ASML

From a humble gathering in 2000 to a global knowledge-sharing event today, our annual Technology Conference has come a long way. 🚀 This year, around 10,000 ASMLers joined by invitation across four locations to explore the latest innovations, research findings and technical breakthroughs. Held by engineers for engineers, the Technology Conference gives our R&D community the space to exchange insights, sharpen ideas and break new frontiers as we keep powering technology forward with you. Here's to innovation through collaboration! 🤝

How much do you know about ASML? 💡 Whether you're a longtime follower or just getting to know us, now's your chance to see how much you know about ASML and our role in chipmaking – and maybe learn something along the way!

A chip is a tiny skyscraper. At the bottom of that skyscraper lie critical layers whose tiny transistors made of the most intricate features. These layers have to be patterned with nanometer precision, but that’s not enough: As the skyscraper grows, layer after layer has to be accurately printed and precisely aligned on top of the existing layers to ensure that the chip’s circuitry works exactly as intended. At ASML, we developed holistic lithography – the innovative integration of lithography systems, computational lithography, and metrology and inspection systems – to make sure that chipmakers can pattern with the precision and accuracy they need for every layer in the skyscraper so we can keep powering technology forward with you.

Our CEO Christophe Fouquet was recently featured in The New York Times in an in-depth article exploring the global semiconductor supply chain. Christophe shares that the semiconductor industry has become strategically important. As a result, geopolitics has become a fact of life. Christophe emphasizes the need to double down on innovation and celebrate global cooperation. He remains optimistic about the road ahead, believing that the industry is just ‘at the start’ of an Artificial Intelligence (AI) boom. Explore the full piece in The New York Times: http://ms.spr.ly/6042SSqcO A New York Times account is required to access the full article.

On June 5, we celebrated our fourth Manufacturing Day, bringing more than 9,000 colleagues together in a globe-spanning 22-hour event to acknowledge manufacturing’s contributions to success, and to celebrate craftsmanship and improvement ideas. The theme this year was “Dare to Share”, highlighting how being open about our experiences and learning from each other strengthens our teams worldwide. This proud group of colleagues from our manufacturing sites in Linkou, Tainan, Pyeongtaek, Berlin, Veldhoven, Wilton and San Diego are at the heart of everything we do. With their expertise, precision mindset and commitment to quality, they embody the engineering excellence and advanced craftsmanship that enable us to keep powering technology forward. 🚀

Advances in chip technology don't happen overnight. Chipmaking is a complex process, and it takes the whole industry working together toward a shared goal to deliver performance improvements. How do we make sure we're working toward a shared goal? Roadmaps. Learn about how industry and customer roadmaps drive progress by guiding our innovation. 👇

Innovation in the semiconductor industry is never a solo act. 🤝 It takes a thriving ecosystem to keep powering technology forward, and we're proud to build it together with our trusted partners.

It takes a global team of experts to build the world’s most advanced lithography systems. 🌎 Our High NA EUV (extreme ultraviolet) lithography systems are made up of subsystems, known as main modules, that are built in cleanrooms around the world. These four locations are key to manufacturing High NA EUV technology: ⚡ In Wilton, Connecticut, we build the top module. Its lightning-fast stage rushes the reticle back and forth as light encodes the blueprint of a chip pattern. 💥 In San Diego, California, we conduct R&D for the EUV light source and vessel, which produce the EUV light that’s needed to print the tiniest features on the most advanced microchips. 🔎 In Oberkochen, Germany, we co-develop and build the projection optics box with our strategic partner ZEISS. It contains ultrasmooth multilayer mirrors that reflect the nearly unreflectable EUV light and focus it on silicon wafers. 🏭 The rest happens at our headquarters in Veldhoven, the Netherlands. This includes building the bottom module, which houses wafer stages that quickly and precisely position silicon wafers for patterning, and integrating the system. It's all about collaboration: We go to the experts for each system component to bring the most advanced technology to our customers.

From simple sensors to advanced chips, today’s tech is made possible by deep ultraviolet (DUV) lithography. Microchip innovation is all about delivering performance improvements at the right price. That's why chipmakers use extreme ultraviolet (EUV) and DUV lithography systems in tandem to optimize patterning. Together, the technologies enable chipmakers to reach the resolution and accuracy they need, and to do it as fast as possible and at the lowest cost. In a world where technology is constantly evolving, DUV lithography remains a key driver of progress. We’re continually innovating for our DUV products and tailoring them to chipmakers’ needs so we can keep powering technology forward with you.

When it comes to the stage acceleration in our lithography system, we’re not matching race cars and fighter jets. We’re exceeding them. Our lithography systems process hundreds of wafers per hour during mass production. To reach that level of productivity, the system has to move fast – both while transferring each pattern and while moving from one pattern to the next. Read on to learn more about stage acceleration and its role in fast, accurate chip patterning. 👇