Latest news: next-gen EUV laser R&D; $285M CHIPS Act award; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron’s $2B Virginia fab expansion; Tesla sales slump; USB-C mandate in Europe. https://lnkd.in/eiP5wV9G #semiconductor #EUV #EDA #semiconductormanufacturing Lawrence Livermore National Laboratory Janelle Cataldo Synaptics Incorporated Google The Hong Kong University of Science and Technology TSMC Micron Technology Hoi-Sing Kwok Natcast.org Deirdre Hanford GlobalFoundries IBM POET Technologies Littelfuse Elmos NVIDIA RunAI Syntiant Corp. Knowles Corporation KAIST National University of Singapore Jiamin Shen YAO CHEN Ruhr University Bochum Weebit Nano Ltd Jen Bernier-Santarini Ceva, Inc. Rigetti Computing Tesla Ansys Kontrol Vikram Gupta Billy Rutledge Semiconductor Research Corporation (SRC) #CHIPSAct National Institute of Standards and Technology (NIST) Arati Prabhakar Todd Younkin
Semiconductor Engineering
Online Audio and Video Media
Silicon Valley, CA 88,322 followers
Deep insights for the tech industry
About us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
- Website
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http://semiengineering.com
External link for Semiconductor Engineering
- Industry
- Online Audio and Video Media
- Company size
- 2-10 employees
- Headquarters
- Silicon Valley, CA
- Type
- Self-Owned
- Founded
- 2013
Locations
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Primary
Silicon Valley, CA, US
Employees at Semiconductor Engineering
Updates
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Silicon lifecycle management applications and techniques are gaining traction as chipmakers figure out how to use them more effectively. By Ann Mutschler. https://lnkd.in/gX8Wmnst #SLM #semiconductor #EDA #siliconlifecycle Lee Vick Randy Fish Adam Cron Noam Brousard Marc Hutner Movellus Inc. Synopsys Inc proteanTecs Siemens Digital Industries Software Simon Rance Keysight Technologies
SLM Evolves Into Critical Aspect Of Chip Design And Operation
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What chip industry engineers watched in 2024. Hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, safety monitoring, security, and much more. https://lnkd.in/gP8s4mty #semiconductor #RISCV #DRAM #chiplets #semiconductormanufacturing #AI #automotive #EDA Onto Innovation Keith Best Rambus Steven Woo Winbond Andy Nightingale Arteris Frank Schirrmeister Dick Otte Promex Industries Inc. Eli Roth Teradyne Bryan Schackmuth Nordson Corporation Yang Zhang Andy Heinig Fraunhofer IIS, Division Engineering of Adaptive Systems EAS Roland Jancke Nir Sever proteanTecs PDF Solutions Sivaram Trikutam Infineon Technologies Kevin Brand Synopsys Inc Jayson Bethurem Pulin Desai Cadence Kajetan Nürnberger Guy Ben-Haim🎗 Lee Vick Movellus Inc. Alphawave Semi Archana P Cheruliyil Ashish Darbari Axiomise Letizia Giuliano Ronen Perets Siemens Digital Industries Software
Top Tech Videos Of 2024
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Verification tools are getting faster and capacity is increasing, but they still can’t keep up with the problem space. Verification is crossing more silos, requiring expanded skill sets. By Brian Bailey. https://lnkd.in/g5JbBMCX #verification #EDA #semiconductor #chiplets #thermal Bryan Ramirez Frank Schirrmeister Matt Graham Bernie DeLay Cadence Siemens Digital Industries Software Synopsys Inc
Improving Verification Performance
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SemiEngineering's latest Automotive, Security & Pervasive Computing newsletter https://lnkd.in/gSGr8dAz #semiconductor #automotive #hardwaresecurity #radar #cryptography #USB4 #verification #edgecomputing
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Semiconductor Engineering's latest Manufacturing, Packaging and Materials newsletter https://lnkd.in/gAQy6AB4 #semiconductor #3DDRAM #NANDFlash #GaN #SiC #GAAFETs #semiconductormanufacturing ASE Global United Microelectronics Corporation (UMC) Lam Research Brewer Science Promex Industries Inc. Amkor Technology, Inc.Synopsys Inc Tignis D2S, Inc. SEMI
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New technical papers recently added to Semiconductor Engineering’s library: https://lnkd.in/gXrdQFdP #semiconductor #NVM #CXL #hardwaresecurity #EDA #diamondsemiconductor University of Michigan Sandia National Laboratories Andrew Jalbert Elliot Fuller Micron Technology Intel Corporation Rohit Sehgal, Vishal T., Vinicius Petrucci Anil Godbole KAIST ByeongSu Woo, YoungKwang Han, Brent ByungHoon Kang Technion - Israel Institute of Technology The Hebrew University of Jerusalem Firas Ramadan Freddy Gabbay Texas Instruments, AIXTRON SE imec Luigi Colombo Salim El Kazzi Mihaela Ioana Popovici National Renewable Energy Laboratory Renewable and Sustainable Energy Institute Debjit Ghoshal, Goutam Paul, Srikrishna Sagar National Institute of Standards and Technology (NIST) Irena Bojanova Macquarie University Massachusetts Institute of Technology Mojtaba Moshkani,
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No single material is ideal, but unique combinations are emerging. By Katherine Derbyshire. https://lnkd.in/gJjKC3Vi #GaN #SiC #powermanagement #semiconductor #powerelectronics Atomera Infineon Technologies Kazuoki Matsugatani Matteo Meneghini Hiroshi Kono Toshiba Umesh Mishra, Ph.D. UC Santa Barbara Shawn Thomas Han Wui T. Intel Corporation DENSO Renesas Electronics Pratik Koirala Leo Varghese Ahmad Zubair #electricvehicles
Challenges In Powering Electrification With GaN And SiC
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A compendium of essential information for the chip industry. https://lnkd.in/g33Kus_S #semiconductor #semiconductormanufacturing #EDA #advancedpackaging #hybridbonding #EUV #glasssubstrates #siliconphotonics #HBM #chiplets
Semiconductor Engineering's Special Reports 2024
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Latest news: U.S. launches trade investigation into China; advanced packaging pilot line; Cohu to buy Tignis; NXP's new acquisition; Alphawave's speedy UCIe IP; flurry of end of year government fundings; HW-assisted verification for Ethernet; auto radar MMIC; MIT's high-rise 3D chips; 3D NAND; strain/stress in advanced packaging and more. https://lnkd.in/gh5zZDXG #semiconductor #semiconductormanufacturing #EDA Alphawave Semi Cohu, Inc. Tignis NXP Semiconductors Aviva Links Inc. GlobalWafers America SK hynix Rapidus Corporation ASML Massachusetts Institute of Technology Jeehwan Kim Seunghwan Seo Cybersecurity and Infrastructure Security Agency Fraunhofer IIS SILICON BOX Diamond Foundry Merck Group EMD Electronics Cadstrom.io Micron Technology Micromax Informatics Ltd Phison Electronics Corps. United Microelectronics Corporation (UMC) IBM Koichi Motoyama Kisik Choi Samsung Semiconductor Ajou University Seoul National University Siemens Digital Industries Software Ansys EQTY Lab Intel Corporation NVIDIA VeriSilicon Holdings Co., Ltd. S2C Limited SiMa.ai Synopsys Inc Sony Semicon (IL) Microchip Technology Inc.
Chip Industry Week In Review
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