Wang, L., Brown, A.R., Nedjalkov, M., Alexander, C., Cheng, B., Millar, C. and Asenov, A. (2014) 3D coupled electro-thermal simulations for SOI FinFET with statistical variations including the fin shape dependence of the thermal conductivity. In: 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology (ICSICT 2014), Guilin, China, 28-31 Oct 2014,
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Publisher's URL: http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=32164
Abstract
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| Item Type: | Conference Proceedings |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Alexander, Dr Craig and Millar, Dr Campbell and Wang, Dr Liping and Cheng, Dr Binjie and Asenov, Professor Asen |
| Authors: | Wang, L., Brown, A.R., Nedjalkov, M., Alexander, C., Cheng, B., Millar, C., and Asenov, A. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| Related URLs: |
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Deposit and Record Details
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