Verly Flores

The i.MX processors from NXP offer real-time OS support accross multiple cores, plus integration with industrial protocols. Check out the link to learn how these features can enhance your next design!

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This is a super interesting blog from Sundeep Bajikar, VP and head of corp. strategy for Applied Materials. We're all living in the biggest computing era yet (yup! bigger than the personal computer era and the mainframe era). The semiconductor industry and potentially the wafer fab equipment market will grow even faster. Why? Because AI and IoT are two sides of the same coin and new materials and exciting science will set the industry and the world up for success with AI. Read more to get some insights from Sundeep on this exciting growth market.

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After a challenging year, the memory market rebounds. DRAM and NAND costs rise with AI's high-bandwidth needs, hinting at commodity shift. TSMC predicts semiconductor growth but remains cautious about memory due to supply challenges. Explore the impact of advancements on electronic components today! >>> https://hubs.la/Q02rQQpx0 #OutInFront #ElectronicComponents #FusionWorldwide #MarketIntelligence

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why choose NVMe PCIe 4.0 SSD? 1. Ultra-high read and write speed ①Strong sequential read and write performance, up to 7,000𝐌𝐁/𝐬𝐞𝐜 read and 6,500𝐌𝐁/𝐬𝐞𝐜 write speeds. ②Excellent 4K random read and write performance 2. Low power consumption and energy saving ①Link energy saving characteristics ②Efficient power management 3. Good compatibility and versatility 4. Compact size and large capacity 5. Long-lasting stability and reliability #nvme #pcie4 #gamingSSD #ps5storage

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Everspin Technologies continues to lead the industry in the adoption of MRAM. Industrial and commercial space markets have embraced the technology.

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Don’t miss the Chiplets: Building the Future of SoCs virtual event on July 24 & 25! We’ll explore technical trends, market demand, and new application areas around chiplets concepts, challenges, technologies, and more with @EE Times and @Embedded.com. Hear from Cadence experts on the role of EDA companies in the chiplet transformation and how you can get a jumpstart in designing your own chiplets. https://ow.ly/tPUE50SBWkM

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Good interview with Eddie Ramirez on how Arm is helping to democratize chiplet-based design with platforms like #Arm #Neoverse CSS, and initiatives like Arm Total Design, which is now over 30 partners strong. https://lnkd.in/geVb4RQ3

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Many of my LinkedIn connections live and work in the Audio field. In this new role within the MCU team at Infineon, I’ve wondered where I’d get my “audio fix”. Last week I found it. It’s too early to share lots of data, but I’ve seen (and heard!) how the machine learning core inside PSOC Edge can really help with noise and echo cancellation, cleaning the audio signal so that following algorithms get a louder voice with less noise. The ML core in PSOC Edge makes the algorithms WAY more adaptive than laboriously hand tuned DSP code - code that’s often fantastic in one situation but falls apart as soon as you change location. It’s one of the reasons why the demo below handles so many different words. If your struggling to handle some of these voice input challenges, have a look at the video below and reach out to me and the team, or even better, ask your local Infineon sales person or distributor about PSOC Edge!

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We’re proud to unveil the successful design and tape-out of our inaugural Arm-based system chiplet, marking a significant leap in chiplet technology and roadmap. This transformative achievement integrates multiple system chiplet dies into a single package, highlighting the capabilities of our cutting-edge Cadence Chiplet Architecture and Framework. Collaborating with Arm, this groundbreaking development promises to transform chip design for automotive, high-performance computing, and communications industries by offering unparalleled efficiency and scalability. 🚀 Learn more: https://ow.ly/1vhv50Uaghx

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With the exponential improvements being made in #LLMs to enable a wide range of #AI applications, #HBM & #HBM3E solutions are pushing the data-rate envelope to solve the memory bottlenecks during #AItraining. Here's an interesting discussion with Nidish & Frank on how #HBM is evolving to tackle these challenges, and the numerous IP solutions that customers can leverage to accelerate their Time to Market and stay ahead in the race!

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Uncover the power-efficient MPU featuring advanced graphics and audio capabilities, along with EdgeLock® Secure Enclave, SESIP, and PSA Level 2 certifications in this special whitepaper from #NXP!

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"Chip and system designers have their work cut out for them to address the demands for increasing memory performance and reducing power consumption in the rapidly unfolding AI era. GenAI is evolving at breakneck speeds, putting pressure on computing infrastructure and memory in particular." Check out the recent blog, "Breaking Through the Memory AI Wall" from Rambus' Steven Woo.

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Looking to drive your business forward? Our latest blog explores how our advancements in IP technology, leveraging TSMC's N3 (3nm) process node, can help. We've achieved milestones like the world's first silicon-proven GDDR7 IP, supporting data rates up to 32Gbps, offering the best price/performance ratio for AI interfaces. Our PCIe 6.0 and CXL 3.x solutions are silicon-proven, power-optimized, and robust, ensuring seamless interoperability with leading vendors. The UCIe PHY IPs will soon be available, setting new industry standards. Read the full blog to see how Cadence is pushing technology boundaries to benefit your business. https://ow.ly/YW4850TOwtL

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Cadence Design Systems is proud to support PCI-SIG at FMS: the Future of Memory and Storage

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Terrific article in Nikkei Asia about EdgeCortix's innovative & efficient approach to delivering AI inference at the edge. Worth a read.

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