Shivani Mehrotra

NY senator breaks a spoiler to AP: Micron Technology to receive $6.1B from the Chips Act. Excerpts from Boise (Idaho) Development : "Micron Technology will get $6.1 billion from the CHIPS Act to fund large-scale expansions in Boise and Syracuse, NY. ... Micron has started work on a $15-billion expansion of its Boise campus, which would add significant new research and development capacity to the site off Federal Way. The City of Boise annexed nearly a square mile of new land for Micron, and work has begun on initial infrastructure. The Boise expansion would add nearly 2,000 local jobs, the company said. ... In addition to the federal funds, Micron will get incentives from the State of Idaho as well as some non-direct assistance from the City of Boise, as BoiseDev previously reported. ... Micron will also build a nearly $100-million facility near Syracuse, New York, which Schumer said to the AP is the largest single investment in that state since the Erie Canal. ... Schumer told Syracuse.com that the deal was preliminary and non-binding and could be announced next week. ... Correction: A prior version of this story incorrectly stated that the reported mount was $5.1 billion. It is $6.1 billion." https://lnkd.in/gCByqhnb

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We had the pleasure of sitting down with Mayank Varshney, VP of Engineering at Mirafra Technologies. Here's a glimpse into our conversation: 💡His Background: Master's in Electronics & Semiconductor Research from UC Riverside. Industry experience in memory design, digital and mixed-signal design solutions, foundry, and design teams. Joined Mirafra in 2019, bringing a holistic understanding of the chip design industry. 💡His Vision: Focus on career growth for engineers through opportunities. Encourage engineers to set career goals and work together to achieve them. His Observations: Technology industry is shifting towards automation and AI. Data & AI revolution is expanding the technology business. Massive growth in data centers and AI workloads. 💡His Advice for Potential Employees: Come with a belief that you are working on technologies shaping the future. Be passionate about your work and invest in learning. Read the full interview here: https://lnkd.in/d---QRYx #semiconductor #semiconductors #interview 

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Don’t miss the Chiplets: Building the Future of SoCs virtual event on July 24 & 25! We’ll explore technical trends, market demand, and new application areas around chiplets concepts, challenges, technologies, and more with @EE Times and @Embedded.com. Hear from Cadence experts on the role of EDA companies in the chiplet transformation and how you can get a jumpstart in designing your own chiplets. https://ow.ly/tPUE50SBWkM

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🌟 Positive Progress for TSMC's Arizona Fab! 🌟 Exciting news from Bloomberg: TSMC’s first U.S. fab in Arizona is showing promising results! Production yields from their 4nm process are reportedly on par with those from their Taiwan facility. 🔹 Key Updates: 🌍 TSMC’s Arizona fab began producing engineering wafers in April. 🏭 The first fab aims for mass production in early 2025. 🔬 Future fabs will use cutting-edge 2nm technology to meet rising AI demand. With a $6.6 billion subsidy from the U.S. government and a total investment of $65 billion, TSMC is set to bring world-class manufacturing quality to Arizona. 🔗👀 Read more from TrendForce Corporation: https://lnkd.in/gT78JBQs 🔗👀 Read more from Bloomberg (paywall): https://lnkd.in/g85_MiUD #TSMC #Semiconductors #ArizonaFab #TechNews #Innovation #AMD

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🌟 Big News for U.S. Semiconductor Innovation: ASU Selected for NSTC Facility! 🌟 The U.S. Department of Commerce and Natcast have chosen Arizona State University (ASU) Research Park in Tempe as the site for the third flagship CHIPS for America R&D facility: the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. Here’s why this is a game-changer: 🔬 Bridging Research to Production: This facility will enable researchers and industry leaders to develop and test new materials, devices, and advanced packaging solutions, closing the gap between lab research and full-scale semiconductor production. 🎓 ASU’s Expertise: ASU’s Ira A. Fulton Schools of Engineering and Knowledge Enterprise will bring cutting-edge resources and workforce development to the forefront. The MacroTechnology Works facility will play a key role with its clean room and advanced tools for semiconductor R&D. 💼 Economic Impact: Expected to generate hundreds of jobs and billions of dollars in investment, this project strengthens Arizona’s position as a global hub for advanced manufacturing and innovation. 🇺🇸 National Leadership: Backed by industry leaders, government officials, and other universities, this collaboration is vital for U.S. economic stability, defense security, and technological leadership. Key Voices: 📢 "This is the largest of three CHIPS R&D flagship facilities being launched that together represent the greatest national laboratory investments since those that came out of the Manhattan Project." – Michael Crow, ASU President 📢 "This groundbreaking effort will mean that researchers and startups won’t need to go to China or Europe to test out their cutting-edge prototype microchips — they'll be able to do that right here in America." – U.S. Senator Mark Kelly This facility is expected to be operational by Q4 2028, and it’s a testament to ASU’s commitment to driving innovation and excellence in the semiconductor industry. Let’s celebrate this major win for Arizona, the U.S., and the global semiconductor community! 🚀 #Semiconductors #CHIPSAct #Innovation #AdvancedManufacturing #Arizona

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‘Chip, Chip, Hooray’ engages Idaho youths in unique semiconductor class: https://lnkd.in/eJwNSX-F To prepare the next generation of semiconductor innovators, Boise State University and Idaho Digital Learning Alliance (IDLA) have launched a groundbreaking course—Chip, Chip, Hooray! —designed specifically for eighth to tenth-grade students across Idaho. The initiative is a collaboration between Boise State’s Institute for Microelectronics Education and Research (MER) and IDLA. As the first of three planned courses, it is part of a broader national initiative spurred by the CHIPS and Science Act of 2022, aimed at empowering young minds to engage in the cutting-edge industries of semiconductors and microelectronics. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

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TSMC's first fab in Arizona funded by the CHIPS Act is expected to come on-line in 2025 with the firm's existing 4nm process, NVIDIA and Apple are expected to be major customers. Intel Corporation and Samsung Semiconductor new fabs likely not on-line until some time in 2026-2028 #semiconductors #Intel #TSMC #fab #foundry #Apple #Nvidia #samsung #4nm #chipsact

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🔝 Strong Quarter for AMD! 📈 AMD CEO Lisa Su shared exciting highlights on CNBC's 'Squawk on the Street': 📈 Record Performance: AMD shares soared, reflecting a strong quarter despite initial market drops. 🤖 AI Revolution: AI technology is a key driver, with AMD Instinct accelerator revenue projections increased to $4.5 billion. 💬 CEO Insights: Lisa Su called AI the biggest tech advancement in the past 50 years. 📊 Revenue Growth: Data Center revenue more than doubled in Q2, with strong growth expected in the second half of the year. 🏆 High Demand: Huge demand for AMD’s compute power across various sectors. Key Points: 🎯 Customer Success: Achieving important milestones and strong partnerships with Microsoft, Meta, Oracle, and OEMs. 💻 AI PCs: AI-powered PCs are game-changers, promising growth into 2025. 📈 Market Position: Confident in capturing market share and driving the AI market, projected to reach $400 billion in 5 years. Lisa Su is optimistic about AI’s potential and AMD’s strategic growth. 👀 Watch the full interview here: https://lnkd.in/gTFR3w8F #AMD #AI #Technology #Growth #Innovation #LisaSu #Datacenter #MarketDemand #Partnerships #Investment

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Daily News ⑤Intel has a wafer-level assembly problem, hurting Core Ultra sales. "Seasonal client revenue is constrained by wafer level assembly supply, which is impacting our ability to meet demand for our Core Ultra-based AI PCs," Gelsinger said during the earnings call. Gelsinger acknowledged that demand will only intensify with Microsoft's expected update to Windows 11 and AI boom. The sales of AI PC CPUs are predicted to beat 40 million units. ⑥Apple plans to spend more in Vietnam.  According to Retail News Asia, as of FY23, the number of Apple suppliers in Vietnam increased to 35, an increase of 10 from the previous year, ranking fourth globally. Apple CEO Tim Cook recently visited Vietnam and met with Prime Minister Pham Minh Chinh, pledging to ramp up procurement of components from local suppliers and support their innovation. ⑦Murata secures $2.6 billion-worth orders in 24Q1, up 30.8%. Murata Chairman Tsuneo Murata said that the smartphone market has shown a recovery in components shipments with demand growth in lower-end and high-end clients. The company's MLCC utilization rate is expected to rise to 85-90% this year. In addition, Murata received $2.6 billion worth of orders during the first three months this year, soaring by 30.8% from a year earlier. ⑧Desay SV, GAC's Hyper, NVIDIA to co-develop cockpit-driving integrated L4 solutions. On April 26, Desay SV, GAIC AION's Hyper brand, and NVIDIA signed a tripartite cooperation agreement at the Auto China 2024 in Beijing. The trio aims to manufacture L4 production vehicles jointly, providing power support for advanced autonomous driving functions, confident views, digital clusters, and AI-powered cockpits. Hyper plans to mass-produce L4 models by 2025, achieving an industry-leading 2,000 TOPS computing power. #randa #electroniccomponents #semiconductors #ic #cpu #mcu #gpu #chips #autoparts #vehicles #materials #trends #AI #supplychains #Intel #Apple #Murata #Desay #EV #DDR #NVIDIA #procurementstrategies

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UC helps bring first-of-its-kind semiconductor hub to California : https://lnkd.in/e2WtzQ54 California has been selected as the home of a new national headquarters for computer chip research and development that is expected to bring in over $1 billion in research funding to the state, create hundreds of local jobs and transform America’s semiconductor industry, a core component of our economy and national security.   “By now you’ve heard the dire statistics: the U.S. share of semiconductor manufacturing capacity, which was 37 percent back in 1990, has dropped to 12 percent,” said Dr. Liu Tsu Jae King, Dean of the UC Berkeley College of Engineering, testifying before the House Subcommittee on Research and Technology in 2022. The dearth of domestic chip sources hit home during the pandemic, when supply chain disruptions brought U.S. factories to a standstill, contributing to painful shortages of consumer goods.  #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

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Tune into the Daily Semiconductor Industry Podcast for December 4th, 2024! Hello, friends, followers, and listeners! I need your support. We pour a lot of time and effort into creating daily content for LinkedIn, and your engagement is what keeps us going. When you like, comment, and share our posts, it helps us reach a broader audience and grow this platform. Sharing truly is caring, and it allows shows like ours to connect with more industry professionals. Please take a moment to like, comment, repost, and share our content so we can continue delivering the latest updates and insights to the semiconductor community. Your support makes all the difference! ▪️ NXP Semiconductors, TSMC Affiliate Expand in Singapore: NXP and Vanguard International Semiconductor Corporation are expanding their $7.8B Singapore plant to diversify production amid US-China tech tensions. Targeting 2030 completion, the facility will produce mature chips (130-40nm) for industries like automotive and telecom, creating 1,500 jobs. NXP also aims to localize supply chains in China. ▪️ Marvell Technology’s AI-Driven Growth: Marvell reported 19% Q3 revenue growth to $1.52B, driven by AI chip demand. Q4 projections estimate $1.8B, with 26% YoY growth. Custom AI chip designs for cloud companies underpin its robust performance, as the industry seeks NVIDIA alternatives. ▪️ Next-Gen Semiconductors: Semiconductor scaling demands advanced 3D architectures. Atom Probe Tomography aids development by analyzing nanoscale materials, enabling breakthroughs for next-gen chips. We have some major updates in the semiconductor world, and we'd like to give a huge thank you to our sponsor,ventureLAB, for powering today’s industry review! ventureLAB is leading the way in helping startups in hardware and enterprise software thrive, playing a crucial role in advancing Canada’s semiconductor and AI ecosystems. #Semiconductors #ChipManufacturing #AIChips #USChinaTech #SingaporeTech #NextGenChips #TechnologyInnovation #SupplyChain #AutomotiveTech #GenerativeAI #AdvancedMaterials #MooresLaw

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Jim Keller, former Intel, AMD, and Tesla engineer, aims to challenge Nvidia's dominance in AI with Tenstorrent's energy-efficient chip design. Tenstorrent's upcoming second-generation AI chip promises superior energy and cost efficiency, presenting a viable alternative to Nvidia's offerings. The innovative design of Tenstorrent's chip features independent decision-making cores, potentially reshaping AI chip technology across diverse applications. #AI #Nvidia #semiconductor #semiconductors #chip #technology #innovation #research #computing Tenstorrent NVIDIA https://lnkd.in/g6a3vAu4

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Texas Instruments Wins $4.6 Billion in #ChipsAct Grants, Loans - Funding will support $18 billion in spending in #Texas, #Utah - Biden administration almost finished allocating #chips grants Texas Instruments Inc. is set to receive $1.6 billion in Chips Act grants and $3 billion in loans, the #Bidenadministration announced Friday, marking the latest major award from a program designed to boost #American #semiconductormanufacturing. The funding will help pay for one factory in Utah and two in Texas — projects that will cost about $18 billion through 2029 — the Commerce Department said in a statement. The effort is expected to generate around 2,000 #manufacturing #jobs and thousands more in #construction. In total, #TexasInstruments plans to spend around $40 billion across both states, including an additional two factories in #Sherman, Texas. It’s likely that those will come online after 2030, and the Commerce Department has said it will prioritize projects that will be done by the end of the decade. Thanks again to Mackenzie Hawkins and Bloomberg for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eFiP2W4P #semiconductorindustry #semiconductors #semiconductor #technology #tech #it #chips #it #geopolitics #subsidies #usa #innovation #chip #ic

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TSMC Advances Silicon Photonics Strategy: A Leap Towards Optical Era TSMC is making significant strides in silicon photonics, according to the Economic Daily News. Recent breakthroughs include integrating co-packaged optics (CPO) with advanced semiconductor packaging. Sample deliveries are projected for early 2025, with 1.6T optical transmission products expected in mass production by late 2025. Broadcom and NVIDIA are likely among the first customers. ◾ Key highlights include: ▪️ Successful trial production of the micro ring modulator (MRM) on TSMC's 3nm process, enabling CPO integration with HPC and AI ASIC chips. ▪️ Potential leap from electrical to optical signal transmission, addressing current limitations in speed and heat dissipation. ▪️ Challenges persist with CPO module packaging due to complexity and low yield rates, possibly leading to outsourced optical engine packaging. NVIDIA reportedly plans to adopt CPO for its GB300 chips (H2 2025) and Rubin architecture, aiming to enhance NVLink interconnect performance. These advancements position TSMC at the forefront of the optical computing era, reshaping the future of high-performance computing and AI applications. What are your thoughts on the potential impact of silicon photonics in AI and HPC? Share below! Thanks again to TrendForce Corporation for the full article with more background and insights click the source link in the comments below. #Semiconductors #SiliconPhotonics #AI #HPC #TSMC

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Lisa Su Named TIME's 2024 CEO of the Year! 🔥 Big news for the AMD team! Lisa Su, our fearless leader, has been named TIME's 2024 CEO of the Year! 🔥 Under Lisa’s leadership, AMD has gone from “How long will they last?” to “Leading the pack!” Here’s why she’s a rockstar 🤘: 💰 From $3 to $140+: AMD stock skyrocketed nearly 50x since Lisa took the reins in 2014. Talk about a glow-up! 💻 Tech that WOWs: From "Zen" CPUs to the world’s most powerful supercomputers, AMD is crushing it with cutting-edge innovation. 🤖 AI for Days: We’ve gone from $0 in AI chip revenue to $5 billion in just one year, and we’re just getting started. 📚 Harvard University Case Study: Yep, Lisa’s leadership is so EPYC, it’s taught at Harvard now. 🔝 The best part? Lisa and AMD aren't slowing down. She’s got bold goals, big dreams, and a vision shaping the future of tech for decades to come. 👟 What truly sets Lisa apart is her philosophy of "running toward problems" rather than away from them. She tackles challenges head-on, turning obstacles into opportunities and inspiring those around her to do the same. 📖 Lisa's story is also a powerful inspiration for women leaders and girls—like my daughter—around the world. Her journey proves that with passion, persistence, and big ambitions, there’s no limit to what you can achieve. Let’s celebrate this milestone as a reminder that the future of tech is brighter and more inclusive because of trailblazers like Lisa. 🌍✨ 🔗 Reade the TIME's article here: https://lnkd.in/gGifqt-J #CEOOfTheYear #LisaSu #AMDProud #AMD #TIME #TimeMagazine #AMDBrandAmbassador

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TechRadar's John Loeffler says Intel's Battlemage graphics cards "might just be the 1440p budget champions we've been waiting for." Read on for details. #IAmIntel https://bit.ly/3OGLXOA

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Daily News ①Decreased Capital Expenditures by Major Memory Manufacturers May Lead to Q3 NAND Flash Oversupply. Three major memory manufacturers are concentrating on HBM and premium DRAM. Although enterprise storage demand is robust, there's a potential oversupply in the NAND Flash sector. This year, Samsung Electronics, SK Hynix, and Micron are cutting, not increasing, their NAND Flash investments. NAND Flash prices have increased each quarter, with production capacities normalizing in the second half. Yet, the market anticipates a modest oversupply in Q3, signaling that price hikes may plateau.  ②Amkor granted CHIPS Act incentives for the Arizona plant. On July 26, Amkor, a U.S. semiconductor packaging and testing service provider, announced that it had signed a non-binding preliminary term sheet with the U.S. Department of Commerce to receive proposed incentives under the CHIPS and Science Act. The Department of Commerce plans to provide up to $400 million in direct funding and an additional $200 million in loans. ③Toyota Motor Corporation will establish an electric vehicle battery plant in Fukuoka, Japan. Toyota plans to invest 5 trillion yen in EV-related fields centered around batteries by 2030. In terms of batteries, Toyota has decided to invest 2 trillion yen in the United States and approximately 300 billion yen in the Himeji plant, a joint venture with Panasonic Holdings. ④TSMC's 2nm Fab Construction Unaffected by Super Typhoon Flooding. TSMC is currently constructing an advanced 2nm manufacturing facility, with plans to start mass production of wafers using this cutting-edge technology for multiple clients, most notably Apple. Unfortunately, the recent Typhoon Doksuri struck Taiwan, causing significant economic damage to the region. Fortunately, the world's largest semiconductor manufacturer has stated that the storm did not damage its 2nm fab in Kaohsiung.  #randa #electroniccomponents #semiconductors #ic #cpu #gpu #mcu #materials #supplychains #solutions #trends #EV #autoparts #vehicles #procurementstrategies #memory #NAND #HBM #ic #chips #Toyota 

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