Jonathan Van Dyke

Jonathan Van Dyke

New York, New York, United States
545 followers 500+ connections

Activity

Experience

  • Gynger Graphic

    Gynger

    New York, New York, United States

  • -

    New York, New York, United States

  • -

    New York City Metropolitan Area

  • -

    Brooklyn, New York, United States

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    New York City Metropolitan Area

  • -

    Baltimore, Maryland Area

  • -

  • -

    Greater New York City Area

Education

Publications

  • Thermal Interface Material Characterization for Cryogenic Electronic Packaging Solutions

    CEC/ICMC

    As applications of superconducting logic technologies continue to grow, the need for
    efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade
    study of materials was done to develop a practical understanding of the properties of interface
    materials around 4 K. While literature exists for varying interface tests, discrepancies are found
    in the reported performance of different materials and in the ranges of applied force in which
    they are…

    As applications of superconducting logic technologies continue to grow, the need for
    efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade
    study of materials was done to develop a practical understanding of the properties of interface
    materials around 4 K. While literature exists for varying interface tests, discrepancies are found
    in the reported performance of different materials and in the ranges of applied force in which
    they are optimal. In considering applications extending from top cooling a silicon chip to
    clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was
    chosen for testing different interface materials. For each range of forces a single material was
    identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil
    clamped at approximately 445 N showed the highest thermal conductance. Results are presented
    from these characterizations and useful methodologies for efficient testing are defined.

    See publication

Patents

  • Temperature control method, system, and apparatus

    Issued US 10575437

    An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first…

    An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first subassemblies. A second temperature tank is formed by second perimeter frames and substantially surrounds the second circuit card subassemblies. A first temperature cooling supply line selectively introduces the first cooling fluid into the first temperature tank for at least partially inducing the first operating temperature. A second temperature cooling supply line selectively introduces the second cooling fluid into the second temperature tank for at least partially inducing the second operating temperature.

  • Cryogenic computing system with thermal management using a metal preform

    Issued US 10394292

    Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portion of the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved…

    Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portion of the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved. The computing system includes a second metal preform bonded to a portion of the second heat sink, where the second metal preform is configured to conform to the at least the portion of a superconducting component when the superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved.

  • Device and method for providing immersion cooling in a compact-format circuit card environment

    Issued US 10,165,707

    An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal…

    An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.

    See patent
  • Patent Pending, Cryogenic System D

    Filed US TBD

    Key contributor in conception of patentable idea.
    Literature review to assess and understand current state of the art.
    Leadership of technical direction, conceptual design, design reviews.

    (Early in the patent process, more detail to be added at a later date)

Projects

  • Robo_js (3js, Physijs, Socket.io, JavaScript, HTML5, CSS3, Webpack)

    - Present

    Real-time online multiplayer game on the browser
    • Built three dimensional browser based game with 3js and Physijs for an immersive user experience
    • Implemented Websocket Socket.io library to enable Real-Time data communication between server and client
    • Integrated Arduino hardware into Websocket server for mechanical feedback from in-game environment

    See project
  • Thingyverse (JavaScript, Ruby on Rails, React, Redux, CSS3, Webpack, PostgreSQL)

    - Present

    Fullstack clone of the thingiverse 3D printing site
    • Implemented CRUD for prints, likes, and collections of prints
    • Integrated AWS backend and photo file hosting to enable user file uploading
    • Created modular display cards that are reused throughout the site for both prints and collections
    • Built profile for users that only returns prints and collections that they’ve created

    See project
  • Additive Manufacturing, Northrop Grumman Innovation Research (SPARK)

    - Present

    • Development of additive manufacturing techniques used to enable complex hardware packaging.

  • Johns Hopkins, NASA proposal, Independent Research

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    Member of NASA team working on winning a CIF proposal.
    Develop prototype system for self-centering payload robots for the Moon and Mars.

    • Literature review of modular robotics, history of Mars exploration.
    • High level conceptual design.
    • Mechanism simulation.
    • 3D printed prototyping.
    • Tolerance analysis.

    Focus on docking mechanism for high speed connection between payload carriers.

  • MECH Mission to Mars

    -

Honors & Awards

  • MS Symposium Presenter

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    Cryogenic Supercomputing Presentation, hardware focused and in relation to C3 program

  • New Technology Award

    Northrop Grumman

    New Cryogenic Dip Probe Design

  • TAP Award

    Northrop Grumman

    Doubling test throughput through innovative cryogenic probe design.

  • ES Symposium Presenter

    Northrop Grumman

    Improvements to statistical qualification of aircraft hardware based on Mil-spec and Industry standards.

  • Good Engineering Award

    Northrop Grumman

    Update to proprietary testing process in Altitude Cycling of Hermetic Packages

  • Deans List

    Lehigh University

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