Barry O'Connell

Unlocking Profitability: Power of designing for reliability in reducing life cycle costs Have you ever wondered why some equipment (products) seem to be a constant headache, requiring frequent repairs and maintenance, while others just keep running smoothly? The answer lies in the design phase, where the foundation for reliability is laid. Consider this shocking fact: In the industry, design and development account for only 5-10% of the total life cycle costs, while a staggering 65-85% is spent on operations and maintenance. The key takeaway? Prioritizing reliability during the design and testing stages can significantly reduce costs associated with breakdowns, repairs, and downtime throughout the equipment's (products’) lifespan. ✅To achieve this, you need to: - From Day One, instruct, guide the design engineering team and instil and solidify the   importance of Reliability - Work closely with suppliers and manufacturers - Ensure reliability is a top priority from the get go - Engage with their design teams - Demand maintainability and reliability specifications - Insist on proven engineering practices that prioritise longevity Remember, the initial purchase price is just the tip of the iceberg. By focusing on designing for reliability, you'll enjoy: - Increased productivity - Reduced downtime - Smoother operations - Significant savings on life cycle costs Don't let short-sighted decisions lead to costly consequences. So many companies (buyers) concentrate on cheaper costs and not on robust and proven designs Embrace designing for reliability, and watch as your equipment's (products) performance soars while life cycle costs shrink. In short, Reliability has to be instilled in every design engineer of every product and not taken for granted or an afterthought. For more detailed info on Reliability & Testing, visit us at www.reliatestlabs.com #ReliabilityTesting #SystemReliability #PerformanceTesting #StressTesting #LoadTesting

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In my new role at Sondrel, I wanted to offer my thoughts and views that we are seeing in the current semiconductor industry. I hope you find this article informative.

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2024 Wafer Fab Equipment revenue will remain stable before a 2025 surge Wafer Fab Equipment (WFE) revenue is estimated to increase in 2024 by +1.3% year-on-year (YoY) to $108.1B. This is due to a WFE expenditure increase across advanced logic as well as #NAND and #DRAM memory, while legacy node investment is robust. Stronger 2024 growth in service and support revenue is expected, at + 6%YoY to $23.5B, due to increasing fab utilization rates worldwide. In the long term, WFE revenue is expected to have a +4.3% CAGR24-29, reaching $133.7B in 2029, while service and support revenue will be $27.6B in 2029, at a +3.3%CAGR24-29. The moderate growth rate is due to the large WFE revenue increase in 2021-2022, which is related to the large demand for semiconductor devices. As device revenue declined in 2023, the ratio of WFE revenue as a % of semiconductor device revenue reached as high as 19%. In particular, investments in Greater #China (domestic and foreign) ensured the overall WFE did not decline in 2023, and similar investment levels should continue in 2024. However, such high #investments by #chipmakers will not be sustainable in the long term and are expected to decline slowly due to continuous WFE buyouts, with capacity exceeding production needs, governmental incentives, and general increases in chip production costs. Thanks again to Yole Group for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejy-Ve2k #semiconductorindustry #semiconductors #semiconductor #technology #tech #it #innovation #chip #chips #foundry #geopolitics #ic #ai #iot #ml #informationtechnology #datacenter #computer #hpc #data #cloud

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Every single person on your team — no matter what their position is — should know and live by your company’s values. When I first joined Coherent Corp. (known as II-VI at the time) as a board member, we had 7 values. They were printed on the back of everyone’s business card but, still, I could never remember them all. In the wake of a large acquisition, I was walking around various facilities and chatting with everyone. I asked if anyone knew what our company’s values were — and no one knew them! That was a hint of an opportunity. I realized that the acquisition was a period of transformation for the company, and it was an opportunity to revisit our values. I remember studying the values of all the S&P 500 companies for inspiration, taking into consideration the founding values of II-VI as well as the values of the companies we had acquired. Eventually, I decided on: ICARE which stands for integrity, collaboration, accountability, respect and enthusiasm. Taken in that order, they have allowed our team to declare “I care” as the primary reason for working at Coherent and helping change the world. I firmly believe that values (and sticking to them) are integral to a company’s success. This might be a little bold to say but as far as I know, today, there’s no one in the company that doesn’t know what our values are.

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Another innovative American semiconductor customer benefiting from our yieldHUB system. Re automation: "We needed to minimize and remove the low-value, low-impact work from our engineers."

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𝗪𝗵𝘆 𝘁𝗵𝗲 𝗥𝗶𝗴𝗵𝘁 𝗧𝗼𝗼𝗹𝘀 𝗔𝗿𝗲 𝗞𝗲𝘆 𝘁𝗼 𝗞𝗲𝗲𝗽𝗶𝗻𝗴 𝗙𝗮𝗯 𝗣𝗿𝗼𝗷𝗲𝗰𝘁𝘀 𝗼𝗻 𝗧𝗿𝗮𝗰𝗸 I’ve seen firsthand how projects can get bogged down when teams rely on outdated methods. In semiconductor fabs, the tool install process alone can involve tracking thousands of moving parts—from electrical connections to chemical lines—and doing it right takes time. Each tool needs an average of 47 hours to be set up properly. With hundreds or even thousands of tools in a fab, the costs and delays from a single misstep add up fast. Our latest report highlights a problem I’ve encountered myself: an over-reliance on spreadsheets. They may seem manageable, but spreadsheets often create more issues than they solve. Without a unified digital source, each team member may be working from their own version of “the truth.” It’s easy to see how errors pile up when everyone isn’t looking at the same, up-to-date data. These errors don’t just slow projects down—they’re costing the industry over €𝟮𝟬𝟬 𝗺𝗶𝗹𝗹𝗶𝗼𝗻 𝗮 𝘆𝗲𝗮𝗿. 💸 Digital transformation is about more than just upgrading tools. It’s about equipping teams with a single, reliable source of information, enabling real-time updates, and reducing repetitive, manual data entry. When a change is made, that update needs to flow across the entire project seamlessly. That’s why the shift to digital is critical—not just for efficiency but for accuracy and, ultimately, cost savings. Our report dives into this, and it’s packed with insights into how AI and automation can optimize fab construction and operations, giving engineers the real-time insights they need to get ahead of potential delays. If you’re interested in learning more about these solutions, check out the full report here 👇 No sign-up is required. https://lnkd.in/eD4K5xpH #DigitalTransformation #Semiconductors #Manufacturing #Innovation #AI #Automation #ProjectManagement #Basesite

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As we approach Christmas and close out December, I’m reminded of what a monumental year 2024 has been for SBT. We celebrated 35 years of continuous recruiting in the semiconductor industry! Reflecting on three and a half decades, I feel an immense sense of pride in the collective impact we’ve made—helping engineers, leaders, and executives find roles where they could thrive and shape the future. But even more profound than our impact on them is the impact these people have had on US! Whether it’s working on power ICs to make datacenters more energy-efficient for AI workloads or developing processors that enable breakthroughs in medicine, hunger, or renewable energy, every conversation reminds me why this industry is so critical to the world. 2024 was also a turning point for me as a recruiting leader and talent advisor. For the first time in my two decades of recruiting, I stepped into the spotlight—inviting founders, executives, and investors to share their stories through video conversations. I asked the burning questions that keep me thinking about our industry’s future, and their responses opened my eyes to incredible insights, and where we’re heading in the year ahead. The result? I had the privilege of having one C-Suite Spotlight interview each month—twelve thought-provoking conversations with leaders who shared their journeys, their companies’ origin stories, their insights into emerging technologies, and, most importantly, their perspectives on talent and building teams. These discussions brought many different facets of the semiconductor industry to light, and for that, we should all be deeply grateful to: Hugh Chow, CEO of ventureLAB; Calista Redmond, CEO of RISC-V International; Shashi Kiran Chilappagari, CTO of DeGirum; Charlie Hong-Men Su 蘇泓萌, CTO and President of Andes Technology Corporation; Richard Fung, CEO of The Six Semiconductor; Srini Ananth, Managing Director of Intel Capital; 劉峻誠Albert Liu, CEO of Kneron; Dan Nilsson and Atif Zafar, CEO and Chief Scientist of X-Silicon Inc; Niraj Mathur, COO of Blumind; Roger Peene, VP of Product and BD at MemryX Inc.; Bob Beachler, VP of Product at Untether AI; and Sumeet Kumar, CEO of Innatera. If you have a quiet moment during the holiday season, I encourage you to revisit these conversations (link in the comments) because each one is like a gift, packed with insights, and I’d love to hear which ones resonate with you most. Looking ahead to 2025, I’m energized by what’s to come. There are more stories to tell, more leaders to spotlight, and more inspiration to share. Stay tuned—because this has only just begun. 😉 #semiconductorindustry #startups #leadership

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Great article on an update at SkyWater Technology from our COO:

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It would be far better for the federal entities involved in these semiconductor sustainment / advancement initiatives to broker a "spin-out" aimed at mainstream and trailing edge technologies for HiRel markets, intact. Everything else wastes working manufacturing capability and the mature nodes are the most exposed to this kind of "profit driven obsolescence". Industrial Base Analysis and Sustainment - anybody home? MCEIP - anybody home? DPA Title III - Anybody home? SRHEC - Anybody home? What could "we" do with a wide open fab full of working equipment and staff? Stomp all over microcircuit obsolescence, is what. Make it a public benefit corporation, screw the profit motive that tanks it all in the end, and get on with building back missing-piece parts for hard core applications that sell for fair prices.

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At the Electronica 2024 conference, a one-panel discussion stood out as a “Mount Rushmore” of SiC and GaN technology. Moderated by Maurizio Di Paolo Emilio this discussion brought leaders together from five companies that are true pioneers in wide-bandgap semiconductor innovation and represent the future of power electronics. Trying to capture all their insights would take too much space, but some of the highlights include: Alex Lidow talked about EPCs sixth-generation GaN devices, emphasizing their cost-effectiveness and efficiency compared to silicon. He noted that GaN is at the forefront of key applications like LiDAR motor drivers for EVs and power supply and conversion for AI-driven data centers. He also highlighted their role in emerging markets like humanoid robotics. On the SiC side, Guy Moxey from Wolfspeed discussed how SiC is leading the charge in industrial and automotive applications and pointed out the transition from silicon-based IGBTs to SiC in these applications. Despite Wolfspeed’s organizational challenges, we shouldn’t overlook their contributions to advancing SiC technology and production. Wolfspeed has truly set the stage for others. Douglas Bailey of Power Integrations bridged the gap between GaN and SiC, explaining how their products integrate GaN flyback converters capable of operating at up to 1700 V, making them ideal for DC-DC applications. He emphasized GaN’s scalability for low-current applications, such as consumer electronics, and its expanding footprint in automotive auxiliary power systems. Professor Florin Udrea of Cambridge GaN Devices Ltd. brought attention to GaN’s growing presence in high-power conversion and increased market adoption that has resulted, in part, from efforts to perfect new manufacturing methodologies – such as GaN-on-Si technology – which leverages existing silicon manufacturing infrastructure. The group discussed challenges to wider WBG adoption, such as manufacturing reliability and performance perceptions. Lidow explained how advancements in device design have made reliability issues negligible, while @Llew Vaughan-Edmundsof Navitas Semiconductor described new topologies like trench-assisted planar gate MOSFETs breaking perceived SiC performance limits. As the panel concluded, a sentiment that stood out to me was: that there should be increased collaboration in the power sector. While the global giants may want to keep their innovation to themselves, these leaders all seem to agree that the future of power electronics will be defined by leveraging complementary strengths. This could be one of the most practical ways to accelerate the wider adoption of GaN and SiC and if the panel was any indication, these companies aren’t just shaping the future—they’re establishing a foundation of collaboration that could be as monumental as any of the technologies they develop, and has the potential to lift the entire industry. #semiconductorindustry #galliumnitride #siliconcarbide

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According to reports Qualcomm is likely to use UMC (note: another foundry) for its advanced packaging needs likely WoW (Wafer on Wafer) Hybrid bonding. Trial product likely starting in mid-2025 with full production expected in 2026.

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Cadence Design Systems is proud to support PCI-SIG at FMS: the Future of Memory and Storage

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This is a great article from Phoronix and highlights the significant performance value of SMT.. And if you are in an environment where it isn't as valuable, it is very easy to turn off. Lots of passionate arguments in the industry about SMT vs no-SMT, but it is a feature and it is important to remember that you can turn it on or off :) https://lnkd.in/gBbnsBgj

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Intel Corporation CEO Pat Gelsinger Steps Down Amid Challenges and Restructuring Efforts Intel has announced the immediate retirement of CEO Pat Gelsinger, who also steps down from the board of directors. CFO David Zinsner and Michelle Johnston Holthaus have been named interim co-CEOs as the company searches for a new leader. Gelsinger, a 40-year Intel veteran who returned in 2021, led the company through a tumultuous period marked by a 61% stock price decline, the largest layoff in Intel’s history (up to 17,475 employees), and efforts to regain process leadership via its IDM 2.0 strategy. Despite some progress, challenges persisted, including delays in product launches, declining competitiveness against AMD and Arm, and a limited presence in the booming AI market. While Gelsinger’s tenure stabilized manufacturing with a roadmap for five nodes in four years, Intel’s fortunes now hinge on the success of its upcoming 18A node, which shows promising early signs. The leadership transition signals continued restructuring, with a focus on product leadership and process innovation. The industry will watch closely as Intel navigates this pivotal moment in its 56-year history. Thanks again to Tom's Hardware for the full article with more background and insights click the source link in the comments below. #Semiconductors #Intel #LeadershipTransition #TechIndustry

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Efficient Power Conversion Corp (EPC), headquartered in El Segundo, CA, specializes in gallium nitride on silicon (eGaN) power FETs and integrated circuits for power management applications, with recent validation of their GaN intellectual property rights by the US International Trade Commission (ITC). The ITC upheld EPC's patents and found Innoscience Technology Co Ltd guilty of infringing EPC’s foundational patent, potentially leading to a ban on importing their products into the USA. This ruling is a significant validation of nearly two decades of EPC's hard work and research, reflecting the importance of their intellectual property portfolio. The ITC's final determination is expected on November 5. Innoscience EPC - Efficient Power Conversion #semiconductor #intellectualproperty #industry #lawsuit #technology #GaN https://lnkd.in/di792VMW

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This article was from Cherry Semiconductor in 1996. Q) What topology?

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HERE IT IS: "The Semiconductor Leadership Podcast" Presents this week 1-1 with:.... Dr. Sandra Vos on Innovation, Legacy & Impact! Join me for an inspiring conversation with Sandra Vos, PhD , Director of Engineering at T.E. Connectivity, where she shares insights from her journey in engineering and innovation. ON YOUTUBE: https://lnkd.in/dZe3Agde ON SPOTIFY: https://lnkd.in/dJKnreVe Here are the top 5 highlights: Engineering with Impact: Dr. Vos reflects on her work with teams conducting experiments and designing products that touch everyday life. Her enthusiasm shines as she shares the joy of seeing math and science in action. A Family Legacy in Engineering: She opens up about how her father’s background in electrical engineering influenced her career path, creating a natural foundation for her success in the field. The First Patent and a Pivotal Moment: Dr. Vos recounts the experience of filing her first patent, a journey filled with problem-solving and unexpected insights, made possible through innovative tools like high-speed cameras. Safety and Stress in Design: Designing life-saving automotive parts is a challenging task that Dr. Vos embraces wholeheartedly, highlighting the responsibility and stress that come with building for safety.Focusing on Talent Efficiency: A passionate advocate for balancing business and talent efficiency, Dr. Vos emphasizes the need for organizations to invest in talent development for sustainable success. Tune in to hear these insights and more from one of semiconductors engineering’s leading voices! #SemiconductorLeadershipPodcast #Engineering #Innovation #TalentDevelopment #Podcast

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Wrapping up #DAC61, I am curious about the decision to rebrand the event as "DAC, The Chips to Systems Conference," instead of the traditional "Design Automation Conference." This is not just a simple change of words — consider the keynote speakers. Last year, they were all #EDA luminaries:  Mike Ellow (recently appointed CEO of Siemens EDA), Lip-Bu Tan (former Cadence CEO), Alberto Sangiovanni-Vincentelli (founder of both Cadence and Synopsys) and Walden C. ( Wally ) Rhines - long time CEO of Mentor Graphics. In contrast, this year, the keynote speakers were Jim Keller (Tenstorrent), Gary Patton (Intel) and Alan Lee (ADI) - all "Chip to Systems" executives. Is this a coincidence? Does it reflect EDA companies taking a lesser role at DAC? Siemens EDA (Siemens Digital Industries Software) was a notable exception as a Diamond sponsor, investing in a sizable booth and team, and hosting guests for a Giants' game at Oracle Park. (The famous Denali party is long gone...) Or is it because part of Design Automation is increasingly being done within "Chips to Systems" companies? Just look at Jim Keller discussing the importance of #opensource and Alan Lee explaining that "Product Design is Complex." What do you think? #Designautomation #chipdesign

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