the samples need to get positioned by the operator.   Why choose the WAFERinspect Semi-Automated systems? ✅ Unmatched Versatility: Inspect virtually any wafer size, material, or package type with ease, thanks to our universal chuck system.  ✅ Operator-Friendly Automation: Maintain control where it matters while automating repetitive, error-prone tasks to reduce fatigue and improve throughput.  ✅ Customizable Workflows: Tailor your inspection process with adjustable parameters, scan sequences, and reporting formats to suit your specific requirements.  ✅ Future-Proof Design: Scale effortlessly with upgrade options for full automation, ensuring your investment grows with your business.   The WAFERinspect Semi-Automated systems bridge the gap between manual and fully automated solutions, offering a cost-effective, scalable approach to high-precision defect inspection and metrology. Designed for industries like #Photonics, #MEMS, #PowerSemiconductors, #3DIC, and #AdvancedPackaging, they deliver consistent, operator-independent results for even the most demanding applications.    With Confovis, you gain not just a tool but a partner in innovation. Let us support you elevate your production quality and unlock new possibilities in inspection and metrology. ➡️ Find the link in the comments

Manufacturing company X-FAB has launched a memory solution combining two kinds of storage: 32kBytes of Flash memory and 4kbits of EEPROM. Experts have managed to create a single compact system with these two types of storage, using X FAB’s SONOS technology. Since they’ve built it with high voltage XT011 and 110nm process, they’ve increased the system’s efficiency, even in extreme conditions. This memory can work even in harsh conditions: -40°C to 175°C. The system is reliable because, while flash memory is ideal for long-term data storage, it’s not frequently updated, while EEPROM can handle frequent updates and store data temporarily, in high-temperature conditions. Simply put, when the temperature improves, EEPROM transfers the data to the flash memory. This makes the system durable and flexible, perfect for demanding environments like automotive, medical, and industrial applications. The design also features shared control circuitry, reducing space and complexity while enhancing performance. With error-correction mechanisms (ECC) for both Flash and EEPROM, the system ensures error-free data storage even in critical applications. Its specialized circuitry enables faster, cheaper testing and X-FAB offers additional support like built-in self-test (BIST) modules. This memory solution sets a new standard for compact, reliable storage in challenging conditions, with expanded capacities (64kBytes and 128kBytes) planned for release in 2025. What do you think of this innovation? Share your thoughts in the comments! Check out our website for more: https://techteamz.io/ #SemiconductorInnovation #AdvancedMemoryTechnology #IndustrialApplications #AutomotiveTech #HighPerformanceStorage

Learn how digital twins and Electronic Design Automation (EDA) are pushing the boundaries of semiconductor innovation with Ron Press and Marc Hutner, Siemens EDA, in their in-depth interview with Advantest. As well as discussing how Chip Design can be advanced with Digital Twins and EDA, they explain why this matters to design and test. Their conversation also introduces pioneering digital twin technology to revolutionize semiconductor design and testing from Siemens EDA, and the transformative impact of these technologies on product quality, time-to-market, and sustainable manufacturing. Don't miss out on these industry expert insights into the future of semiconductor technology. Watch the full #AdvantestTalksSemi episode here. https://sie.ag/5SS4ro #FutureofAI #DigitalTwin #AIchips #DFTmarketleader #Tessent #designfortest #TessentStreamingScanNetwork #TessentSSN #Semiconductor #SiemensEDA

The healthcare industry benefits from advanced medical electronic components. Find medical-grade sensors, biochips, and healthcare monitoring devices on chipmall.com for improved patient care and diagnostics.#electronics #components #chipmall

AD8541ARZ-REEL7: High-Performance Operational Amplifier 🌟 High Performance and Stability The AD8541ARZ-REEL7 is a high-performance single-channel CMOS operational amplifier designed for low-power applications. Its unique architecture ensures stable performance across a wide temperature range, making it ideal for systems requiring high precision and stability. ⚡ Low Power Consumption and High Efficiency This op-amp is renowned for its ultra-low power consumption of just 45µA, making it perfect for battery-powered portable devices. Additionally, its high-efficiency design ensures excellent performance in various applications, including sensor interfaces and signal conditioning. 🛠️ Versatility and Wide Applications With its wide bandwidth and low distortion characteristics, the AD8541ARZ-REEL7 can handle various signal types. This makes it widely applicable in fields such as medical devices, industrial automation, and communication equipment, meeting the needs of different application scenarios. 🌐 Easy Integration and Use The compact packaging of this op-amp makes it easy to integrate into existing systems. Its high input impedance and low output impedance simplify the design process while enhancing overall system performance. 💡 Conclusion With its low power consumption, high performance, and versatility, the AD8541ARZ-REEL7 is an ideal choice for numerous applications. Whether developing new products or upgrading existing systems, this op-amp is a reliable option. #WirelessCommunication #Innovation #AnalogDevices #ElectronicComponents #TechnologySolutions #BOMServices #ElectronicEngineering #Semiconductors #InnovationInTech #IntegratedCircuits #Telecommunications #AutomotiveElectronics #ComputerElectronics #ElectronicsSupplyChain #QualityControl #ElectronicsManufacturing #GlobalSupply #ElectronicsIndustry #CircuitDesign #TechSupply #IndustryLeaders #TechInnovation

#Fiber_Optic_Development_Tools Market 2023: Global Industry Analysis, Opportunities and Forecast To 2032 >> https://lnkd.in/gaHzvdPJ #Fiber Optic #Development Tools #assist an easier way to #execute fiber #optic technology and #integrated fiber optic #modules in an infrastructure. These fiber optic development #tools cover all the #modules, components, and #tools that are necessary for users to rapidly and #accurately evaluate and gain access to the value of a #manufacturer's products within the respective #applications. Broadcom; Finisar Corporation; Radiall; MikroElektronika, Qorvo, Inc., among #fiberart #fiberlasercutting #fiberopticcable #developments #developmentsector #optics

𝐏𝐢𝐠𝐭𝐚𝐢𝐥𝐞𝐝 𝐋𝐚𝐬𝐞𝐫 𝐃𝐢𝐨𝐝𝐞 𝐌𝐚𝐫𝐤𝐞𝐭 𝐎𝐯𝐞𝐫𝐯𝐢𝐞𝐰 The pigtailed laser diode market is driven by advancements in optical communication, medical diagnostics, and consumer electronics. These laser diodes offer high efficiency and compact design, making them ideal for applications such as fiber optics, sensors, and laser systems. Market growth is also supported by increased demand for high-speed data transmission and precision laser technologies. 𝐆𝐞𝐭 𝐌𝐨𝐫𝐞 𝐈𝐧𝐟𝐨@https://lnkd.in/dFs3bYwc 𝐊𝐞𝐲 𝐏𝐥𝐚𝐲𝐞𝐫𝐬 II-VI Incorporated, Newport Healthcare, Qorvo, Inc., Hamamatsu Corporation, OSRAM, Thorlabs, EPITECH GROUP SPA, LaserAway, Sharp HealthCare, KYOCERA Global, EPISTAR, Mitsubishi Electric, SANKEN, Panasonic North America, STMicroelectronics, Coherent Corp., Amphenol, Toshiba, Maxell Group, Nordson MEDICAL, Yokogawa, LEDVANCE. #PigtailedLaserDiodes #OpticalCommunications #LaserTechnology #MarketGrowth