Welcome in your future photonics packaging standards

Welcome in your future photonics packaging standards

Integrated packaging platform

All-in-one package: Combination of functionalities using scalable Wafer-Level Microfabrication techniques

ICON brings a breaking through optical coupling technology allowing low-losses and easy assembly to your high speed components and PICs.

Easy fiber assembly using a mechanical fixture to provide fiber array self alignment in multiple fiber to chip configurations.

The wafer-level platform allows embedding the active chip devices in Si interposers such as PICs, Detectors, SNSPDs, VCSELs, LEDs, Lasers, Electronics.

Integration of your sub-assembly with electrical wafer-level packaging (eWLP) interconnects

The interposer also integrates high speed transmission lines adapted to your active device. Advanced electrical wafer-level interconnects ease your access to mmW bands.

Full on-wafer microoptics adding an extra beam control directly at the aperture level for free-space applications.

All-in-one package: Combination of functionalities using scalable Wafer-Level Microfabrication techniques

ICON brings a breaking through optical coupling technology allowing low-losses and easy assembly to your high speed components and PICs.

Easy fiber assembly using a mechanical fixture to provide fiber array self alignment in multiple fiber to chip configurations.

The wafer-level platform allows embedding the active chip devices in Si interposers such as PICs, Detectors, SNSPDs, VCSELs, LEDs, Lasers, Electronics.

Integration of your sub-assembly with electrical wafer-level packaging (eWLP) interconnects

The interposer also integrates high speed transmission lines adapted to your active device. Advanced electrical wafer-level interconnects ease your access to mmW bands.

Full on-wafer microoptics adding an extra beam control directly at the aperture level for free-space applications.

Our main innovations

Optical coupling technology

Passive fiber fixtures

Si electrical interposer

Adapted to your challenges

Surface packaging

Edge packaging

Advanced

Our 3 main innovations

Optical coupling expertise

Passive fiber fixtures

Si electrical interposer

Adapted to your situation

Surface coupling

Edge coupling

Others

Your benefits

MINIATURIZATION

From pluggable to co-packaged Optics. Excellent precision by semiconductor processing techniques enabling low loss coupling and easy assembly process steps for ultra-high speed modules.

VERSATILITY

Easy customization applicable with multiple applications:
optical interconnects, quantum photonics and sensing over a wide range of wavelength (0.5 to 5µm)

SCALABILITY

Full Wafer-Level microfabrication : cost-effective mass production solution

RELIABILITY

TELCORDIA standards passed / Cryogenic validation down to 4mK / Reflow process validation above 300°C / Mechanical stability and robustness

Come to meet us

At ICON Photonics we give particularly a great prominence on building bridges along the photonics community attending and participating in the wordwide photonics exhibitions. A great moment to meet you, share our work, learn about your challenges and find ways to cooperate.

See all the events

Come to meet us

At ICON Photonics we give particularly a great prominence to meet new people, share our work, and discover new technologies. We participate at plenty of international events, and we would be very glad to meet you there.

See all the events

Our History

Coming from the national French research center (CNRS) & ESIEE Paris, the company has now grown and developed its partnerships to become a world-reference in Photonics Integrated Packaging domain enabling the next generation optical connectivity.

About us

Our History

Coming from a famous French research center (CNRS), the company has now grown and developed its partnerships to become a world-reference in its domains.

About us
About us

Our History

Coming from a famous French research center (CNRS), the company has now grown and developed its partnerships to become a world-reference in its domains.

About us