“Vijay = GREAT marketer! I have worked with him for over 4 years. Vijay is details oriented, a team player and a visionary in our organization. Using his technical expertise and business acumen he has the ability to identify new high-value products. He also has fantastic communication skills that captivates our customers.”
About
I have 18+ years of product management experience. I enjoy designing, developing and…
Activity
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🚀 In collaboration with NBC Universal, we've launched the Wicked Virtual Showroom! 🎉 Dive into a dorm room inspired by Glinda & Elphaba's…
🚀 In collaboration with NBC Universal, we've launched the Wicked Virtual Showroom! 🎉 Dive into a dorm room inspired by Glinda & Elphaba's…
Liked by Vijay Ramani
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Product-market fit is probably one of the most talked about topics in the startup world — yet the concept can still be elusive. In my experience…
Product-market fit is probably one of the most talked about topics in the startup world — yet the concept can still be elusive. In my experience…
Liked by Vijay Ramani
Experience
Education
Patents
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Methods and systems for inspection of a wafer or setting up an inspection process
Issued USPTO 07659975
Methods and systems for inspection of a wafer or setting up an inspection process are provided. One method for inspection of a wafer includes detecting first and second sets of defects on the wafer by performing different scans of the wafer with different focus offsets. The method also includes comparing results of the different scans for a defect of the first set and a defect of the second set that are detected at approximately the same location on the wafer. The method further includes…
Methods and systems for inspection of a wafer or setting up an inspection process are provided. One method for inspection of a wafer includes detecting first and second sets of defects on the wafer by performing different scans of the wafer with different focus offsets. The method also includes comparing results of the different scans for a defect of the first set and a defect of the second set that are detected at approximately the same location on the wafer. The method further includes determining if the defect of the first and second sets is a defect of an underlying layer or an uppermost layer formed on the wafer based on results of the comparing step.
Languages
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English
Native or bilingual proficiency
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Korean
Elementary proficiency
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Mandarin
Elementary proficiency
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Hindi
Professional working proficiency
Recommendations received
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