“Jonathan isn't just a competent mechanical engineer, he's also an artist, programmer, and expert problem solver. With an intense interest in refining his own logic and understanding of the world around him, Jonathan would easily become a valued asset for any company/organisation. With adaptability to perform in any setting, I recommend him for any and all positions -a great mind, and a great person.”
Jonathan Van Dyke
New York, New York, United States
545 followers
500+ connections
Activity
Experience
Education
Publications
-
Thermal Interface Material Characterization for Cryogenic Electronic Packaging Solutions
CEC/ICMC
As applications of superconducting logic technologies continue to grow, the need for
efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade
study of materials was done to develop a practical understanding of the properties of interface
materials around 4 K. While literature exists for varying interface tests, discrepancies are found
in the reported performance of different materials and in the ranges of applied force in which
they are…As applications of superconducting logic technologies continue to grow, the need for
efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade
study of materials was done to develop a practical understanding of the properties of interface
materials around 4 K. While literature exists for varying interface tests, discrepancies are found
in the reported performance of different materials and in the ranges of applied force in which
they are optimal. In considering applications extending from top cooling a silicon chip to
clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was
chosen for testing different interface materials. For each range of forces a single material was
identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil
clamped at approximately 445 N showed the highest thermal conductance. Results are presented
from these characterizations and useful methodologies for efficient testing are defined.
Patents
-
Temperature control method, system, and apparatus
Issued US 10575437
An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first…
An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first subassemblies. A second temperature tank is formed by second perimeter frames and substantially surrounds the second circuit card subassemblies. A first temperature cooling supply line selectively introduces the first cooling fluid into the first temperature tank for at least partially inducing the first operating temperature. A second temperature cooling supply line selectively introduces the second cooling fluid into the second temperature tank for at least partially inducing the second operating temperature.
-
Cryogenic computing system with thermal management using a metal preform
Issued US 10394292
Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portion of the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved…
Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portion of the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved. The computing system includes a second metal preform bonded to a portion of the second heat sink, where the second metal preform is configured to conform to the at least the portion of a superconducting component when the superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved.
-
Device and method for providing immersion cooling in a compact-format circuit card environment
Issued US 10,165,707
An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal…
An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.
-
Patent Pending, Cryogenic System D
Filed US TBD
Key contributor in conception of patentable idea.
Literature review to assess and understand current state of the art.
Leadership of technical direction, conceptual design, design reviews.
(Early in the patent process, more detail to be added at a later date)
Projects
-
Robo_js (3js, Physijs, Socket.io, JavaScript, HTML5, CSS3, Webpack)
- Present
Real-time online multiplayer game on the browser
• Built three dimensional browser based game with 3js and Physijs for an immersive user experience
• Implemented Websocket Socket.io library to enable Real-Time data communication between server and client
• Integrated Arduino hardware into Websocket server for mechanical feedback from in-game environment
-
Thingyverse (JavaScript, Ruby on Rails, React, Redux, CSS3, Webpack, PostgreSQL)
- Present
Fullstack clone of the thingiverse 3D printing site
• Implemented CRUD for prints, likes, and collections of prints
• Integrated AWS backend and photo file hosting to enable user file uploading
• Created modular display cards that are reused throughout the site for both prints and collections
• Built profile for users that only returns prints and collections that they’ve created
-
Additive Manufacturing, Northrop Grumman Innovation Research (SPARK)
- Present
• Development of additive manufacturing techniques used to enable complex hardware packaging.
-
Johns Hopkins, NASA proposal, Independent Research
-
Member of NASA team working on winning a CIF proposal.
Develop prototype system for self-centering payload robots for the Moon and Mars.
• Literature review of modular robotics, history of Mars exploration.
• High level conceptual design.
• Mechanism simulation.
• 3D printed prototyping.
• Tolerance analysis.
Focus on docking mechanism for high speed connection between payload carriers. -
MECH Mission to Mars
-
Honors & Awards
-
MS Symposium Presenter
-
Cryogenic Supercomputing Presentation, hardware focused and in relation to C3 program
-
New Technology Award
Northrop Grumman
New Cryogenic Dip Probe Design
-
TAP Award
Northrop Grumman
Doubling test throughput through innovative cryogenic probe design.
-
ES Symposium Presenter
Northrop Grumman
Improvements to statistical qualification of aircraft hardware based on Mil-spec and Industry standards.
-
Good Engineering Award
Northrop Grumman
Update to proprietary testing process in Altitude Cycling of Hermetic Packages
-
Deans List
Lehigh University
Recommendations received
2 people have recommended Jonathan
Join now to viewOther similar profiles
Explore collaborative articles
We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
Explore MoreOthers named Jonathan Van Dyke in United States
-
Jonathan Van Dyke
-
Jonathan Van Dyke
Communications Manager | Storyteller
-
Jonathan Van Dyke
General Manager at Duval's Fresh. Local. Seafood
-
Jonathan Van Dyke
17 others named Jonathan Van Dyke in United States are on LinkedIn
See others named Jonathan Van Dyke