Robert Hand

I’m excited to be the new owner of a state of the art molecular beam epitaxy (MBE) system currently set up for epitaxial Ga/Mn/As/Ge heterostructure growth .. I’ll be installing this bad boy in my old Virginia Cleanroom fab near Virginia Tech where I started my first silicon micro-machining and thin films company 30 years ago in a burnt down church- ACT MicroDevices. The clean room there never had such good company as this guy. I spent my first decade there (and at its sister facilities with our growth) working on silicon micro machining and micro optics for hybrid optoelectronics and their packaging - esp for integrated optics and advanced fiber optic applications like laser die wafer level hermetic packaging. In one project - I multilayer AR coated over 2 million sub millimeter discrete precision micro-optics for Lucent for fiber optic backhaul networks - for their “Laser 2000” program - a SiOB based laser transmitter. I ran it in a LPVCD tube furnace I modified. This ended up being the most profitable job I ever did though I bid it at cost to win the project. I was able to transition from 10k lenses in a batch to 60k in a batch in less than a year. Due to careful engineering of the coating layer stresses we ended up becoming their sole source at ~20 cents per lens. Why did coating stress engineering matter? This is because with sub-mm lenses on SiOB platforms you can’t use epoxy - they were solid state bonded to 3um Al deposited in a <111> inverted pyramid in the silicon chip at the 4 tangential contact points- the final layer compressive was key to high shear. Ok - Back to the “why” on the heteroepitaxial growth… high delta N ridge waveguide SOI integrated optics were always held back by needing to hybridly integrate lasers and detectors (Intel)… meanwhile GaAs / InP were just too expensive and fragile for complex and large integrated optical systems. Enter recently a new pioneer: heteroepitaxial Ge on Sapphire https://lnkd.in/gschJcuB follow by direct active layers … I’m now thinking -as the Mandalorian says -“this is the way” :) viz: Integated Microwave Photonic Circuits See: “Integrated microwave photonics” Nature Photonics volume 13, pages 80–90 (2019) https://lnkd.in/gAhxui35 For me - a marriage of my first love in optoelectonics (Si-Pak) with my second - advanced microwave/mm-wave circuits (PolyStrata) into something new, far smaller, more integrated and faster. Who wants to collaborate? I haven’t worked with big UHV ion pumps on MBE since high-school when I brought them home from the local tech junkyard with ln2 “sorption” pumps to rough your UHV chamber .. I always thought it was cool that you could use diminishing pump discharge current to measure your UHV degree of success - something that takes less energy the better it gets! What else takes less energy the better it gets 🤔 Photo of my new system below from the manufacturer. (racks of controllers not shown).

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NEED PRECISION OPTICAL METROLOGY? AOM IN TUCSON, AZ, HAS ANSWERS. I’ve just been talking to Tyler Steele, part of the dedicated team working with AOM - Arizona Optical Metrology LLC. Established in 2009, they are well-known globally as a leading computer-generated hologram (CGH) supplier for the world’s most challenging optical engineering projects. Often, metrology is the limiting factor in fabricating complex optical surfaces, as methods for qualification and feedback are not precise, flexible, or capable enough. A CGH overcomes many of these surface testing challenges to make optical surface qualification feasible for most complex surfaces while maintaining precision, resolution, and speed. EXPANDING HORIZONS Now, AOM are reaching out to bring CGH technology to a broader set of optics and photonics applications. Complex optics are being used more widely than ever–and at precision and production volumes that seemed impossible just a few years ago. The challenges these applications face are on par with the biggest space telescope projects of the past, but with a fraction of the budget and extremely tight timelines to complete. Think of the volume market for AR glasses. AOM - Arizona Optical Metrology LLC is delivering new and novel solutions to optics projects and programs to address this new world of optics production. They enable a new level of precision and ease of use for complex optics metrology from surface figure error of aspheres, freeforms, and off-axis sections to optical system alignment. A CGH converts an interferometer regular wavefront (collimated or spherical) into a custom-designed wavefront that matches the unique shape of the surface to be tested. The result is an interferometric null test when the test optic is well aligned to the CGH. In my conversation below, Tyler answers the Optica question: What can you do for other Optica corporate members, and what can they do for you? Quite a lot, it seems. Together, the future of optics is very bright indeed! Contact them directly or drop me a line for an introduction.

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TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025 💡 In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, #TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC #N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025. TSMC states that 'N2 development is well on track and #N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb #SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production. Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eHgpfX4k #semiconductormanufacturing #semiconductors #semiconductor #tech #technology #innovation #chip #chips #integratedcircuits #ic #foundry #taiwan #geopolitics #asml #thenetherlands #europe #euv #computer

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T-ray enabled isosurface imaging is a great tool for visualization and metrology.

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As the growth chart for gallium nitride (GaN) wafer demand is looking more like a hockey stick, it’s apparent that innovators who have long believed in the merits of GaN are being proven right. A private company in El Segundo, CA that predates some of the other startups in the GaN-based power IC space by more than a decade has been hard at work developing solutions in this space for over seventeen years. That company is EPC - Efficient Power Conversion and I got a firsthand look at some of their solutions when I was at the 2024 APEC Conference. They were co-founded in 2007 by a luminary of the power IC industry and CEO Alex Lidow. Lidow was at International Rectifier for over thirty years and had leadership positions spanning R&D and manufacturing. He was even their CEO for 12 years. As co-inventor of the silicon power MOSFET in the 1970s, his seminal work has shaped development in this sector. Lidow was flanked by Joe Cao and Robert Beach, both of whom have also made their own impact. Cao had over 15 years of experience and more than 30 patents in developing GaN and silicon power device technologies before deciding to embark on the quest with Lidow. Beach had founded multiple companies aimed at bringing GaN ICs to the marketplace before partnering with Lidow and Cao, making him a perfect complement to their triumvirate. What put EPC on the map was the development of their proprietary enhancement-mode GaN (eGaN) transistors which they released in June 2009. Unlike traditional MOSFETs, which used built-in channels between the drain and source, eGaN MOSFETS had no such channel. eGaN MOSFETs’ have small geometry, low power dissipation, and are easy to manufacture, making them desirable for a wide array of applications. The founders also had the foresight to manufacture using a foundry meant to produce silicon devices and were able to create a mature, efficient, and low-cost supply chain to bring new products to market quickly. Nowadays, newer companies in the space are gaining similar traction using this approach, but it’s safe to say EPC was a pioneer and began to reap the benefits decades ahead of competitors. This is another key element that differentiates them. In my experience, “mature startups” tend to be modest organizations, often letting their technology speak for itself and not over-indexing on marketing their brands to potential talent. But the hiring landscape is far more competitive than it was when they started and the allure of high-growth startups can be attractive for talented engineers. EPC’s goal is to enable companies to develop their technologies by leveraging the power of GaN and avoid being left behind by developing on silicon. That, combined with their lengthy market presence and leadership team, are strong elements to highlight and EPC would be well-served to fold these details into their talent attraction messaging. #semiconductorindustry #galliumnitride #powermanagement

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#AMKOR Wins $600 Million in US Grants, Loans for #Chip Packaging - Company investing $2 billion, creating 2,000 #jobs in #Arizona - Facility will package Apple #chips manufactured at TSMC Amkor Technology, Inc.  is in line to receive $400 million in US government grants and about $200 million in loans for an advanced chip packaging project in #Arizona, marking the latest award from a program designed to boost American #semiconductormanufacturing. The funding from the 2022 Chips and Science Act will support Amkor’s $2 billion facility in the city of #Peoria, which is estimated to generate about 2,000 jobs. The site is slated to package chips manufactured for #Apple Inc. at Taiwan Semiconductor Manufacturing Co.’s sprawling new #Phoenix complex. Thanks again to Mackenzie Hawkins and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eCnSrUki #semiconductor #semiconductorindustry #semiconductors #technology #tech #informationtechnology #advancedpackaging #geopolitics #it #ai #chipsact #samsung #micron #tsmc #globalfoundries #microchip #ic

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GD4 Test Services, Inc. (“GD4”) is an independent, privately-owned electronic component third-party test lab that has maintained its ISO 17025 accreditation 4 years running. Now, although GD4 is labeled a test lab, our employees act more like private investigators. Constantly sifting through and searching for the “devil in the details” among electronic components. That devil has a name, too, and its name is “Counterfeit.” Companies across the globe have come to trust in GD4’s capabilities to identify whether a component is counterfeit or valid. This daily feat is accomplished through rigorous testing by identifying anomalies or performance issues that may indicate suspicious and/or counterfeit activity. The industry has created multiple standards to combat counterfeiting, including AS6171 and AS6081.  AS6171 testing includes, but is not limited to, Electrical Testing, Visual Inspection, Decapsulation, XRF, Thermal Temperature Cycle, Solvent/HCT testing and more.  Both standards are effective in combating counterfeits as they have rounded approaches, though AS6171 goes into much more detail, and GD4 is qualified and certified to both standards. Thanks to our diligence, reliability, responsibility and high regard for industry standards, GD4 is quickly becoming the leader in unbiased electronic component testing and services industry-wide. Tasked in 2007 to address aspects of preventing, detecting and counteracting the growing risk of counterfeit electronic components, several agencies banded together to ultimately create AS5553 which was adopted by the United States Department of Defense in August of 2009. It was created for the sole purpose of preventing counterfeit parts from entering into the Global Supply Chain. Fast-forward years later and AS6171 (a standard that can be traced back to the AS5553) is the industry standard by which GD4 prides itself when it comes to mitigating counterfeit risks affecting the global supply chain. If your company or your clients are unsure of the electronic components you buy or possess, put your mind at ease by trusting GD4 Test Services with your testing needs. To request a quote or a complete listing of our capabilities and certifications, contact us directly: Call: 1-512-535-1677 now or email: [email protected]

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According to reports Qualcomm is likely to use UMC (note: another foundry) for its advanced packaging needs likely WoW (Wafer on Wafer) Hybrid bonding. Trial product likely starting in mid-2025 with full production expected in 2026.

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TSMC's Arizona facility has achieved production yields comparable to its established plants in Taiwan, indicating strong progress in its U.S. operations. The trial production at the Arizona plant uses advanced 4-nanometer process technology, essential for maximizing chip performance and efficiency. Despite a delay in full production until 2025 due to skilled labor shortages, the U.S. government plans to support TSMC with $6.6 billion in grants and up to $5 billion in loans to enhance domestic semiconductor manufacturing. #TSMC #4nm #TSMCArizona #semiconductor #semiconductors #technology #ChipsAct #chip #yield #semiconductormanufacturing Read more https://lnkd.in/dcyNGDyd

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🌟 Elevate Your Semiconductor Team with Top Talent! 🌟 Are you in the semiconductor industry and seeking to strengthen your team with top-tier talent? Look no further! Our expert semiconductor direct hire recruiting services with NSOURCE at WGNSTAR are tailored to match your company's unique needs and propel your business to new heights. With a deep understanding of the intricacies of the semiconductor field, we specialize in identifying and attracting highly skilled professionals who possess the technical prowess and innovative mindset necessary to thrive in this dynamic industry. Here's why partnering with NSOURCE for your semiconductor direct hire needs is a game-changer: Industry Expertise: Our team comprises seasoned recruiters with a comprehensive understanding of the semiconductor landscape, enabling us to pinpoint candidates with the precise skills and experience you require. Extensive Network: Leveraging our vast network of industry connections and proprietary database, we access a pool of talent that may not be readily available through traditional channels, ensuring you have access to the best candidates in the market. Tailored Approach: We understand that every company has unique requirements and culture. That's why we take a personalized approach to recruitment, aligning our efforts with your specific goals and values to find candidates who not only possess the right skills but also fit seamlessly into your organization. Efficiency and Timeliness: Time is of the essence in the fast-paced semiconductor industry. Our streamlined recruitment process is designed to deliver results swiftly, allowing you to fill critical positions without delay and maintain your competitive edge. Long-Term Partnerships: We're not just here to fill a vacancy; we're committed to fostering long-term partnerships that drive your success. By understanding your strategic objectives, we can assist in building a robust team that propels your company toward its goals. Don't settle for mediocre talent when you can have the best. Let us be your trusted partner in semiconductor direct hire recruitment, and together, we'll take your team to the next level of excellence. Connect with us today to discuss how we can support your recruitment needs and empower your semiconductor business for sustained growth and innovation. Your success starts with the right people, and we're here to help you find them! #Recruiting #Hiring #NSOURCE #WGNSTAR #Semiconductor #Recruitment #DirectHire #TalentAcquisition #TechIndustry 🚀✨

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TSMC 3nm chip output to rise over 300% in 2024, says fab director 🤯💡 #TSMC is scaling up its 3nm #chip output, which in 2024 will be over three times that of 2023, according to Y. K. Hwang, company senior director for Fab 18B. The #Taiwan session of TSMC's annual #technology symposium, held on May 23, followed the same theme as the North American session in April. Nonetheless, TSMC CEO C. C. Wei did not appear on stage for the Taiwan session. New faces such as Hwang shared additional details on the foundry's capacity development strategy and future fab projects. Hwang oversees TSMC's Fab 18B located at the Southern Taiwan Science Park (STSP), responsible for manufacturing 3nm chips. Hwang stated at the symposium in Hsinchu that TSMC is expanding its production capacity for 3nm technology; however, a shortage persists. To satisfy customer demand, the #foundry will further boost its production of 3nm #chips. A big thank you again to Monica Chen , Jessie Shen and DIGITIMES Asia for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ewby8hnG #semiconductorindustry #semiconductormanufacturing #semiconductor #semiconductors #technology #tech #innovation #foundry #geopolitics #it #ai #aiot #automotiveindustry #consumerelectronics #datacenters #nvidia #apple #amd #intel #smartphones #cloudcomputing #hpc #pc

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Fine-tuning your image signal processor is a challenging engineering endeavor, yet it is crucial for ensuring top-notch digital image quality. It's time to delve into the intricacies of this process and discover the support and tools at your disposal to successfully navigate these hurdles.

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This article was from Cherry Semiconductor in 1996. Q) What topology?

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Why NVDA should buy INTC... Intel has been struggling a lot lately with it's stock price down to a low of $18.84 from over $50 this past year. I remember hearing old timers at Intel refer to the company as a manufacturing company, not a microprocessor company. The true strength of Intel is its production and packaging. The company even famously pivoted from producing DRAM to processors in the 1980's. Microprocessors served them well for decades as computation and Internet scaled. However, the centrality of the microprocessor in computation today is diminishing, displaced by AI. Intel is trying to develop it's own AI hardware with very limited success, and the company enterprise valuation has shrunk to $110B Nvidia meanwhile, with its $2.6T enterprise valuation has the world's most lucrative ASIC product but can't produce enough of them. It seems to me like a perfect opportunity for Nvidia to buy Intel and complete their pivot to AI from microprocessors. I think it could do this on a all stock basis even. Nvidia would acquire the ability to manufacture it's own chips which could unleash new capabilities and profits. There are numerous other benefits like preventing Intel from failing and reshoring manufacturing of critical technology to America Intel is too important to fail and I am bullish on it's long term prospects

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Interesting video about the pros and cons of two different gage study methods.

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TSMC is slowly but surely expanding the number of major US based clients to manufacture in the Arizona plant. This is most crucial from a US domestic manufacturing capability perspective and a secure supply chain in this age of uncertainty. However a lack of CoWoS and advanced packaging capability of TSMC in the US means the supply chain risk is still not resolved. Perhaps OSATs like Amkor in their Arizona facility can step in to fill in the void of advanced packaging demand in the US.

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Transphorm GaN technology offers the most flexibility in power electronics. This is the result its ease of design, which is one of the cornerstones of our technology. Our SuperGaN FETs compete directly against silicon, silicon carbide, and e-mode GaN whether it’s how the device is driven or the package(s) it’s offered in. Up and above SuperGaN’s flexibility we also enable our SIP (System-In-Package) partners such as Weltrend with GaN FET solutions that compliment our discrete offerings. This results in a solution for all customers no matter their architecture or system needs. #supergan #gan #transphorm #reliability #Weltrend

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NY senator breaks a spoiler to AP: Micron Technology to receive $6.1B from the Chips Act. Excerpts from Boise (Idaho) Development : "Micron Technology will get $6.1 billion from the CHIPS Act to fund large-scale expansions in Boise and Syracuse, NY. ... Micron has started work on a $15-billion expansion of its Boise campus, which would add significant new research and development capacity to the site off Federal Way. The City of Boise annexed nearly a square mile of new land for Micron, and work has begun on initial infrastructure. The Boise expansion would add nearly 2,000 local jobs, the company said. ... In addition to the federal funds, Micron will get incentives from the State of Idaho as well as some non-direct assistance from the City of Boise, as BoiseDev previously reported. ... Micron will also build a nearly $100-million facility near Syracuse, New York, which Schumer said to the AP is the largest single investment in that state since the Erie Canal. ... Schumer told Syracuse.com that the deal was preliminary and non-binding and could be announced next week. ... Correction: A prior version of this story incorrectly stated that the reported mount was $5.1 billion. It is $6.1 billion." https://lnkd.in/gCByqhnb

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