TY  - JOUR
PB  - MDPI
TI  - CORNERSTONE?s silicon photonics rapid prototyping platforms: current status and future outlook
IS  - 22
JF  - Applied Sciences
A1  - Littlejohns, Callum G.
A1  - Rowe, David J.
A1  - Du, Han
A1  - Ke, Li
A1  - Zhang, Weiwei
A1  - Cao, Wei
A1  - Bucio, Thalia D.
A1  - Yan, Xingzhao
A1  - Banakar, Mehdi
A1  - Tran, Dehn
A1  - Liu, Shenghao
A1  - Meng, Fanfan
A1  - Chen, Bigeng
A1  - Qi, Yanli
A1  - Chen, Xia
A1  - Nedeljkovic, Milos
A1  - Mastronardi, Lorenzo
A1  - Maharjan, Rijan
A1  - Bohora, Sanket
A1  - Dhakal, Ashim
A1  - Crowe, Iain
A1  - Khurana, Ankur
A1  - Balram, Krishna C.
A1  - Zagaglia, Luca
A1  - Floris, Francesco
A1  - O?Brien, Peter
A1  - Di Gaetano, Eugenio
A1  - Chong, Harold M. H.
A1  - Gardes, Frederic Y.
A1  - Thomson, David J.
A1  - Mashanovich, Goran Z.
A1  - Sorel, Marc
A1  - Reed, Graham T.
ID  - enlighten253315
UR  - https://eprints.gla.ac.uk/253315/
N2  - The field of silicon photonics has experienced widespread adoption in the datacoms industry over the past decade, with a plethora of other applications emerging more recently such as light detection and ranging (LIDAR), sensing, quantum photonics, programmable photonics and artificial intelligence. As a result of this, many commercial complementary metal oxide semiconductor (CMOS) foundries have developed open access silicon photonics process lines, enabling the mass production of silicon photonics systems. On the other side of the spectrum, several research labs, typically within universities, have opened up their facilities for small scale prototyping, commonly exploiting e-beam lithography for wafer patterning. Within this ecosystem, there remains a challenge for early stage researchers to progress their novel and innovate designs from the research lab to the commercial foundries because of the lack of compatibility of the processing technologies (e-beam lithography is not an industry tool). The CORNERSTONE rapid-prototyping capability bridges this gap between research and industry by providing a rapid prototyping fabrication line based on deep-UV lithography to enable seamless scaling up of production volumes, whilst also retaining the ability for device level innovation, crucial for researchers, by offering flexibility in its process flows. This review article presents a summary of the current CORNERSTONE capabilities and an outlook for the future.
AV  - public
Y1  - 2020/11//
VL  - 10
SN  - 2076-3417
ER  -