RT Journal Article
SR 00
ID 10.1364/OME.432751
A1 Jevtics, Dimitars
A1 Smith, Jack A.
A1 McPhillimy, John
A1 Guilhabert, Benoit
A1 Hill, Paul
A1 Klitis, Charalambos
A1 Hurtado, Antonio
A1 Sorel, Marc
A1 Hoe Tan, Hark
A1 Jagadish, Chennupati
A1 Dawson, Martin D.
A1 Strain, Michael J.
T1 Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing
JF Optical Materials Express
YR 2021
FD 2021-10-01
VO 11
IS 10
SP 3567
OP 3576
AB The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.
PB Optical Society of America
SN 2159-3930
LK https://eprints.gla.ac.uk/281464/