Alexander E Tan

Transphorm GaN technology offers the most flexibility in power electronics. This is the result its ease of design, which is one of the cornerstones of our technology. Our SuperGaN FETs compete directly against silicon, silicon carbide, and e-mode GaN whether it’s how the device is driven or the package(s) it’s offered in. Up and above SuperGaN’s flexibility we also enable our SIP (System-In-Package) partners such as Weltrend with GaN FET solutions that compliment our discrete offerings. This results in a solution for all customers no matter their architecture or system needs. #supergan #gan #transphorm #reliability #Weltrend

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PCIe Gen6 + 5nm + MRVL SerDes = Lowest Power for AI!!

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Last week, the power management sector witnessed an impactful merger of two PMIC powerhouses, Renesas Electronics, and Transphorm Inc., which highlighted the timeless expression that the whole could indeed be greater than the sum of its parts.   This acquisition is part of Renesas’ long-term strategy for driving growth in the power industry and it follows previous strategic acquisitions of Dialog Semiconductor in 2021, IDT in 2018, and Intersil in 2017. Since acquiring Dialog, the power management sector has seen rapid growth in demand for wide-bandgap materials, primarily driven by the increased adoption of electric vehicles (EVs), industrial applications, and renewable power generation. GaN and SiC have become highly sought after and although WBG adoption is still in its early stages, the industry as a whole recognizes the importance of WBG materials for capitalizing on growing trends and future opportunities. This acquisition is not just a strategic hedge for the future; it has an immediate impact on their customers' businesses. Renesas and Transphorms’ combined portfolio promises to increase access to advanced wide-bandgap (WBG) technologies and aid companies in transitioning to more efficient, cleaner power delivery and management systems. Transphorm’s GaN IP portfolio includes over 1,000 patents and has already enabled Renesas to introduce 15 new “Winning Combinations”—market-ready reference designs combining Transphorm's GaN technologies with Renesas' embedded processing, power, connectivity, and analog portfolios. “Customers instantly benefit from the new GaN products through turnkey reference designs, which integrate technologies from both companies,” said Chris Allexandre, SVP, and GM of Power at Renesas. “Adding GaN into our portfolio also reinforces our commitment to develop products and technology that make people’s lives easier. Providing robust and sustainable power solutions that save energy, reduce cost and minimize environmental impacts does just that.” Renesas’ commitment to investing in WBG space isn’t only demonstrated through buying companies, it’s also shown in the establishment of their Kofu, Japan factory, a facility specializing in manufacturing power products using 300-mm wafers. They’ve also increased their production capacity by setting up a new SiC production line at their Takasaki, Japan factory and they’ve secured a reliable SiC wafer supply for the next decade through a partnership with Wolfspeed. Renesas’ aim to offer more wide-bandgap power solutions to meet the needs of an evolving market is very wise, and I admire the fact that they’re looking at their financial resources and investing toward the proliferation of technologies in the manufacturing sense as well. These moves make them a powerful contender and I believe we’ll see Renesas increasing their market share in the near future as well as climbing the charts of the most respected power semiconductor companies worldwide.

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yieldHUB has semiconductor customers from 13 countries. Customers have, on average, been with us for 5 years. 33% have been with us for at least 5 years and 20% have been with us for more than 10 years. With few exceptions, customers are well funded private companies or well known and publicly quoted companies. Some dropped off over the years, but we grow net customers every year, this year being the second fastest of net customer growth after 2021 (move to cloud tech for big data accelerated during and just after Covid). 50% of payments by all customers are either on time or ahead of time. The payment average is 4 days over payment terms this year so far, 3 days over being the median. But every one of them has paid what they are supposed to, and that's going back 19 years. Semiconductors is a very honourable industry and it's great to be part of it. #customersuccess #payments #customerretention #semiconductors

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I always enjoy speaking with Anshel Sag from @Moor Insights & Strategy. We had the opportunity to chat again when he attended Qualcomm's Investor Day. Check out the video below to learn about Qualcomm's leadership in PCs, XR, Anshel's "oh, snap" moment from Investor Day, and more.

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#Korean #NANDFlash #Manufacturers Cautiously Increase #Wafer Input, Capacity Utilization Maintains Around 50% 💡 According to a report from South Korean media The Chosun Daily, Samsung Electronics is set to increase wafer input by approximately 30% this quarter at its #NAND #Flash production lines in #Pyeongtaek, #SouthKorea, and Xi’an, #China. However, #Samsung remains cautious about further production increases to avoid impacting NAND Flash price trends. The report indicates that while Samsung’s NAND Flash production lines can exceed 2 million wafers in a quarter at full capacity, internal targets for wafer output in the second to fourth quarters are capped at 1.2 million wafers each, maintaining overall utilization rate at around 50%. The same report further indicates that SK hynix has set a quarterly cap of around 600,000 #wafers for NAND Flash production, with overall utilization rate ranging between 50% and 60%. As per TrendForce Corporation’s data, it has projected a strong 13–18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/emAnDDQc #semiconductorindustry #technology #tech #memory #micron #chip #ic #chips #semiconductormanufacturing #ai #cloudcomputing #server #ai

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The biggest message coming out of this year’s Qualcomm Investor Day is that both the present and the future look bright. How bright? Here are a few of the key takeaways from the event: ✅  We’ve seen strong growth and execution in FY24 ✅ Our recent positive performance is part of a larger trend ✅ We’re well positioned to take advantage of transformative growth opportunities ✅ Revenue growth forecast is strong In short, we are in the process of creating a new Qualcomm that has both a stronger growth profile and lower customer concentration. Important note: since this post has future-looking statements, be sure to check out the Qualcomm Safe Harbor Statement: https://lnkd.in/gW_YSMfE

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#6G is anticipated to deploy in 2030, and there’s a long path ahead. Currently, mobile devices rely on gallium arsenide (GaAs) semiconductors for reliable signal transmission. As we look towards the next step, gallium nitride (GaN) on silicon will better support 6G’s higher frequencies and bandwidth. This is because GaN delivers superior performance characteristics such as higher power density and superior energy efficiency. I’m curious to hear your thoughts — as we prepare for the eventual shift from #5G ➡️ 6G, what should designers do NOW to prepare for next-gen wireless communications?

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The countdown to CES 2025 has started - stay tuned for what we will showcase there to drive AI in the cloud as well as Edge AI to unleash human experience #innovation #CES2025 #AI #SamsungSemiEurope

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Cadence introduces the Janus NoC for SoC designs.

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Just as we feared, our January 3 percent growth assumption for Q1-2024 has proved optimistic. The first quarter crashed, wiping US$13 billion off the quarter, which, in turn, has reduced our full year forecast by US$50 billion. Low unit sales, driven by ‘take of pay’ long-term price agreements (LTAs) from the Covid-boom era, are exacerbating industry attempts to rein back excess inventory. Just like the emperor’s new clothes, the supposed 2024 Super-Cycle has evaporated in a puff of smoke. It always was a delusion, Q1 removed all doubt. Visit our website for your copy of the May Industry Update Forecast Webinar side deck and video, see the highlights here: https://lnkd.in/evNyJxNH

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#Tessolve proudly partnered with NXP Semiconductors to deliver a groundbreaking Digital Connected Cluster Platform for two and three-wheelers. We are thrilled to share that our #collaboration with #NXP has resulted in an innovative platform that redefines the digital experience for automotive clusters. Learn more:https://lnkd.in/gdP-xcKA #DigitalCluster #Automotive #Automotiveindustry #DigitalConnectedCluster

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June 20 In-person Seminar: Quantum Dots for MicroLEDs https://lnkd.in/gE5Xcv6v MicroLEDs promise to play a major role in future display products: they are tiny, bright, power efficient, and long-lasting. However, transferring huge numbers of Red, Green, and Blue devices from the wafer to the display surface adds complexity and cost. MicroLED products can be more easily manufactured by using a single type of LED that can emit R, G, or B. One approach is to use only blue LED’s, then pattern a Color Conversion Layer so that B can also produce R or G. NanoPattern Technologies, Inc. makes Quantum Dot CCL’s without requiring vacuum. This greatly simplifies the deposition and patterning processes. Please join us on June 20 at Eurofins | EAG Laboratories in Sunnyvale with NanoPattern’s CTO, Danielle R. Chamberlin. #quantumdot #microled 

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In this episode of the "Quick Chip Series" on the Semiconductor Leadership Podcast, we dive into the remarkable journey of Qualcomm, a powerhouse in the semiconductor industry. On Youtube: https://lnkd.in/de6CY2Jw On Spotify: https://lnkd.in/dppbZi5C Join us as we uncover surprising facts and lesser-known stories about the company's rise to prominence. Did you know Qualcomm's name was almost different? What unexpected innovation sparked its success? How did a single invention revolutionize mobile communication forever? Tune in to discover these intriguing details and more. Subscribe to our YouTube and Spotify channels now to stay updated with our latest episodes and never miss an insight into the semiconductor world!

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China’s binge-buying of chipmaking equipment could yield another overcapacity problem Such over-investment ultimately will lead to “inefficient or under-utilized capacity in the future,” creating pricing pressures to its global industry peers, SEMI’s senior director Clark Tseng said. In the first half of 2024, China splurged a whopping $24.73 billion on procuring chip manufacturing equipment, according to data from SEMI, a global semiconductor industry association. That’s more than the $23.68 billion spent by South Korea, Taiwan, North America and Japan combined, during the same period. The U.S. accounted for most of the spending in North America.

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Here offer Micron N48R：QLC HBM MT29F1T08GBLCEN48R3WC1-R Q’ty：300K samsung V5 256Gb. 6k EP3C16F484C6N EP3C5F256C8N  M393A4K40EB3-CWE server 1. H5WRAGESM8W-N8L Qty:8,000/pcs USD650/pcs D/C:Within 2 years L/T:10Weeks HK EXW 2. KHAA84901B-JC17 Qty:10,000pcs USD480/pcs D/C:21+ L/T:12-16Weeks HK EXW The HBM4 war begins! Memory chip stacking is difficult to solve, Hybrid Bonding is the key to breakthrough SK Hynix, a major Korean memory manufacturer, participated in COMPUTEX 2024 for the first time, displaying the latest HBM3E memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealed that Hybrid bonding will become a very important part of the chip stack. MR-MUF is a process in which semiconductor wafers are attached to circuits and "EMC" (liquid epoxy molding compound) is used to fill the gaps between wafers or between wafers and bumps when stacking the wafers. At present, MR-MUF technology can make chips closer together, improve heat dissipation performance by 10%, improve energy efficiency by 10%, product capacity reaches 36GB, and can be stacked 12 layers.As for competitors such as Samsung and Micron, which use TC-NCF technology (thermal compression with non-conductive film, non-conductive film thermal compression), it is necessary to convert the material into a solid through high temperature and high pressure, then melt it, and then clean it. The total process More than 2-3 steps, MR-MUF can be completed in one go and no further cleaning is required. Compared with NCF, MR-MUF has about twice the thermal conductivity, which has a great impact on process speed and yield. As the number of stacked layers increases, the HBM package thickness is limited to 775 microns (μm). Therefore, memory manufacturers must think about how to stack more layers within a certain height. This is also a big challenge for current packaging technology, and hybrid bonding (Hybrid bonding) is likely to be one of the solutions.stack more than 20 layers (ie no more than 775 microns) through Hybrid bonding technology. According to Korean media reports, HBM4E will be a 16-20-layer product and is expected to debut in 2028. SK Hynix will use 10-nanometer sixth-generation (1c) DRAM in HBM4E for the first time, and the memory capacity is expected to be significantly increased. (Source of the first picture: Science and Technology News).#china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle]\\

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That’s a great perspective on GaN fast chargers! Share to you 🔌 **Traveling Light: The Right Charger for Your Needs!** As a frequent traveler, I’ve put various chargers to the test, and I want to share my insights on the best options currently available. ⚡ **65W GaN Fast Charger**: For those looking for an affordable solution for basic charging needs, the 65W model is an excellent choice. It’s lightweight, compact, and easy to handle most devices—ideal for on-the-go use! 💻 **100W Charger**: If you’re seeking the best value for versatility, the 100W charger comes out on top. Its ability to power smartphones, laptops, and tablets efficiently makes it a must-have for tech-savvy travelers. It strikes the perfect balance between functionality and portability. 📦 **140W Chargers & Multi-port Options**: While they may offer more power, I’ve found that the 140W variants or those with three or more ports can get quite heavy. They’re more suited for stationary office use than travelers who need to minimize bulk in their bags.

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The global High Bandwidth Memory (HBM) market was valued at US$ 856.78 million in 2023 and is anticipated to reach US$ 48,925.41 million by 2030, witnessing a CAGR of 68.08% during the forecast period 2024-2030.

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