Dhwani Vyas

Cadence introduces the Janus NoC for SoC designs.

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Transphorm GaN technology offers the most flexibility in power electronics. This is the result its ease of design, which is one of the cornerstones of our technology. Our SuperGaN FETs compete directly against silicon, silicon carbide, and e-mode GaN whether it’s how the device is driven or the package(s) it’s offered in. Up and above SuperGaN’s flexibility we also enable our SIP (System-In-Package) partners such as Weltrend with GaN FET solutions that compliment our discrete offerings. This results in a solution for all customers no matter their architecture or system needs. #supergan #gan #transphorm #reliability #Weltrend

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Nice low cost alternative to a fiber cable solution. No costly installation. And, the 60GHz spectrum is Unlicensed so NO spectrum reoccurring data usage costs is great for ROI.

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PCIe Gen6 + 5nm + MRVL SerDes = Lowest Power for AI!!

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The biggest message coming out of this year’s Qualcomm Investor Day is that both the present and the future look bright. How bright? Here are a few of the key takeaways from the event: ✅  We’ve seen strong growth and execution in FY24 ✅ Our recent positive performance is part of a larger trend ✅ We’re well positioned to take advantage of transformative growth opportunities ✅ Revenue growth forecast is strong In short, we are in the process of creating a new Qualcomm that has both a stronger growth profile and lower customer concentration. Important note: since this post has future-looking statements, be sure to check out the Qualcomm Safe Harbor Statement: https://lnkd.in/gW_YSMfE

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Just as we feared, our January 3 percent growth assumption for Q1-2024 has proved optimistic. The first quarter crashed, wiping US$13 billion off the quarter, which, in turn, has reduced our full year forecast by US$50 billion. Low unit sales, driven by ‘take of pay’ long-term price agreements (LTAs) from the Covid-boom era, are exacerbating industry attempts to rein back excess inventory. Just like the emperor’s new clothes, the supposed 2024 Super-Cycle has evaporated in a puff of smoke. It always was a delusion, Q1 removed all doubt. Visit our website for your copy of the May Industry Update Forecast Webinar side deck and video, see the highlights here: https://lnkd.in/evNyJxNH

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Very nice interview by Salah Nasri with Ron Huemoeller, providing insight into his background, experiences, and influences, and how he's using those to guide and grow #sarasmicrodevices!

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Interesting takeover bid to take ASMPT private by KKR. There is a lot of movement and potential consolidation in the advance packaging space, that’s growing fast, driven by AI applications. In particular hybrid bonding is of interest due to its use in 3D packaging and upcoming implementation for high bandwidth memory (HBM) stacks that are integrated with logic chips for AI processing. ASMPT has a strong packaging experience and a hybrid bonder with pretreatment modules from EVG on the market. An interesting twist is ASM International’s 25% stake in ASMPT, which has been an activist shareholder target in the past. Activists suggested in the past that there were no synergies between the companies and the stake should be divested for shareholders’ benefit. However, things change and I would argue that there are very strong synergies with ASMI’s deposition technology as ALD and new materials are introduced for advance packaging. Will be interesting to see how this plays out. #ALD, #ASMPT, #ASMI

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Congratulations to Flex Logix on this outcome. They helped bring much needed awareness to the capabilities and benefits of #eFPGA technology (I will have the yellow tradeshow booths permanently etched in my brain) . On a related note, this moment reminds me of the risk/reward tradeoffs associated with adopting start-up technology. Many years ago, we licensed sensor fusion software from a startup company. Shortly after going to market with that software embedded into one of our FPGAs, the startup company was purchased by a public company - and made a captive technology. That created a whole series of challenges for us - first and foremost was to make or buy an alternative so we could continue shipping. We decided to make, but in retrospect, buying (licensing) would have been much lower risk and lower overall cost. For those of you who may have been #FlexLogix customers and suddenly need an alternative eFPGA IP to fit your existing ASIC floorplan, or perhaps just FPGA User Tools support so you can reprogram your eFPGA cores years/decades into the future - DM me on LinkedIn. #eFPGA #FPGA #GlobalFoundries #GF #Intel #IntelFoundry #Samsung #TSMC #UMC

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⚡ Drive innovation at warp speed with #NXP's Partner Marketplace! Dive into a treasure trove of partner offerings designed to expedite your path to success.

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Great OFC coverage by LightCounting. TeraSignal’s Intelligent Re-Driver in CMOS is changing the power, reliability and performance calculus between DSP and LPO modules.

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In this episode of the "Quick Chip Series" on the Semiconductor Leadership Podcast, we dive into the remarkable journey of Qualcomm, a powerhouse in the semiconductor industry. On Youtube: https://lnkd.in/de6CY2Jw On Spotify: https://lnkd.in/dppbZi5C Join us as we uncover surprising facts and lesser-known stories about the company's rise to prominence. Did you know Qualcomm's name was almost different? What unexpected innovation sparked its success? How did a single invention revolutionize mobile communication forever? Tune in to discover these intriguing details and more. Subscribe to our YouTube and Spotify channels now to stay updated with our latest episodes and never miss an insight into the semiconductor world!

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Contract Price Increases Offset Seasonal Slump, Boosting #DRAM Q1 Revenue by 5.1%, Says TrendForce Corporation TrendForce reveals that the #DRAM industry experienced a 5.1% revenue increase in 1Q24 compared to the previous quarter. This growth—reaching US$18.35 billion—was driven by rising contract prices for mainstream products, with the price increase being more significant than in 4Q23. As a result, most companies in the industry continued to see revenue growth. The top three suppliers experienced a decline in shipments in the first quarter, demonstrating the industry’s off-season effect. Additionally, downstream companies had higher inventory levels, which led to a significant reduction in #procurement volume. As for ASP, the top three suppliers continued to benefit from contract price increases seen in 4Q23. With inventory levels still healthy, there was a strong intention to raise prices. #Mobile DRAM saw the highest price increase out of all applications thanks to strong sales of Chinese #smartphones. On the other hand, the price increase for consumer DRAM was the lowest among all applications, as manufacturers still need to clear their inventories. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eXyJeY8D #semiconductorindustry #semiconductors #semiconductor #technology #tech #informationtechnology #memory #smartphones #pc #notebook #server #mobile #artificialintelligence #ai #aiot #chip #chips #geopolitics MEMPHIS Electronic Intelligent Memory Neumonda Samsung Electronics Micron Technology SK hynix Nanya Technology Winbond

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June 20 In-person Seminar: Quantum Dots for MicroLEDs https://lnkd.in/gE5Xcv6v MicroLEDs promise to play a major role in future display products: they are tiny, bright, power efficient, and long-lasting. However, transferring huge numbers of Red, Green, and Blue devices from the wafer to the display surface adds complexity and cost. MicroLED products can be more easily manufactured by using a single type of LED that can emit R, G, or B. One approach is to use only blue LED’s, then pattern a Color Conversion Layer so that B can also produce R or G. NanoPattern Technologies, Inc. makes Quantum Dot CCL’s without requiring vacuum. This greatly simplifies the deposition and patterning processes. Please join us on June 20 at Eurofins | EAG Laboratories in Sunnyvale with NanoPattern’s CTO, Danielle R. Chamberlin. #quantumdot #microled 

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Devices that benefit most from LPDDR4X are those requiring efficient power management and high-speed data processing, such as smartphones, tablets, and other portable or embedded systems. Its low voltage operation and high data rates make it ideal for running advanced applications and handling demanding tasks.

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Efficiency is key to enable AI at the edge. In this video our VP of AI, Carlos Morales shows how efficiently and fast Ambiq Apollo5 (Cortex M55 on SPOT) can classify images. Reach out to hear more if you are curious! #edgeAI #CortexM55 #arm #efficiencymatters #subthreshold #SPOT #edgecompute #innovation #semiconductors

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And the right course it is!

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Tech Thought #1 Innovations Beyond HBM in Memory Technology Exciting advancements are on the horizon beyond HBM in memory technology. HBM3 is poised to elevate bandwidth and capacity for demanding applications, while Memory-Class Storage (MCS) merges memory and storage features for enhanced speed and capacity. Persistent Memory (PMEM) offers a blend of DRAM-like performance and storage durability, propelling innovation in data processing efficiency. Furthermore, breakthroughs in 3D integration, like 3D NAND and 3D DRAM, promise heightened storage density and performance. Neuromorphic memory, inspired by neural networks, and Quantum memory, harnessing quantum states, hold the potential to revolutionize speed and capacity in memory technology. Reconfigurable memory architectures are also set to adapt to diverse workloads, optimizing performance across various applications. These advancements collectively mark a significant leap forward in memory technology, paving the way for a future that goes beyond the capabilities of HBM. #MemoryArchitecture #3DMemories #HBM #SpintronicsAI

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We’re one day into DAC, and there have already been announcements that will shape the future of semiconductor design. One startup that I've followed closely for two years shared groundbreaking news that promises to revolutionize chip development and democratize accessibility to chiplets. Baya Systems emerged from stealth mode last week, and CEO and co-founder Sailesh Kumar has done a remarkable job of staying under the radar since founding the company, choosing the perfect moment to unveil updates. Baya revealed not only WHAT they’re working on but also HOW they plan to tackle some of the most pressing challenges faced by SoC architects and designers, and it’s inspiring. The complexity of system design, high costs, and long time-to-market for advanced SoCs often means that a chip can be nearly obsolete by the time it reaches customers. The rapid pace of innovation, especially in AI chips, creates an unforgiving environment where promising startups might only have one shot at success. Baya’s solutions, WeaverPro and WeaveIP, aim to accelerate the design and performance of complex single-die and multi-die SoCs and chiplets. By leveraging a software-centric architecture, Baya simplifies development and accelerates data movement between chiplets and dies. This approach reduces the overall costs associated with advanced AI and CPU acceleration and speeds up time-to-market. WeaverPro and WeaveIP have already received the best kind of acclaim, customer adoption, and Baya announced this week that chiplet technology advocate Tenstorrent will license their WeaveIP fabric to scale their AI and RISC-V chiplet solutions. Chip design icon Jim Keller, who sits on Baya’s Advisory Board, praised the company, saying: “Baya makes great, comprehensive fabric tools that start with top-level architecture and allow us to plan at a detailed level… this, coupled with their visualization tools, enables designers to build next-generation chips, chiplets, and IP.” Adding to their momentum, Baya announced a partnership with Blue Cheetah Analog Design, Inc. yesterday at DAC and introduced a combined chiplet-optimized Network on Chip and PHY interconnect IP solution that simplifies the design and architecture of chiplet-based systems. Sailesh said, “In partnership, we provide system architects with a state-of-the-art platform and powerful tools to create the most innovative and cost-effective chiplet-based products.”   I've mentioned before that enabling development is key to unlocking the door to innovation. For founders without deep pockets or connections to investors, gaining access to better tools and proven intellectual property allows them to move faster and at a lower cost, ultimately helping to bring new designs to life. I’m impressed that Baya, a small yet mighty startup, has created this accessibility and fostered partnerships to help proliferate it. My encouragement to the community - watch them closely. #semiconductorindustry #ai #chiplets

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