Kihong/Joshua Kim

TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025 💡 In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, #TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC #N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025. TSMC states that 'N2 development is well on track and #N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb #SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production. Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eHgpfX4k #semiconductormanufacturing #semiconductors #semiconductor #tech #technology #innovation #chip #chips #integratedcircuits #ic #foundry #taiwan #geopolitics #asml #thenetherlands #europe #euv #computer

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TSMC 3nm chip output to rise over 300% in 2024, says fab director 🤯💡 #TSMC is scaling up its 3nm #chip output, which in 2024 will be over three times that of 2023, according to Y. K. Hwang, company senior director for Fab 18B. The #Taiwan session of TSMC's annual #technology symposium, held on May 23, followed the same theme as the North American session in April. Nonetheless, TSMC CEO C. C. Wei did not appear on stage for the Taiwan session. New faces such as Hwang shared additional details on the foundry's capacity development strategy and future fab projects. Hwang oversees TSMC's Fab 18B located at the Southern Taiwan Science Park (STSP), responsible for manufacturing 3nm chips. Hwang stated at the symposium in Hsinchu that TSMC is expanding its production capacity for 3nm technology; however, a shortage persists. To satisfy customer demand, the #foundry will further boost its production of 3nm #chips. A big thank you again to Monica Chen , Jessie Shen and DIGITIMES Asia for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ewby8hnG #semiconductorindustry #semiconductormanufacturing #semiconductor #semiconductors #technology #tech #innovation #foundry #geopolitics #it #ai #aiot #automotiveindustry #consumerelectronics #datacenters #nvidia #apple #amd #intel #smartphones #cloudcomputing #hpc #pc

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We’ve returned from Semicon West. When we are in Santa Clara, we occasionally get the time to drop by the Intel Museum. Most of us at WFI US entered the industry in the early-mid 1990’s, so we missed the very earliest days. We got pictures of their earlier microcontrollers and EEPROM displays, with the microcontroller display in the picture below. On that day, there weren’t any class tours, although we’ve been there at the time there were tours. Fostering early talent is critical, especially for the larger organizations. Examples of Intel’s Early Microcontrollers:

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Efficient Power Conversion Corp (EPC), headquartered in El Segundo, CA, specializes in gallium nitride on silicon (eGaN) power FETs and integrated circuits for power management applications, with recent validation of their GaN intellectual property rights by the US International Trade Commission (ITC). The ITC upheld EPC's patents and found Innoscience Technology Co Ltd guilty of infringing EPC’s foundational patent, potentially leading to a ban on importing their products into the USA. This ruling is a significant validation of nearly two decades of EPC's hard work and research, reflecting the importance of their intellectual property portfolio. The ITC's final determination is expected on November 5. Innoscience EPC - Efficient Power Conversion #semiconductor #intellectualproperty #industry #lawsuit #technology #GaN https://lnkd.in/di792VMW

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TSMC's wafer pricing now $18,000 for a 3nm #wafer, increased over 3X in 10 years: Analyst 💡 At advanced nodes, #chips are not getting cheaper! Apple's A-series #smartphone processors have evolved significantly from the A7 (28nm) to the A18 Pro (3nm), gaining more cores, transistors, and features. With each new node, TSMC charged Apple more per wafer, so the price increased from $5,000 for a 28nm wafer with A7 processors to $18,000 for a 3nm-class wafer for A17 and A18-series processors, reports Ben Bajarin, the chief executive and principal analyst at Creative Strategies, Inc. Bajarin notes that as #Apple's A-series #chips have evolved, their #transistor count has consistently increased, starting at 1 billion in the #A7 and reaching 20 billion in the #A18 Pro. That makes sense because the number of cores and features has also increased: in 2013, the A7 featured two high-performance cores and a four-cluster #GPU, whereas, in 2024, the A18 Pro features two high-performance cores, four energy-efficient cores, a 16-core #NPU, and a six-cluster GPU. Thanks again to Anton Shilov and Tom's Hardware plus also to Ben Bajarin and Creative Strategies, Inc. for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eixje5Tj #semiconductorindustry #semiconductormanufacturing #taiwan #chip #consumerelectronics #mobile #smartphone #iPhone #tech #usa #california #it #ai #ar #vr #apps #technology #innovation #software

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POLYN’s analog chips are thinking outside the box—literally. With 100X less power and 1000X lower data latency, they’re making us question who’s really in charge here. Invest now. https://lnkd.in/dyvbMAK3

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Numemory reinvents Optane storage-class #memory 💡 Chinese fabless #semiconductor startup Numemory is developing storage-class memory (SCM) #chips using Optane-like phase change memory and crossbar #technology. Numemory, a business unit of Xincun Technology (#Wuhan), has launched the NM101, a storage-class memory #chip with 10x faster read and write speeds and 5x longer endurance than #NAND #chips. Xincun Technology was established in July 2022 and has developed a 3D selector-only memory (SOM) #technology using phase-change memory and a crossbar structure, which is remarkably similar to Intel Corporation and Micron Technology’s failed Optane #memory technology. Numemory’s website states: “The new memory is a type of SCM (storage-class memory) that can increase #storage capacity, reduce costs, and thus greatly improve the overall performance of the storage system. The new memory is considered to be a next-generation non-volatile storage technology that is very promising for large-scale mass production, and has become a hot topic of international concern in recent years.” Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/emUECvnU #semiconductorindustry #semiconductormanufacturing #technology #ai #tech #innovation #dram #nand #nandflash #flashmemory #server #computer #datacenter #foundry #it #computing #computer #ic

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As the growth chart for gallium nitride (GaN) wafer demand is looking more like a hockey stick, it’s apparent that innovators who have long believed in the merits of GaN are being proven right. A private company in El Segundo, CA that predates some of the other startups in the GaN-based power IC space by more than a decade has been hard at work developing solutions in this space for over seventeen years. That company is EPC - Efficient Power Conversion and I got a firsthand look at some of their solutions when I was at the 2024 APEC Conference. They were co-founded in 2007 by a luminary of the power IC industry and CEO Alex Lidow. Lidow was at International Rectifier for over thirty years and had leadership positions spanning R&D and manufacturing. He was even their CEO for 12 years. As co-inventor of the silicon power MOSFET in the 1970s, his seminal work has shaped development in this sector. Lidow was flanked by Joe Cao and Robert Beach, both of whom have also made their own impact. Cao had over 15 years of experience and more than 30 patents in developing GaN and silicon power device technologies before deciding to embark on the quest with Lidow. Beach had founded multiple companies aimed at bringing GaN ICs to the marketplace before partnering with Lidow and Cao, making him a perfect complement to their triumvirate. What put EPC on the map was the development of their proprietary enhancement-mode GaN (eGaN) transistors which they released in June 2009. Unlike traditional MOSFETs, which used built-in channels between the drain and source, eGaN MOSFETS had no such channel. eGaN MOSFETs’ have small geometry, low power dissipation, and are easy to manufacture, making them desirable for a wide array of applications. The founders also had the foresight to manufacture using a foundry meant to produce silicon devices and were able to create a mature, efficient, and low-cost supply chain to bring new products to market quickly. Nowadays, newer companies in the space are gaining similar traction using this approach, but it’s safe to say EPC was a pioneer and began to reap the benefits decades ahead of competitors. This is another key element that differentiates them. In my experience, “mature startups” tend to be modest organizations, often letting their technology speak for itself and not over-indexing on marketing their brands to potential talent. But the hiring landscape is far more competitive than it was when they started and the allure of high-growth startups can be attractive for talented engineers. EPC’s goal is to enable companies to develop their technologies by leveraging the power of GaN and avoid being left behind by developing on silicon. That, combined with their lengthy market presence and leadership team, are strong elements to highlight and EPC would be well-served to fold these details into their talent attraction messaging. #semiconductorindustry #galliumnitride #powermanagement

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TSMC aims to produce ultra-advanced 1.6-nm #chips by 2026  #Taiwan #chip titan aims to secure leading position and capture #AI demand Taiwan Semiconductor Manufacturing Co. says it will start production of ultra-advanced 1.6-nanometer chips by 2026 as the world's top chipmaker races to secure its leadership over the next decade. #TSMC unveiled its A16 #technology at the North America Technology Symposium in #SantaClara, #California, on Wednesday, saying the introduction of 1.6-nm chipmaking technology can "greatly improve logic [#chip] density and performance." “At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI [using] the world’s most advanced silicon," chief executive C.C. Wei said at the event. Thanks again to Cheng Ting-Fang and Nikkei Asia for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eJMxSpQe #semiconductorindustry #semiconductors #tech #innovation #asml #it #nvidia #computer #thenetherlands #semiconductormanufacturing #ai #lithography #geopolitics #icdesign #foundry #computing #server #hbm

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Lattice Semiconductor is reportedly considering making an offer for all of Intel Corp.’s Altera, in a twist that could complicate the chip giant’s plans to sell a minority stake in the unit. https://lnkd.in/gDTPQFst

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TSMC's N2 process has a major advantage over Intel's 18A: SRAM density https://lnkd.in/gAJU3Cqz TSMC N2 will be the first time in nearly a decade that a node has far superior SRAM density that previous node. SRAM bitcell has resisted shrinking for more than a decade. from N12 to N7 it shrunk very little, from N7 to N5 even less and from N5 to N3 not at all (in fact SRAM density reduced) N2 is coming in with about 20% shrink in bitcell area vs N3, for oldtimers of Semiconductors this isn't a lot, but given how last decade has been, this is still phenomenal what is more, next node from TSMC will have CFETs, with P and N FETs stacked vertically. that'll improve density once more. The news mentions Intel Corporation but about that I would only say 18A should properly be compared against N3P of TSMC. Just because Intel's previous CEO decided to call a Ford Focus a Ferrari didn't make it so.

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#AMKOR Wins $600 Million in US Grants, Loans for #Chip Packaging - Company investing $2 billion, creating 2,000 #jobs in #Arizona - Facility will package Apple #chips manufactured at TSMC Amkor Technology, Inc.  is in line to receive $400 million in US government grants and about $200 million in loans for an advanced chip packaging project in #Arizona, marking the latest award from a program designed to boost American #semiconductormanufacturing. The funding from the 2022 Chips and Science Act will support Amkor’s $2 billion facility in the city of #Peoria, which is estimated to generate about 2,000 jobs. The site is slated to package chips manufactured for #Apple Inc. at Taiwan Semiconductor Manufacturing Co.’s sprawling new #Phoenix complex. Thanks again to Mackenzie Hawkins and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eCnSrUki #semiconductor #semiconductorindustry #semiconductors #technology #tech #informationtechnology #advancedpackaging #geopolitics #it #ai #chipsact #samsung #micron #tsmc #globalfoundries #microchip #ic

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U.S. Push for Domestic Chip Production https://lnkd.in/gDQunsde - Geopolitical Concerns: U.S. is pushing for domestic chip production due to the growing risk of geopolitical instability in Taiwan, where many U.S. tech companies currently source their chips. - Intel’s Struggles: Intel's foundry division has been underperforming, losing $1.6 billion, but remains a vital part of the Biden administration’s semiconductor strategy. - CHIPS Act: The U.S. government is investing heavily in the semiconductor industry, though funding disbursements to Intel may be delayed until operational improvements are made. - Tech Giants’ Flexibility: Companies like Nvidia have the capability to shift fabs if necessary, but doing so would impact performance and cost. The U.S. government, through Commerce Secretary Gina Raimondo, is encouraging major tech companies such as Nvidia and Apple to use Intel’s foundries for chip production, particularly AI chips, as part of a broader effort to reduce reliance on foreign manufacturers like Taiwan's TSMC. This push aligns with the Biden administration’s focus on bolstering U.S.-based semiconductor production, especially as geopolitical tensions around Taiwan continue to pose risks to the global supply chain.

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