Sam Bhayani

When working with a PCBA supplier, communication is key. For your supplier to meet your needs, it's crucial that they understand your project's design goals and specifications, and can easily reach out to you. By choosing a reliable supplier and communicating effectively, you should have no problem achieving your desired end result. Here are some helpful tips and suggestions for improving communication with your PCBA supplier.

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In the intricate world of PCB manufacturing, the significance of PCBA box build assembly cannot be overstated. It represents the final stage where various components, subassemblies, enclosures, and software/firmware integration come together to form a fully functional electronic device.

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When adding stitching vias to a PCB, strategic placement is crucial. It's essential to position them around the edges of critical components, high-speed signal traces, and ground planes. This ensures effective shielding and enhanced signal integrity. The appropriate size and spacing of stitching vias are chosen based on your application's specific requirements and the PCB's material. #PCBdesign

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Stitching vias, also known as via stitching, are a crucial design practice for PCBs. By placing a series of vias around the perimeter of a ground plane or signal trace, a continuous conductive path is created, connecting the top and bottom layers of the board. #PCBdesign #viastitching

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Want to learn more about the future of RF Wireless Microphones? The future is here!

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Texas Instruments (TI) has secured a $1.6 billion award from the U.S. government under the CHIPS and Science Act to support the construction of three new 300mm wafer fabs in Texas and Utah. This funding will bolster TI's efforts to increase domestic semiconductor production, ensuring a reliable supply of essential analog and embedded processing chips for various industries. The company is committed to sustainable manufacturing practices, including the use of renewable energy and water conservation initiatives. TI's investment in these new fabs will create thousands of jobs and contribute significantly to the U.S. semiconductor industry. #TexasInstruments #TI #CHIPSandScienceAct #chips #chipmanufacturing #semiconductor #semiconductors #semiconductormanufacturing #semiconductorindustry #USA #innovation #technology #technologynews #sustainability

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Tiny chips, huge impact. Semiconductors are at the heart of U.S.-China tensions, fueling a new era of technological power struggles. Explore what this means for the global tech landscape. #Semiconductors #TechPower https://zurl.co/e7ax

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Episode 142 of the Reliability Matters Podcast is now available. This episode was recorded at the Surface Mount Technology Association (SMTA) Pan Pacific Strategic Electronics Symposium on the Big Island of Hawaii. My guests on this episode are Dr. Chuck Bauer, founder of PanPac, Keith Bryant, and Dr. Ron Lasky. We discussed the history of PanPac, technologies introduced at PanPac, and what makes PanPac so unique. We also discuss Dartmouth College's unique engineering innovations program. https://lnkd.in/gFW3j2HP #smta #panpac #reliabilitymatters #reliability

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Passive elements are integral to a multitude of electronic devices, ranging from mobile phones and computers to healthcare apparatus and industrial equipment. Their subtle yet essential function in influencing circuit performance is of great importance. In PCB design, these elements are carefully positioned and linked to produce specific results.

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In the Southern California Area? Don't miss the Surface Mount Technology Association (SMTA) Los Angeles / Orange County Expo on Tuesday, November 5th from 10:00 AM - 3:00 PM. The SMTA LA/OC Expo provides a great platform to bring professionals within the industry together and provide attendees with exposure to global technology at a local level. In addition, the LA/OC Expo provides an opportunity to educate local engineers who may not be able to attend larger conferences and trade shows. Who You Will Meet? Process Engineers, Manufacturing Engineers, Production Managers, Engineering Managers, Quality Managers, Product Managers, Presidents, Vice Presidents, CEOs, Managers, Owners, Directors, and Buyers. There will be a free "Lunch & Learn" panel discussion on the subject of Ultra High-Density Interconnects (UHDI). An Introduction to Ultra High-Density Interconnects (UHDI) This panel discussion provides a comprehensive guide to Ultra High-Density Interconnects (UHDI) and their implications for the assembly industry. UHDI represents the next frontier in printed circuit board (PCB) design, enabling significantly higher routing density and miniaturization by utilizing fine-pitch traces, smaller vias, and advanced substrate technologies. Our expert panel consists of Tara Dunn, Director of Training and Education at SMTA, Anaya Vardya, CEO of American Standard Circuits, and Mumtuz Bora, Sr. Staff Packaging Engineer/ Backend Operations Manager at pSemi. The presentation begins by defining UHDI, exploring the technological advancements that have driven its development, and highlighting the key differences from traditional interconnect technologies. The presentation will also review the reasons for UHDI, delving into the factors pushing UHDI adoption, including the demand for smaller, lighter, and more powerful electronic devices, and the challenges of integrating complex functionality into increasingly constrained spaces. Finally, the presentation will review how UHDI will impact the assembly industry. It discusses the evolving requirements for precision assembly techniques, enhanced soldering processes, and inspection methods needed to meet the tighter tolerances of UHDI designs. The implications for supply chain management, manufacturing costs, and the importance of advanced testing methodologies to ensure reliability are also addressed. This guide equips assemblers with the knowledge they need to prepare for the transition to UHDI and stay competitive in a rapidly evolving technological landscape. Location: Highway 39 Events Center 1563 S State College Blvd, Anaheim, CA 92806 Cost: Free for members and non-members. Includes entry to expo, technical session, and lunch. Free registration here: https://lnkd.in/gcUabVaV

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Have lengthy delivery times, sluggish responses, and hefty excess and obsolescence charges left you exasperated? Have you occasionally encountered individuals who evade responsibility by pointing fingers at customer forecasts? Is your manufacturing partner more focused on achieving their own metrics rather than yours? Discover what sets Sonic apart.

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Inspiring update from Dr. Laurie Locascio on the progress of CHIPS for America Act at SEMICOM West. $1.6B has been completely allocated to help the USA increase its share of worldwide semiconductor fabrication to 28% by 2032, creating millions of jobs. The next act is to allocate new funding to help the USA establish itself as an innovator, leader, and major provider for semiconductor packaging #semiconductors #USA #CHIPSforAmericaAct

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Quality assurance plays a vital role in the manufacturing process of printed circuit boards (PCBs), ensuring the dependability, efficiency, and functionality of electronic devices. By employing efficient quality assurance methods, manufacturers can reduce defects, enhance customer satisfaction, and lower expenses related to rework or product recalls. Let's delve into some of the primary approaches we utilize to elevate quality assurance in PCB manufacturing. These strategies guarantee that you receive the top-notch and dependable PCBs you rely on.

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🚨 𝗖𝗮𝗹𝗶𝗳𝗼𝗿𝗻𝗶𝗮 𝗜𝗦𝗢 𝗜𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝗼𝗻 𝗣𝗿𝗼𝗰𝗲𝘀𝘀 𝗘𝗻𝗵𝗮𝗻𝗰𝗲𝗺𝗲𝗻𝘁𝘀 𝟮𝟬𝟮𝟯 – 𝗧𝗿𝗮𝗰𝗸 𝟯𝗔 𝗪𝗼𝗿𝗸𝗶𝗻𝗴 𝗚𝗿𝗼𝘂𝗽 𝗠𝗲𝗲𝘁𝗶𝗻𝗴 𝗥𝗲𝗰𝗮𝗽 (𝗦𝗲𝗽 𝟰, 𝟮𝟬𝟮𝟰) 🚨 CAISO hosted a key working group session to discuss the 𝗜𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝗼𝗻 𝗣𝗿𝗼𝗰𝗲𝘀𝘀 𝗘𝗻𝗵𝗮𝗻𝗰𝗲𝗺𝗲𝗻𝘁𝘀 (𝗜𝗣𝗘) 𝟮𝟬𝟮𝟯 for Track 3A. Industry stakeholders reviewed updates and proposals to improve California's interconnection process and support the state's clean energy goals. Here’s a recap: 🔑 𝗧𝗿𝗮𝗰𝗸 𝟯𝗔 & 𝟯𝗕 𝗜𝗻𝗶𝘁𝗶𝗮𝘁𝗶𝘃𝗲 𝗨𝗽𝗱𝗮𝘁𝗲𝘀: 🔸The final proposal is expected by 𝗙𝗲𝗯𝗿𝘂𝗮𝗿𝘆 𝟮𝟬𝟮𝟱, with the Board of Governors’ decision in 𝗠𝗮𝗿𝗰𝗵 𝟮𝟬𝟮𝟱. 🔸Key challenges include 𝗧𝗿𝗮𝗻𝘀𝗺𝗶𝘀𝘀𝗶𝗼𝗻 𝗣𝗹𝗮𝗻 𝗗𝗲𝗹𝗶𝘃𝗲𝗿𝗮𝗯𝗶𝗹𝗶𝘁𝘆 (𝗧𝗣𝗗) allocation for projects facing delayed 𝗗𝗲𝗹𝗶𝘃𝗲𝗿𝗮𝗯𝗶𝗹𝗶𝘁𝘆 𝗡𝗲𝘁𝘄𝗼𝗿𝗸 𝗨𝗽𝗴𝗿𝗮𝗱𝗲𝘀 (𝗗𝗡𝗨𝘀) and 𝗥𝗲𝗹𝗶𝗮𝗯𝗶𝗹𝗶𝘁𝘆 𝗡𝗲𝘁𝘄𝗼𝗿𝗸 𝗨𝗽𝗴𝗿𝗮𝗱𝗲𝘀 (𝗥𝗡𝗨𝘀), which can push full deliverability status out by 10+ years. 💡 𝗞𝗲𝘆 𝗣𝗿𝗼𝗽𝗼𝘀𝗮𝗹𝘀: 🔸𝗔𝗖𝗣-𝗖𝗮𝗹𝗶𝗳𝗼𝗿𝗻𝗶𝗮 proposed renaming 𝗚𝗿𝗼𝘂𝗽 𝗗 to 𝗖𝗼𝗻𝗱𝗶𝘁𝗶𝗼𝗻𝗮𝗹 𝗗𝗲𝗹𝗶𝘃𝗲𝗿𝗮𝗯𝗶𝗹𝗶𝘁𝘆. This would allow early-stage projects to receive conditional TPD allocations, even without a 𝗣𝗣𝗔 or short-list position, and implement a priority system to help offtakers assess the likelihood of securing full deliverability. 🔸𝗘𝗗𝗙 𝗥𝗲𝗻𝗲𝘄𝗮𝗯𝗹𝗲𝘀 emphasized aligning project milestones with 𝗖𝗣𝗨𝗖 𝗯𝘂𝘀𝗯𝗮𝗿 𝗺𝗮𝗽𝗽𝗶𝗻𝗴 to synchronize TPD allocations with project development timelines. They also suggested 𝗶𝗻𝗱𝗲𝘅𝗲𝗱 𝗣𝗣𝗔𝘀 and 𝗰𝗼𝗻𝗱𝗶𝘁𝗶𝗼𝗻𝗮𝗹 𝗣𝗣𝗔𝘀 as alternative contracting solutions to mitigate long lead times. 📝 𝗦𝘁𝗮𝗸𝗲𝗵𝗼𝗹𝗱𝗲𝗿 𝗙𝗲𝗲𝗱𝗯𝗮𝗰𝗸: 🔸Stakeholders discussed the viability of PPAs for long-lead-time projects and agreed that further working sessions are needed to refine the proposals for Track 3. 🌿 𝗪𝗵𝗮𝘁’𝘀 𝗡𝗲𝘅𝘁: 🔸These enhancements are vital for California’s 100% clean energy target by 2045, aiming to remove interconnection bottlenecks and create a more resilient and sustainable energy grid. 🔗 𝗟𝗲𝗮𝗿𝗻 𝗺𝗼𝗿𝗲: 𝙝𝙩𝙩𝙥𝙨://𝙨𝙩𝙖𝙠𝙚𝙝𝙤𝙡𝙙𝙚𝙧𝙘𝙚𝙣𝙩𝙚𝙧.𝙘𝙖𝙞𝙨𝙤.𝙘𝙤𝙢/𝙎𝙩𝙖𝙠𝙚𝙝𝙤𝙡𝙙𝙚𝙧𝙄𝙣𝙞𝙩𝙞𝙖𝙩𝙞𝙫𝙚𝙨/𝙄𝙣𝙩𝙚𝙧𝙘𝙤𝙣𝙣𝙚𝙘𝙩𝙞𝙤𝙣-𝙥𝙧𝙤𝙘𝙚𝙨𝙨-𝙚𝙣𝙝𝙖𝙣𝙘𝙚𝙢𝙚𝙣𝙩𝙨-2023 Stay tuned for more updates! 🌟 #CleanEnergy #CAISO #InterconnectionProcess #RenewableEnergy #EnergyTransition #SustainableFuture #RMSEnergy

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FMG and Chipanalog Microelectronics are pleased to announce Chipanalog New Product Release – CA-IS3417WT-Q1. The CA-IS3417WT is low-EMI, opto-compatible input, reinforced isolated HV (high-voltage) switch. The input stage (primary side) is an emulated diode (e-diode). While maintaining the input characteristics of the optocoupler, it also has better consistency, long-term stability and higher reliability. Unlike traditional optical MOS relays, this device's signal transmission characteristics will not attenuate over time. Also, compared with traditional mechanical relays, the CA-IS3417WT features long term reliability and excellent aging characteristics. CA-IS3417WT-Q1 Automotive 1700V High-voltage Isolated Switches - https://lnkd.in/ePEvNzMR Please contact FMG for more technical information and pricing.

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Explore our new #PCBmanufacturing resource hub. We have curated a collection of articles, case studies, knowledge base pages, courses, and webinars on PCB manufacturing. Perfect for designers, #electricalengineers, and anyone in the electronics field. -- Share this for better reach. #PCBDesign #TechLearning #ElectronicsIndustry

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🚀 Micron’s $6.2 Billion Investment: A Major Boost for U.S. Semiconductor Manufacturing 🇺🇸💾 In a pivotal move, Micron Technology has secured a $6.2 billion award under the CHIPS and Science Act to expand its memory chip manufacturing in the U.S. With a total investment expected to exceed $75 billion by 2030, Micron will ramp up production of DRAM and NAND flash memory in Idaho and New York—critical technologies for artificial intelligence (AI), cloud computing, 5G, and more. 🔧 What’s Next for Micron? This strategic investment comes at a crucial time, as demand for memory chips surges alongside advances in next-gen technologies like AI. Micron’s move will help position the U.S. as a leader in the semiconductor industry, ensuring local manufacturing of cutting-edge technologies that power the future of digital innovation. 📈 Implications for U.S. Manufacturing This decision not only boosts Micron’s capabilities but also has far-reaching implications for the U.S. semiconductor sector: Job creation: Thousands of high-tech manufacturing jobs will be generated across the U.S. 👩‍🔬👨‍🔬 National security: Strengthening domestic memory production mitigates risks from global supply chain disruptions and geopolitical tensions ⚡ Innovation: The U.S. will continue to lead in memory technologies, ensuring cutting-edge solutions for AI, cloud computing, and more 💡 🌐 Why This Matters With Micron’s expansion, the U.S. is taking a significant step toward technological self-sufficiency. As the demand for high-performance chips continues to grow, this investment will help secure the nation’s position at the forefront of technological innovation. More importantly, it signals a stronger, more resilient future for the global tech industry, with local production ensuring the stability of critical supply chains. Micron’s commitment to expanding U.S.-based memory manufacturing is not just a win for the company, but a win for the entire technology ecosystem. The U.S. is poised to lead the charge in semiconductor innovation for years to come. 🇺🇸🔋 #Micron #Semiconductors #CHIPSAct #USManufacturing #MemoryChips #AI #Technology #Innovation #MadeInUSA #SupplyChainResilience #NationalSecurity #Fortune https://lnkd.in/dFt7drNZ

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