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Apple silicon refers to a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of Mac, iPhone, iPad, Apple TV, Apple Watch, AirPods, AirTag, HomePod, and Apple Vision Pro devices.

Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020.^[1]^[2] The first Macs built with the Apple M1 chip were unveiled on November 10, 2020. As of June 2023, the entire Mac lineup uses Apple silicon chips.

Apple fully controls the integration of Apple silicon chips with the company's hardware and software products. Johny Srouji is in charge of Apple's silicon design.^[3] Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as TSMC.

A series

Evolution of Apple "A" series

A4
March 12, 2010 – September 10, 2013

A5
March 2, 2011 – October 4, 2016

A5X
March 7 – October 23, 2012

A6
September 12, 2012 – September 9, 2015

A6X
October 23, 2012 – October 22, 2013
March 18 – October 16, 2014

A7
September 10, 2013 – March 21, 2017

A8
September 9, 2014 – October 18, 2022

A8X
October 16, 2014 – March 21, 2017

A9
September 9, 2015 – September 12, 2018

A9X
November 9, 2015 – June 5, 2017

A10 Fusion
September 7, 2016 – May 10, 2022

A10X Fusion
June 5, 2017 – April 20, 2021

A11 Bionic
September 12, 2017 – April 15, 2020

A12 Bionic
September 12, 2018 – October 18, 2022

A12X Bionic
October 30, 2018 – March 18, 2020

A13 Bionic
September 10, 2019 – present

A12Z Bionic
March 18, 2020 – April 20, 2021

A14 Bionic
September 15, 2020 – present

A15 Bionic
September 14, 2021 – present

A16 Bionic
September 7, 2022 – present

A17 Pro
September 12, 2023 – present

The "A" series is a family of SoCs used in the iPhone, certain iPad models, and the Apple TV. "A" series chips were also used in the discontinued iPod Touch line and the original HomePod. They integrate one or more ARM-based processing cores (CPU), a graphics processing unit (GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.^[4]

Apple A4

The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.^[5] It combines an ARM Cortex-A8 CPU – also used in Samsung's S5PC110A01 SoC^[6]^[7] – and a PowerVR SGX 535 graphics processor (GPU),^[8]^[9]^[10] all built on Samsung's 45-nanometer silicon chip fabrication process.^[11]^[12] The design emphasizes power efficiency.^[13] The A4 commercially debuted in 2010, in Apple's iPad tablet,^[8] and was later used in the iPhone 4 smartphone,^[14] the fourth-generation iPod Touch, and the 2nd-generation Apple TV.^[15]

The Cortex-A8 core used in the A4, dubbed "Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple^[16]^[17] It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM.^[18] The A4 runs at different speeds in different products: 1 GHz in the first iPads,^[19] 800 MHz in the iPhone 4 and fourth-generation iPod Touch, and an undisclosed speed in the 2nd-generation Apple TV.

The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less.^[20] Other performance improvements include additional L2 cache.

The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod Touch,^[21] and the 2nd-generation Apple TV^[22] have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB.^[23]^[24]^[25] The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.^[26]

Apple A5

The Apple A5 is an SoC manufactured by Samsung^[27] that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011,^[28] followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance",^[29] according to Apple.

The A5 contains a dual-core ARM Cortex-A9 CPU^[30] with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz,^[31] though it can adjust its frequency to save battery life.^[30]^[32] The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.^[33]

An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4).^[34] The chip in the Apple TV has one core locked.^[35]^[36] Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.^[37]

In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design.^[38] Markings tell that it is named APL7498, and in software, the chip is called S5L8947.^[39]^[40]

Apple A5X

The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5.^[41] It was superseded in the fourth-generation iPad by the Apple A6X processor.

The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm²,^[42] for example twice the size of Nvidia Tegra 3.^[43] This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5.^[44] The RAM in A5X is separate from the main CPU package.^[45]

Apple A6

The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5.^[46] It is 22% smaller and draws less power than the 45 nm A5.^[47]

The A6 is said to use a 1.3 GHz^[48] custom^[49] Apple-designed ARMv7 based dual-core CPU, called Swift,^[50] rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3^[51] graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4.^[49] The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.^[52]

Apple A6X

Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.^[53]

Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate.^[54] It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem.^[54]^[55] Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.^[55]

Apple A7

The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6.^[56] The Apple A7 chip is the first 64-bit chip to be used in a smartphone and later a tablet computer.^[57]

The A7 features an Apple-designed 1.3^[58]–1.4^[59] GHz 64-bit^[60] ARMv8-A^[61]^[62] dual-core CPU,^[58] called Cyclone,^[61] and an integrated PowerVR G6430 GPU in a four cluster configuration.^[63] The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6.^[64] It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/NEON registers that are each 128-bits wide.^[60] The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process^[65] and the chip includes over 1 billion transistors on a die 102 mm² in size.^[58]

Apple A8

The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014.^[66] A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7.^[67] On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.^[68]

The A8 features an Apple-designed 1.4^[69] GHz 64-bit^[70] ARMv8-A^[70] dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration.^[69] The GPU features custom shader cores and compiler.^[71] The A8 is manufactured on a 20 nm process^[72] by TSMC,^[73] which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm² (consistent with a shrink only, not known to be a new microarchitecture).^[74]

Apple A8X

The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014.^[75] It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.^[75]^[76]

Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate.^[77] It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem.^[77] It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.

Apple A9

The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015.^[78] Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8.^[78] It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.

Apple A9X

The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro.^[79] It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.^[80]

Apple A10 Fusion

The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016.^[81] The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch.^[82] It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.

Apple A10X Fusion

The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017.^[83] It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X.^[83] On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.^[84]

Apple A11 Bionic

The Apple A11 Bionic is a 64-bit ARM-based SoC^[85] that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017.^[85] It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10.^[85]^[86] It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.^[87]

Apple A12 Bionic

The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic.^[88] The A12 is manufactured by TSMC^[89] using a 7 nm^[90] FinFET process, the first to ship in a smartphone.^[91]^[89] It is also used in the 6th generation Apple TV.

Apple A12X Bionic

The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018.^[92] It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.

Apple A12Z Bionic

The Apple A12Z Bionic is an updated version of the A12X Bionic, first appearing in the fourth generation iPad Pro, which was announced on March 18, 2020.^[93] It adds an additional GPU core, compared to the A12X, for improved graphics performance.^[94] The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.^[95]

Apple A13 Bionic

The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020), the 9th generation iPad (announced September 14, 2021) and in the Studio Display (announced March 8, 2022)

The entire A13 SoC features a total of 18 cores – a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.^[96]

Apple A14 Bionic

The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor.^[97] It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities. It was later used in the tenth-generation iPad, released on October 26, 2022.

Apple A15 Bionic

The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13 and 13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.^[98]^[99] It is also used in the iPhone SE (3rd generation), iPhone 14, iPhone 14 Plus and iPad Mini 6.^[100]

Apple A16 Bionic

The Apple A16 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 14 Pro, unveiled on September 7, 2022. The A16 has 16 billion transistors and is built on TSMC's N4P fabrication process, being touted by Apple as the first 4 nm processor in a smartphone.^[101]^[102] However, N4 is an enhanced version of N5 technology, a de facto fourth-generation 5 nm manufacturing process.^[103]^[104]^[105] The chip has 2 high-performance processing cores, 4 high-efficiency cores and 5-core graphics for iPhone 14 Pro series. Memory is upgraded to LPDDR5 for 50% higher bandwidth and a 7% faster 16-core Neural Engine capable of 17 trillion operations per second.

Apple A17 Pro

The Apple A17 Pro is a 64-bit ARM-based SoC that first appeared in the iPhone 15 Pro, unveiled on September 12, 2023. It is Apple's first 3nm SoC. The chip has 2 high-performance processing cores, 4 high-efficiency cores, a 6-core GPU for iPhone 15 Pro series, and a 16-core Neural Engine capable of 35 trillion operations per second. The GPU was described as their biggest redesign in the history of Apple GPUs, it added hardware accelerated Ray tracing and mesh shading support.^[106]

List of processors

General			Image	Semiconductor technology				Computer architecture		CPU											GPU						AI accelerator		Memory technology					First released date	Devices	Supported OS
Name	Codename	Part No.		Node	Manufacturer	Transistors count	Die size	CPU ISA	Bit width	Performance core			Efficiency core			Overall cores	Cache				Vendor	Cores	SIMD EU count	FP32 ALU count	Frequency	FP32 FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity			Initial	Terminal
Name	Codename	Part No.		Node	Manufacturer	Transistors count	Die size	CPU ISA	Bit width	Core name	Cores	Core speed	Core name	Cores	Core speed		L1	L2	L3	SLC	Vendor	Cores	SIMD EU count	FP32 ALU count	Frequency	FP32 FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity			Initial	Terminal
^[a]	APL0098	S5L8900		90 nm ^[107]	Samsung		72 mm² ^[11]	ARMv6	32-bit	ARM11	1	412 MHz	—	—	—		Single-core	L1i: 16 KB L1d: 16 KB	—	—	—	PowerVR MBX Lite	1	1	8	60 MHz – 103 MHz	0.96 GFLOPS – 1.64 GFLOPS	—	—	16-bit	1 channel 16-bit/channel	LPDDR-266 (133.25 MHz)	533 MB/s	128 MB	June 29, 2007	iPhone iPod Touch (1st Gen)	iPhone OS 1.0
^[b]	APL0278	S5L8720		65 nm ^[11]			36 mm² ^[11]	ARMv6		ARM11		533 MHz				103 MHz – 133 MHz		L1i: 16 KB L1d: 16 KB	—			PowerVR MBX Lite		1	8	1.64 GFLOPs – 2.12 GFLOPS	32-bit			1 channel 32-bit/channel	1066 MB/s	LPDDR-266 (133.25 MHz)	July 11, 2008	128 MB	iPhone 3G iPod Touch (2nd Gen)	iPhone OS 2.1.1
^[c]	APL0298	S5L8920		65 nm ^[11]			71.8 mm² ^[12]	ARMv7		Cortex-A8		600 MHz				L1i: 32 KB L1d: 32 KB		256 KB	PowerVR SGX535 ^[108]			2		16	200 MHz	6.4 GFLOPS					LPDDR-400 (200 MHz)	1.6 GB/s	256 MB	June 19, 2009	iPhone 3GS	iPhone OS 3.0	iOS 6.1.6
^[c]	APL2298	S5L8922		45 nm ^[11]^[12] ^[33]			41.6 mm² ^[11]					600 MHz						256 KB							200 MHz	6.4 GFLOPS						1.6 GB/s		September 9, 2009	iPod Touch (3rd Gen)	iPhone OS 3.1.1	iOS 5.1.1
A4	APL0398	S5L8930					53.3 mm² ^[11]^[12]					800 MHz						512 KB							200 MHz – 250 MHz	6.4 GFLOPS – 8.0 GFLOPS	64-bit			2 channels 32-bit/channel		3.2 GB/s		April 3, 2010	iPad (1st Gen) iPhone 4 iPod Touch (4th Gen) Apple TV (2nd Gen)	iPhone OS 3.2 Apple TV Software 4.0	iOS 6.1.6
												1.0 GHz																									iOS 5.1.1^[d] Apple TV Software 6.2.1
												800 MHz																					512 MB				iOS 7.1.2
A5	APL0498	S5L8940					122.2 mm² ^[33]			Cortex-A9	2	800 MHz					Dual-core	1 MB	PowerVR SGX543 ^[109]^[51]			2	4	32	200 MHz	12.8 GFLOPS					LPDDR2-800 (400 MHz)	6.4 GB/s		March 11, 2011	iPad 2 iPhone 4S	iOS 4.3	iOS 9.3.5^[e] iOS 9.3.6^[f] Apple TV Software 7.6.2
	APL0498	S5L8940					122.2 mm² ^[33]					1.0 GHz																						March 11, 2011	iPad 2 iPhone 4S	iOS 4.3
	APL2498	S5L8942		32 nm Hκ MG ^[34]^[40]			69.6 mm² ^[34]					800 MHz																						March 7, 2012	Apple TV (3nd Gen) iPad 2 iPod Touch (5th Gen) iPad Mini (1st Gen)	iOS 5.1
												1.0 GHz																								iOS 5.1
											2 (One core locked)						Dual-core Single-core in actual																			Apple TV Software 5.0
	APL7498	S5L8947					37.8 mm² ^[40]				1						Single-core																	January 28, 2013	Apple TV (3nd Gen Rev. A)	Apple TV Software 5.2
A5X	APL5498	S5L8945		45 nm ^[11]^[12] ^[33]			165 mm² ^[42]				2						Dual-core					4	8	64		25.6 GFLOPS	128-bit			4 channels 32-bit/channel		12.8 GB/s	1 GB	March 16, 2012	iPad (3rd Gen)	iOS 5.1
A6	APL0598	S5L8950		32 nm Hκ MG ^[52]^[110] ^[55]			96.71 mm² ^[52]^[110]	ARMv7s^[111]		Swift^[49]		1.3 GHz ^[112]										3	6	48	266 or 709 MHz	25.5 or 68.0 GFLOPS	64-bit			2 channels 32-bit/channel	LPDDR2-1066 (533 MHz)	8.5 GB/s		September 21, 2012	iPhone 5 iPhone 5C	iOS 6.0	iOS 10.3.3^[g] iOS 10.3.4^[h]
A6X	APL5598	S5L8955		32 nm Hκ MG ^[52]^[110] ^[55]			123 mm² ^[55]	ARMv7s^[111]		Swift^[49]		1.4 GHz ^[54]							PowerVR SGX554 ^[54]^[113]			4	16	128	300 MHz	76.8 GFLOPS	128-bit			4 channels 32-bit/channel	LPDDR2-1066 (533 MHz)	17.0 GB/s		November 2, 2012	iPad (4th Gen)	iOS 6.0	iOS 10.3.3^[g] iOS 10.3.4^[h]
A7	APL0698	S5L8960		28 nm Hκ MG ^[65]^[114]		1 billion	102 mm² ^[60]^[114]	ARMv8.0-A ^[61]^[69]	64-bit	Cyclone		1.3 GHz				L1i: 64 KB L1d: 64 KB			4 MB (Inclusive) ^[61]^[115]^[59]	PowerVR G6430 ^[63]^[113]					450 MHz	115.2 GFLOPS	64-bit			1 channel 64-bit/channel	LPDDR3-1600 (800 MHz)	12.8 GB/s		September 20, 2013	iPhone 5S iPad Mini 2 iPad Mini 3	iOS 7.0	iOS 12.5.7
A7	APL5698	S5L8965		28 nm Hκ MG ^[65]^[114]		1 billion	102 mm² ^[60]^[114]			Cyclone		1.4 GHz								PowerVR G6430 ^[63]^[113]					450 MHz	115.2 GFLOPS								November 1, 2013	iPad Air (1st Gen)	iOS 7.0.3
A8	APL1011	T7000		20 nm Hκ MG ^[70]^[69]	TSMC	2 billion	89 mm² ^[116]^[77] ^[117]			Typhoon		1.1 GHz								PowerVR GX6450 ^[71]^[118]^[119]					533 MHz	136.4 GFLOPS								September 19, 2014	iPhone 6 & 6 Plus iPod Touch (6th Gen) iPad Mini 4 Apple TV HD HomePod (1st Gen)	iOS 8.0
												1.4 GHz																								iOS 8.0
												1.4 GHz																								audioOS 11.0	HomePod Software 15.6 (Current)
												1.5 GHz																					2 GB			iOS 8.0 tvOS 9.0	iPadOS 15.8.3 (Current) tvOS 18.2 (Current)
A8X	APL1021	T7001				3 billion	128 mm² ^[77]				3	1.5 GHz					3-core	2 MB		PowerVR GX6850 ^[71]^[77]^[117]		8	32	256	450 MHz	230.4 GFLOPS	128-bit			2 channels 64-bit/channel		25.6 GB/s		October 22, 2014	iPad Air 2	iOS 8.1	iPadOS 15.8.3 (Current)
A9	APL0898	S8000		14 nm FinFET ^[120]	Samsung	≥ 2 billion	96 mm² ^[121]			Twister	2	1.85 GHz ^[122]^[123]					Dual-core	3 MB	4 MB (Victim) ^[115]^[124]	PowerVR GT7600 ^[71]^[125]		6	24	192	650 MHz	249.6 GFLOPS	64-bit			1 channel 64-bit/channel	LPDDR4-3200 (1600 MHz)			September 25, 2015	iPhone 6S & 6S Plus iPhone SE (1st Gen) iPad (5th Gen)	iOS 9.0	iOS 15.8.3 (Current) iPadOS 16.7.10 (Current) tvOS 18.2 (Current)
A9	APL1022	S8003		16 nm FinFET ^[121]^[126] ^[127]	TSMC	≥ 2 billion	104.5 mm² ^[121]					1.85 GHz ^[122]^[123]							4 MB (Victim) ^[115]^[124]	PowerVR GT7600 ^[71]^[125]		6	24	192		249.6 GFLOPS	64-bit			1 channel 64-bit/channel				September 25, 2015	iPhone 6S & 6S Plus iPhone SE (1st Gen) iPad (5th Gen)	iOS 9.0
A9X	APL1021	S8001				≥ 3 billion	143.9 mm² ^[126]^[84]					2.16 GHz ^[128]^[129]							— ^[115]^[126]	PowerVR GT7850 ^[71]^[126]		12	48	384		499.2 GFLOPS	128-bit (64-bit in actual)			2 channels (one channel is unused) 64-bit/channel				November 11, 2015	iPad Pro 9.7-inch (2016) & iPad Pro 12.9-inch (2015)	iOS 9.1
A9X	APL1021	S8001				≥ 3 billion	143.9 mm² ^[126]^[84]					2.26 GHz							— ^[115]^[126]	PowerVR GT7850 ^[71]^[126]		12	48	384		499.2 GFLOPS	128-bit			2 channels 64-bit/channel		51.2 GB/s	4 GB	November 11, 2015	iPad Pro 9.7-inch (2016) & iPad Pro 12.9-inch (2015)	iOS 9.1
A10 Fusion	APL1W24	T8010				3.3 billion	125 mm² ^[127]	ARMv8.1-A		Hurricane	2	1.64 GHz	Zephyr	2	1.09 GHz	Quad-core (Only 2 cores performed at a same time)	P-core: L1i: 64 KB L1d: 64 KB E-core: L1i: 32 KB L1d: 32KB	P-core: 3 MB E-core: 1 MB	4 MB	PowerVR GT7600 Plus^[130]^[71] ^[131]^[132]		6	24	192	900 MHz	345.6 GFLOPS	64-bit			1 channel 64-bit/channel		25.6 GB/s	2 GB	September 16, 2016	iPhone 7 & 7 Plus iPad (6th Gen) iPad (7th Gen) iPod Touch (7th gen)	iOS 10.0
												2.34 GHz																					2 GB
												2.34 GHz																					3 GB
A10X Fusion	APL1071	T8011		10 nm FinFET ^[84]		≥ 4 billion	96.4 mm² ^[84]				3	2.38 GHz		3	1.30 GHz	6-core (Only 3 cores performed at a same time)		P-core: 8 MB E-core: 1 MB	— ^[133]^[134]		4 MB	12	48	384	1000 MHz	768.0 GFLOPS	128-bit			2 channels 64-bit/channel		51.2 GB/s	3 GB	June 13, 2017	iPad Pro 10.5-inch (2017) & iPad Pro 12.9-inch (2nd Gen) Apple TV 4K (2017)	tvOS 11.0
A10X Fusion	APL1071	T8011				≥ 4 billion	96.4 mm² ^[84]				3	2.38 GHz		3	1.30 GHz	6-core (Only 3 cores performed at a same time)						12	48	384	1000 MHz	768.0 GFLOPS	128-bit			2 channels 64-bit/channel		51.2 GB/s	4 GB	June 13, 2017		iOS 10.3.2
A11 Bionic	APL1W72	T8015				4.3 billion	87.66 mm² ^[135]	ARMv8.2-A ^[136]		Monsoon	2	2.39 GHz	Mistral	4 (1 efficiency core disabled in Apple TV 4K 3rd Gen)	1.19 GHz	6-core				First generation Apple- designed		3	12	192	1066 MHz	409.3 GFLOPS	2	600 billion OPS	64-bit	4 channels 16-bit/channel	LPDDR4X-4266 (2133 MHz)	34.1 GB/s	2 GB	September 22, 2017	iPhone 8 & 8 Plus iPhone X	iOS 11.0	iOS 16.7.10 (Current)
A11 Bionic	APL1W72	T8015				4.3 billion	87.66 mm² ^[135]	ARMv8.2-A ^[136]		Monsoon		2.39 GHz	Mistral		1.19 GHz					First generation Apple- designed		3	12	192	1066 MHz	409.3 GFLOPS	2	600 billion OPS					3 GB	September 22, 2017	iPhone 8 & 8 Plus iPhone X	iOS 11.0	iOS 16.7.10 (Current)
A12 Bionic	APL1W81	T8020		7 nm (N7) FinFET		6.9 billion	83.27 mm² ^[137]	ARMv8.3-A ^[138]		Vortex		2.49 GHz	Tempest		1.59 GHz		P-core: L1i: 128 KB L1d: 128 KB E-core: L1i: 32 KB L1d: 32KB	P-core: 8 MB E-core: 2 MB		8 MB	Second generation Apple- designed (Apple G11P)	4	16	256	1125 MHz	576.0 GFLOPS	8	5 TOPS					3 GB	September 21, 2018	iPhone XS & XS Max iPhone XR iPad Mini (5th Gen) iPad Air (3rd Gen) iPad (8th Gen) Apple TV 4K (2nd Gen)	iOS 12.0 tvOS 14.5	iOS 18.2 (Current) iPadOS 18.2 (Current) tvOS 18.2 (Current)
A12 Bionic	APL1W81	T8020				6.9 billion	83.27 mm² ^[137]														Second generation Apple- designed (Apple G11P)	4	16	256		576.0 GFLOPS							4 GB	September 21, 2018		iOS 12.0 tvOS 14.5
A12X Bionic	APL1083	T8027				10 billion	135 mm² ^[139]				4					8-core					Second generation Apple- designed (Apple G11G)	7	28	448		1.008 TFLOPS			128-bit	2 channels 64-bit/channel		68.2 GB/s	4 GB	November 7, 2018	iPad Pro 11-inch (1st Gen) & iPad Pro 12.9-inch (3rd Gen)	iOS 12.1
A12X Bionic																						7	28	448		1.008 TFLOPS							6 GB	November 7, 2018	iPad Pro 11-inch (1st Gen) & iPad Pro 12.9-inch (3rd Gen)	iOS 12.1
A12Z Bionic																						8	32	512		1.152 TFLOPS							6 GB	March 25, 2020	iPad Pro 11-inch (2nd Gen) & iPad Pro 12.9-inch (4th Gen)	iPadOS 13.4
A12Z Bionic																						8	32	512		1.152 TFLOPS							16 GB	June 22, 2020	Developer Transition Kit (ARM, 2020)	macOS Big Sur 11.0 Beta 1	macOS Big Sur 11.3 Beta 2
A13 Bionic	APL1W85	T8030		7 nm (N7P) FinFET		8.5 billion	98.48 mm² ^[140]	ARMv8.4-A ^[141]		Lightning	2 (under clocked to 2.93 GHz on iPad Mini (6th Gen) & Apple TV 4K (3rd Gen)	2.65 GHz	Thunder		1.72 GHz	6-core	P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 96 KB L1d: 48 KB	P-core: 8 MB E-core: 4 MB		16 MB	Third generation Apple- designed ^[142]	4	16 ^[143]	256	1350 MHz	691.2 GFLOPS		5.5 TOPS	64-bit	4 channels 16-bit/channel		34.1 GB/s	3 GB	September 20, 2019	iPhone 11 iPhone 11 Pro & 11 Pro Max iPhone SE (2nd Gen) iPad (9th Gen) Apple Studio Display	iOS 13.0 iPadOS 13.0	iOS 18.2 (Current) iPadOS 18.2 (Current) tvOS 18.2 (Current)
A13 Bionic	APL1W85	T8030		7 nm (N7P) FinFET		8.5 billion	98.48 mm² ^[140]	ARMv8.4-A ^[141]		Lightning		2.65 GHz	Thunder		1.72 GHz						Third generation Apple- designed ^[142]				1350 MHz	691.2 GFLOPS		5.5 TOPS					4 GB	September 20, 2019		iOS 13.0 iPadOS 13.0
A14 Bionic	APL1W01	T8101		5 nm (N5) FinFET		11.8 billion	88 mm² ^[144]	ARMv8.5-A ^[145]		Firestorm		3.09 GHz	Icestorm		1.82 GHz		P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB				Fourth generation Apple- designed ^[146]^[142]^[147] ^[148]				1462.5 MHz	748.8 GFLOPS	16	11 TOPS					4 GB	October 23, 2020	iPad (10th Gen) iPad Air (4th Gen) iPhone 12 & 12 Mini iPhone 12 Pro & 12 Pro Max	iOS 14.0 iPadOS 14.0
A14 Bionic	APL1W01	T8101		5 nm (N5) FinFET		11.8 billion	88 mm² ^[144]			Firestorm		3.09 GHz	Icestorm		1.82 GHz						Fourth generation Apple- designed ^[146]^[142]^[147] ^[148]				1462.5 MHz	748.8 GFLOPS		11 TOPS					4 GB	October 23, 2020		iOS 14.0 iPadOS 14.0
A15 Bionic	APL1W07 ^[149]	T8110		5 nm (N5P) FinFET		15 billion	108.01 mm² ^[149]			Avalanche		3.24 GHz	Blizzard		2.02 GHz			P-core: 12 MB E-core: 4 MB		32 MB	Fifth generation Apple- designed ^[150]^[151]^[152]			512 ^[143]	1338 MHz ^[143]^[153]	1.370 TFLOPS		15.8 TOPS					4 GB	September 24, 2021	iPhone SE (3rd Gen) iPhone 13 & 13 Mini iPhone 13 Pro & 13 Pro Max iPhone 14 & 14 Plus iPad mini (6th Gen) Apple TV 4K (3rd Gen)^[154]	iOS 15.0 iPadOS 15.0 tvOS 16.1
												2.93 GHz										5	20 ^[153]^[155]	640 ^[153]^[155]		1.712 TFLOPS							4 GB
												3.24 GHz														1.712 TFLOPS							6 GB
A16 Bionic	APL1W10 ^[156]	T8120		4 nm (N4P) FinFET ^[103]^[104] ^[105]^[102] ^[157]		16 billion	112.75 mm² ^[158]	ARMv8.6-A ^[159]		Everest ^[160]^[161]		3.46 GHz	Sawtooth ^[160]^[161]					P-core: 16 MB E-core: 4 MB ^[162]		24 MB ^[162]	Sixth generation Apple- designed				1398 MHz ^[155]	1.789 TFLOPS ^[155]		17 TOPS			LPDDR5-6400 (3200 MHz)	51.2 GB/s	6 GB	September 16, 2022	iPhone 14 Pro & 14 Pro Max iPhone 15 & 15 Plus	iOS 16.0
A17 Pro	APL1V02	T8130		3 nm (N3B) FinFET		19 billion	103.80 mm² ^[158]			—		3.78 GHz ^[163]	—		2.11 GHz ^[163]			P-core: 16 MB E-core: 4 MB ^[162]		24 MB ^[162]	Seventh generation Apple- designed	6	24	768	1398 MHz ^[155]	2.147 TFLOPS		35 TOPS			LPDDR5-6400 (3200 MHz)	51.2 GB/s	8 GB	September 22, 2023	IPhone 15 Pro & 15 Pro Max	iOS 17.0
Name	Codename	Part No.	Image	Node	Manufacturer	Transistors count	Die size	CPU ISA	Bit width	Core name	Cores	Core speed	Core name	Cores	Core speed	Overall cores	L1	L2	L3	SLC	Vendor	Cores	EU count	ALU count	Frequency	FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	First released date	Devices	Initial	Terminal
Name	Codename	Part No.		Node	Manufacturer	Transistors count	Die size	CPU ISA	Bit width	Performance core			Efficiency core			Overall cores	Cache				Vendor	Cores	EU count	ALU count	Frequency	FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity			Initial	Terminal
General				Semiconductor technology				Computer architecture		CPU											GPU						AI accelerator		Memory technology							Supported OS

H series

The Apple "H" series is a family of SoCs with low-power audio processing and wireless connectivity for use in headphones.

Apple H1

The Apple H1 chip was used in AirPods 2nd and 3rd generation. It was also used in the Powerbeats Pro, the Beats Solo Pro, Beats Fit Pro, the AirPods Pro, the 2020 Powerbeats, AirPods Max.^[164] Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands,^[165] and offers 30 percent lower latency than the W1 chip used in earlier AirPods.^[166]

Apple H2

The Apple H2 chip was first used in the 2022 version of AirPods Pro. It has Bluetooth 5.3, and implements 48 kHz noise reduction in hardware.

List of processors

Name	Model no.	Image	Bluetooth	First Released
H1	343S00289^[167] (AirPods 2nd Generation) 343S00290^[168] (AirPods 2nd Generation) 343S00404^[169] (AirPods Max) H1 SiP^[170] (AirPods Pro)		5.0	March 20, 2019
H2	AirPods Pro (2nd generation)		5.3	September 7, 2022

M series

The Apple "M" series is a family of systems on a chip (SoC) used in Mac computers from November 2020 or later, iPad Pro tablets from April 2021 or later, iPad Air tablets from March 2022 or later, and Vision Pro. The "M" designation was previously used for Apple motion coprocessors.

Evolution of Apple "M" series

M1
November 10, 2020 – present

M1 Pro
October 18, 2021 – January 17, 2023

M1 Max
October 18, 2021 – June 5, 2023

M1 Ultra
March 8, 2022 – June 5, 2023

M2
June 6, 2022 – present

M2 Pro
January 17, 2023 – present

M2 Max
January 17, 2023 – present

M2 Ultra
June 5, 2023 – present

M3
October 30, 2023 – present

M3 Pro
October 30, 2023 – present

M3 Max
October 30, 2023 – present

Apple M1

The M1, Apple's first system on a chip designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it is used in the MacBook Air (M1, 2020), Mac mini (M1, 2020), MacBook Pro (13-inch, M1, 2020), iMac (24-inch, M1, 2021), iPad Pro (5th generation) and iPad Air (5th generation). It comes with 4 performance cores and 4 efficiency cores, for a total of 8 CPU cores. It comes with up to 8 GPU cores, with the entry level MacBook Air having only 7 GPU cores. The M1 has 16 billion transistors.^[171]

Apple M1 Pro

The M1 Pro is a more powerful version of the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple claimed the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).

Apple M1 Max

The M1 Max is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro, as well as the Mac Studio. Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.

Apple M1 Ultra

The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple's UltraFusion technology.^[172] It has 114 billion transistors, 16 performance cores, 4 efficiency cores, 48 to 64 GPU cores and 32 Neural Engine cores; it can be configured with up to 128 GB unified RAM of 800 GB/s memory bandwidth. It was announced on March 8, 2022, as an optional upgrade for the Mac Studio. Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback.^[173]

Apple M2

Apple announced the M2 SoC on June 6, 2022, at WWDC, along with the new MacBook Air and the new 13-inch MacBook Pro and later the iPad Pro (6th generation). It is the successor to the Apple M1. The M2 is made with TSMC's "Enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the previous generation M1. The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. The M2 also increases the memory bandwidth to 100 GB/s. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the previous M1.^[174]

Apple M2 Pro

The M2 Pro is a more powerful version of the M2, with six to eight performance cores, four efficiency cores, 16 to 19 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and double the transistors. It was announced on January 17, 2023 in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro as well as the Mac Mini. Apple claims the CPU performance is 20 percent faster than the M1 Pro and the GPU is 30 percent faster than the M1 Pro.^[175]

Apple M2 Max

The M2 Max is a larger version of the M2 Pro, with eight performance cores, four efficiency cores, 30 to 38 GPU cores, 16 Neural Engine cores, up to 96 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It was announced on January 17, 2023 in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro, as well as the Mac Studio.^[176] Apple claims the CPU performance is 20 percent faster than M1 Max and the GPU is 30 percent faster than the M1 Max.^[175]

Apple M2 Ultra

The M2 Ultra consists of two M2 Max dies connected together by a silicon interposer through Apple's UltraFusion technology. It has 134 billion transistors, 16 performance cores, 8 efficiency cores, 60 to 76 GPU cores and 32 Neural Engine cores; it can be configured with up to 192 GB unified RAM of 800 GB/s memory bandwidth. It was announced on June 5, 2023, as an optional upgrade for the Mac Studio and the sole processor for the Mac Pro. Apple claims the M2 Ultra can deliver up to 22 streams of 8K ProRes video playback.^[177]

Apple M3

In late October 2023, Apple's "Scary Fast" Showcase launched the M3, M3 Pro, and M3 Max chips, all based on the 3nm process. These were showcased in 24" iMac. Apple’s M3 chips offer up to 128GB of unified memory, with the most powerful M3 Max chip coming with up to 92 billion transistors, a 40-core GPU, and a 16-core CPU.^[178]

Apple M3 Pro

Apple M3 Max

List of processors


General			Semiconductor technology		CPU										GPU						AI accelerator		Memory technology					Connectivity				First released date	Devices	Supported OS
Name	Codename and part no.	Image	Process	Transistor count and die size	CPU ISA	Codename		Cores		Clocks (GHz)		Cache			Vendor	Cores	SIMD EU count	FP32 ALU count	Frequency	FP32 FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	Ports			External display			Initial	Terminal
Name	Codename and part no.	Image	Process	Transistor count and die size	CPU ISA	P	E	P	E	P	E	L1	L2	SLC	Vendor	Cores	SIMD EU count	FP32 ALU count	Frequency	FP32 FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	Thunderbolt	USB	Max	External display			Initial	Terminal
M1	APL1102 T8103		TSMC N5	16 billion 118.91 mm² ^[179]	ARMv8.5-A	Firestorm	Icestorm	4	4	3.204	2.064	P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB	P-core: 12 MB E-core: 4 MB	8 MB	Fourth generation Apple-designed	7	28	896	1278 MHz	2.290 TFLOPS	16	11 TOPS	128-bit	2 channels 64-bit/channel	LPDDR4X-4266 (2133 MHz)	68.25 GB/s	8 GB 16 GB^[i]	Thunderbolt 3 (Up to 40 Gbit/s)^[j]	USB4 (Up to 40 Gbit/s)^[k] USB 3.1 Gen 2 (Up to 10 Gbit/s)	iPad Air/Pro: 1x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility^[l] MacBook Air/Pro: 2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility & 1x 3.5 mm headphone jack iMac (4 ports): 2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet Mac mini: 2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 1 or 10 Gb Ethernet	All: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt/USB-C Mac mini: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI	November 17, 2020	MacBook Air (M1, 2020) – base model has 7-core GPU^[180] Mac Mini (M1, 2020)^[181] MacBook Pro (13-inch, M1, 2020)^[182] iMac (24-inch, M1, 2021) – base model has 7-core GPU^[183] iPad Pro (11-inch, 3rd Gen)^[184](2021) iPad Pro (12.9-inch, 5th Gen)^[184] (2021) iPad Air (5th Gen) (2022)	macOS Big Sur 11.0 iPadOS 14.5	macOS Sequoia 15.2 (Current) iPadOS 18.2 (Current)
M1	APL1102 T8103			16 billion 118.91 mm² ^[179]				4	4	3.204			P-core: 12 MB E-core: 4 MB	8 MB		8	32	1024	1278 MHz	2.617 TFLOPS			128-bit	2 channels 64-bit/channel	LPDDR4X-4266 (2133 MHz)	68.25 GB/s	8 GB 16 GB^[i]	Thunderbolt 3 (Up to 40 Gbit/s)^[j]				November 17, 2020		macOS Big Sur 11.0 iPadOS 14.5	macOS Sequoia 15.2 (Current) iPadOS 18.2 (Current)
M1 Pro	APL1103 T6000			33.7 billion ≈ 245 mm² ^[185]				6	2	3.228			P-core: 24 MB E-core: 4 MB	24 MB		14	56	1792	1296 MHz	4.644 TFLOPS			256-bit	2 channels 128-bit/channel	LPDDR5-6400 (3200 MHz)	204.8 GB/s	16 GB 32 GB^[m]	Thunderbolt 4 (Up to 40 Gbit/s)		MacBook Pro: 3x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x MagSafe 3	Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt or One 6016 x 3384 at 60 Hz at 10-bit color depth display over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI	October 26, 2021	MacBook Pro (14-inch and 16-inch, 2021)	macOS Monterey 12.0	macOS Sequoia 15.2 (Current)
								8								14	56	1792		4.644 TFLOPS
																16	64	2048		5.308 TFLOPS
M1 Max	APL1105 T6001 ^[186]			57 billion ≈ 432 mm² ^[185]										48 MB		24	96	3072		7.962 TFLOPS			512-bit	4 channels 128-bit/channel		409.6 GB/s	32 GB 64 GB^[n]			MacBook Pro: 3x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x MagSafe 3 Mac Studio: 4x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet	MacBook Pro: Three 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI Mac Studio: Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI		MacBook Pro (14-inch and 16-inch, 2021) - 14-inch build-to-order only Mac Studio (2022)
M1 Max	APL1105 T6001 ^[186]			57 billion ≈ 432 mm² ^[185]										48 MB		32	128	4096		10.616 TFLOPS			512-bit	4 channels 128-bit/channel		409.6 GB/s	32 GB 64 GB^[n]
M1 Ultra	APL1W06 T6002			114 billion ≈ 864 mm²				16	4				P-core: 48 MB E-core: 8 MB	96 MB		48	192	6144		15.925 TFLOPS	32	22 TOPS	1024-bit	8 channels 128-bit/channel		819.2 GB/s	64 GB 128 GB^[o]			Mac Studio: 6x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet	Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI	March 18, 2022	Mac Studio (2022)	macOS Monterey 12.3
M1 Ultra	APL1W06 T6002			114 billion ≈ 864 mm²				16	4				P-core: 48 MB E-core: 8 MB	96 MB		64	256	8192		21.233 TFLOPS	32	22 TOPS	1024-bit	8 channels 128-bit/channel		819.2 GB/s	64 GB 128 GB^[o]					March 18, 2022	Mac Studio (2022)	macOS Monterey 12.3
M2	APL1109 T8112		TSMC N5P	20 billion 155.25 mm² ^[179]		Avalanche	Blizzard	4	4	3.504	2.424		P-core: 16 MB E-core: 4 MB	8 MB	Fifth generation Apple-designed	8	32	1024	1398 MHz	2.863 TFLOPS	16	15.8 TOPS	128-bit	2 channels 64-bit/channel		102.4 GB/s	8 GB 16 GB^[p] 24 GB^[q]	Thunderbolt 3 (Up to 40 Gbit/s)^[r] Thunderbolt 4 (Up to 40 Gbit/s)^[s]		iPad Pro: 1x TB 3 with DP 1.4/USB4/ USB 3.1 Gen 2 compatibility MacBook Air/Pro: 2x TB 3 with DP 1.4/USB4/ USB 3.1 Gen 2 compatibility & 1x 3.5 mm headphone jack Mac mini: 2x TB 4 with DP 1.4/USB4/ USB 3.1 Gen 2 compatibility, 2x USB-A 3.0, 1x HDMI 2.0, 1x 3.5 mm headphone jack & 1x 1 or 10 Gb Ethernet	All: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt Mac mini: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt and one 5120 x 2880 at 60 Hz at 8-bit color depth display over Thunderbolt or One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI	June 24, 2022	MacBook Air (13-inch, M2, 2022) base model has 8-core GPU MacBook Air (15-inch, M2, 2023) MacBook Pro (13-inch, M2, 2022) iPad Pro (11-inch, 6th Gen) (2022) iPad Pro (12.9-inch, 6th Gen) (2022) Mac Mini (2023) Vision Pro (2024)^[187]	macOS Monterey 12.4 iPadOS 16.1	macOS Sequoia 15.2 (Current) iPadOS 18.2 (Current)
M2	APL1109 T8112			20 billion 155.25 mm² ^[179]				4					P-core: 16 MB E-core: 4 MB	8 MB		10	40	1280		3.578 TFLOPS			128-bit	2 channels 64-bit/channel		102.4 GB/s	8 GB 16 GB^[p] 24 GB^[q]					June 24, 2022		macOS Monterey 12.4 iPadOS 16.1	macOS Sequoia 15.2 (Current) iPadOS 18.2 (Current)
M2 Pro	APL1113 T6020			40 billion				6					P-core: 32 MB E-core: 4 MB	24 MB		16	64	2048		5.726 TFLOPS			256-bit	4 channels 64-bit/channel		204.8 GB/s	16 GB 32 GB^[t]	Thunderbolt 4 (Up to 40 Gbit/s)		MacBook Pro: 3x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1 & 1x MagSafe 3 & 1x 3.5 mm headphone jack Mac mini: 4x TB 4 with DP 1.4/USB4/ USB 3.1 Gen 2 compatibility, 2x USB-A 3.0, 1x HDMI 2.1, 1x 3.5 mm headphone jack & 1x 1 or 10 Gb Ethernet	All: One 6016 x 3384 at 60 Hz at 10-bit color depth display over Thunderbolt and one 3840 x 2160 at 144 Hz at 8-bit color depth display over HDMI or One 3840 x 2160 at 240 Hz at 8-bit color depth display over HDMI or One 7680 x 4320 at 60 Hz at 8-bit color depth display over HDMI or MacBook Pro: Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt Mac mini: Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI	January 24, 2023	MacBook Pro (14-inch and 16-inch, early 2023) Mac Mini (2023)	macOS Ventura 13.2	macOS Sequoia 15.2 (Current)
M2 Pro	APL1113 T6020			40 billion				8						24 MB		19	76	2432		6.799 TFLOPS			256-bit	4 channels 64-bit/channel		204.8 GB/s	16 GB 32 GB^[t]
M2 Max	APL1111 T6021			67 billion						3.696 ^[188]				48 MB		30	120	3840		10.736 TFLOPS			512-bit	4 channels 128-bit/channel		409.6 GB/s	32 GB 64 GB^[u] 96 GB^[v]			MacBook Pro: 3x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x MagSafe 3 & 1x 3.5 mm headphone jack Mac Studio: 4x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet	All: Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 7680 x 4320 at 60 Hz at 8-bit color depth display over HDMI or Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 240 Hz at 8-bit color depth display over HDMI or MacBook Pro: Three 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 144 Hz at 8-bit color depth display over HDMI or Mac Studio: Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI		MacBook Pro (14-inch and 16-inch, early 2023) Mac Studio (2023)^[189]
M2 Max	APL1111 T6021			67 billion						3.696 ^[188]				48 MB		38	152	4864		13.599 TFLOPS			512-bit	4 channels 128-bit/channel		409.6 GB/s	32 GB 64 GB^[u] 96 GB^[v]
M2 Ultra	APL1W12			134 billion				16	8	~3.000 -3.696 ^[190]^[191]			P-core: 64 MB E-core: 8 MB	96 MB		60	240	7680		21.473 TFLOPS	32	31.6 TOPS	1024-bit	8 channels 128-bit/channel		819.2 GB/s	64 GB 128 GB^[w] 192 GB^[x]			Mac Studio: 6x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-A 3.0, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x 3.5 mm headphone jack & 1x 10 Gb Ethernet Mac Pro: 8x TB 4 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 3x USB-A 3.0, 2x HDMI 2.1, 2x SATA 3.5, 1x 3.5 mm headphone jack, 2x 10 Gb Ethernet & 7x PCI Express expansion slots (1x 1/2 length Gen 3 x4, 6x full length Gen 4 (4x8 & 2x16))	Eight 3840 x 2160 at 60 Hz at 10-bit color depth displays or Six 6016 x 3384 at 60 Hz at 10-bit color depth displays or Three 7680 x 4320 at 60 Hz at 8-bit color depth displays over HDMI	June 13th, 2023	Mac Studio (2023) Mac Pro (2023)	macOS Ventura 13.4
M2 Ultra	APL1W12			134 billion				16	8	~3.000 -3.696 ^[190]^[191]			P-core: 64 MB E-core: 8 MB	96 MB		76	304	9728		27.199 TFLOPS	32	31.6 TOPS	1024-bit	8 channels 128-bit/channel		819.2 GB/s	64 GB 128 GB^[w] 192 GB^[x]					June 13th, 2023	Mac Studio (2023) Mac Pro (2023)	macOS Ventura 13.4
M3			TSMC N3E	25 billion	ARMv8.6-A	—	—	4	4	4.05	2.75	P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB	P-core: 16 MB E-core: 4 MB		Seventh generation Apple-designed	8	128	1024			16		128-bit	2 channels 64-bit/channel		102.4 GB/s	8 GB 16 GB 24 GB	Thunderbolt 3 (Up to 40 Gbit/s)		Macbook Pro: 2x TB 3 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x MagSafe 3 & 1x 3.5 mm headphone jack iMac (2 ports): 2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet iMac (4 ports): 2x TB 3 with DP 1.4/USB 3.1 Gen 2/USB4 compatibility, 2x USB-C 3.1 Gen 2, 1x 3.5 mm headphone jack & 1x 1 Gb Ethernet		October 30, 2023	MacBook Pro (14-inch, late 2023) iMac (24-inch, 2023) – base model has 8-core GPU	macOS Sonoma 14.1
M3				25 billion				4	4				P-core: 16 MB E-core: 4 MB			10	160	1280					128-bit	2 channels 64-bit/channel		102.4 GB/s	8 GB 16 GB 24 GB	Thunderbolt 3 (Up to 40 Gbit/s)
M3 Pro				37 billion				5	6				P-core: 32 MB E-core: 4 MB			14	224	2048					192-bit	2 channels 96-bit/channel		153.6 GB/s	18 GB 36 GB	Thunderbolt 4 (Up to 40 Gbit/s)		MacBook Pro: 3x TB 4 with DP 1.4/ USB 3.1 Gen 2/USB4 compatibility, 1x SDXC card slot (UHS-II), 1x HDMI 2.1, 1x MagSafe 3 & 1x 3.5 mm headphone jack			MacBook Pro (14-inch and 16-inch, late 2023)
M3 Pro				37 billion				6	6							18	288	2304					192-bit	2 channels 96-bit/channel		153.6 GB/s	18 GB 36 GB
M3 Max				92 billion				10	4							30	480	3840					384-bit	4 channels 96-bit/channel		307.2 GB/s	36 GB 96 GB
M3 Max				92 billion				12	4							40	640	5120					512-bit	4 channels 128-bit/channel		409.6 GB/s	48 GB 64 GB 128 GB
Name	Codename and part no.	Image	Process	Transistor count and die size	CPU ISA	P	E	P	E	P	E	L1	L2	SLC	Vendor	Cores	EU count	ALU count	Frequency	FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	Thunderbolt	USB	Max	External display	First released date	Devices	Initial	Terminal
Name	Codename and part no.	Image	Process	Transistor count and die size	CPU ISA	Codename		Cores		Clocks (GHz)		Cache			Vendor	Cores	EU count	ALU count	Frequency	FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	Ports			External display			Initial	Terminal
General			Semiconductor technology		CPU										GPU						AI accelerator		Memory technology					Connectivity						Supported OS

R series

Apple R1

The Apple R1 was announced by Apple on June 5, 2023 at its Worldwide Developers Conference. It will be used in the Apple Vision Pro headset. The Apple R1 is dedicated to the real time processing of sensor inputs and delivering extremely low-latency images to the displays.

S series

Evolution of Apple "S" series

S1
September 9, 2014 – September 7, 2016

S2
September 7, 2016 – September 12, 2017

S1P
September 7, 2016 – September 12, 2018

S3
September 12, 2017 – September 7, 2022

S4
September 12, 2018 – September 10, 2019

S5
September 10, 2019 – present

S6
September 15, 2020 – September 14, 2021

S7
September 14, 2021 – September 7, 2022
January 18, 2023 – present

S8
September 7, 2022 – present

S9
September 12, 2023 – present

The Apple "S" series is a family of systems in a package (SiP) used in the Apple Watch and HomePod. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O form a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.

Apple S1

The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.^[192]

Apple S1P

Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.^[193]^[194]

Apple S2

Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor,^[195] and is similar in performance to the Apple S1P.^[196]

Apple S3

Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver.^[197] There is also an option for a cellular modem and an internal eSIM module.^[197] It also includes the W2 chip.^[197] The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.^[197]

Apple S4

Used in the Apple Watch Series 4. It has a custom 64-bit dual-core processor based on the A12 with up to 2× faster performance. It also contains the W3 wireless chip, which supports Bluetooth 5. The S4 introduced 64-bit ARMv8 cores to the Apple Watch. The chip contains two Tempest cores,^[198]^[199] which are the energy-efficient cores found in the A12. Despite the small size, Tempest still uses a 3-wide decode out-of-order superscalar design, which make them much more powerful than previous in-order cores.

The S4 contains a Neural Engine that is able to run Core ML.^[200] Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed.^[201] It also contains a new custom GPU, which can use the Metal API.^[202]

Apple S5

Used in the Apple Watch Series 5, Watch SE, and HomePod mini.^[203] It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.^[204]

Apple S6

Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5.^[205]^[206] The dual cores in the S6 are based on the A13's energy-efficient "little" Thunder cores at 1.8 GHz.^[207] Like the S4 and S5, it also contains the W3 wireless chip.^[206] The S6 adds the new U1 ultra wideband chip, an always-on altimeter, and 5 GHz WiFi.^[205]^[206]

Apple S7

Used in the Apple Watch Series 7 and second-generation HomePod. The S7 has the same T8301 identifier and quoted performance as the S6.^[208]

Apple S8

Used in the Apple Watch SE (2nd generation), Watch Series 8, and Watch Ultra. The S8 adds a new three-axis gyroscope and high g-force accelerometer.^[209] It has the same T8301 identifier and quoted performance as the S6 and S7.^[210]

Apple S9

Used in the Apple Watch Series 9 and Watch Ultra 2. The S9 has a new dual-core CPU with 60 percent more transistors than the S8, and a new four-core Neural Engine.^[211]

List of processors

Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	Modem	First Released	Utilizing devices	Initial OS	Terminal OS
S1	APL 0778 ^[212]		28 nm Hκ MG^[213]^[214]	32 mm²^[213]	ARMv7k^[214]^[215]	520 MHz single-core Cortex-A7^[214]	L1d: 32 KB^[214] L2: 256 KB^[214]	PowerVR Series 5^[214]^[216]	LPDDR3^[217]		April 2015	Apple Watch (1st generation)	watchOS 1.0	watchOS 4.3.2
S1P	TBC		TBC		ARMv7k^[218]^[219]^[195]	520 MHz dual-core Cortex-A7 without GPS^[218]	TBC	PowerVR Series 6 'Rogue'^[218]	LPDDR3		September 2016	Apple Watch Series 1	watchOS 3.0	watchOS 6.3
S2					ARMv7k^[218]^[219]^[195]	520 MHz dual-core Cortex-A7^[218]	TBC	PowerVR Series 6 'Rogue'^[218]	LPDDR3		September 2016	Apple Watch Series 2	watchOS 3.0	watchOS 6.3
S3					ARMv7k^[220]	Dual-core	TBC		LPDDR4	Qualcomm MDM9635M (Snapdragon X7 LTE)	September 2017	Apple Watch Series 3	watchOS 4.0	watchOS 8.7.1
S4			7 nm (TSMC N7)	TBC	ARMv8-A ILP32^[221]^[222]	1.59 GHz Dual-core Tempest	TBC	Apple G11M^[222]	TBC		September 2018	Apple Watch Series 4	watchOS 5.0	watchOS 10.0 (Current) audioOS 17.0 (Current)
S5			7 nm (TSMC N7)	TBC	ARMv8-A ILP32^[221]^[222]	1.59 GHz Dual-core Tempest	TBC	Apple G11M^[222]	TBC		September 2019	Apple Watch SE Apple Watch Series 5 HomePod Mini	watchOS 6.0 audioOS 14.2
S6			7 nm (TSMC N7P)	TBC		1.8 GHz Dual-core Thunder	TBC				September 2020	Apple Watch Series 6	watchOS 7.0
S7											October 2021	Apple Watch Series 7 HomePod (2nd generation)	watchOS 8.0 audioOS 16.3
S8											September 2022	Apple Watch SE (2nd generation) Apple Watch Series 8 Apple Watch Ultra	watchOS 9.0
S9			TBC			TBC					September 2023	Apple Watch Series 9 Apple Watch Ultra 2	watchOS 10.0
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	Modem	First Released	Utilizing devices	Initial OS	Terminal OS

T series

The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information (Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.^[223] The functions of the T series processor were built into the M series CPUs, thus ending the need for the T series.

Apple T1

The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.^[224]

Apple T2

The Apple T2 security chip is a SoC first released in the iMac Pro. It is a 64-bit ARMv8 chip (a variant of the A10 Fusion, or T8010).^[225] It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive.^[226]^[227]^[228] T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.^[229]^[230]

List of processors

Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	First Released
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory bandwidth	First Released
T1	APL 1023 ^[231]		Same as S2	TBC	ARMv7			TBD		November 12, 2016
T2	APL 1027 ^[232]		TSMC 16 nm FinFET.^[233]	104 mm²^[233]	ARMv8-A ARMv7-A	2× Hurricane 2× Zephyr + Cortex-A7	L1i: 64 KB L1d: 64 KB L2: 3 MB^[233]	3× cores^[233]	LP-DDR4^[233]	December 14, 2017
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory bandwidth	First Released
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	First Released

U series

The Apple "U" series is a family of systems in a package (SiP) implementing ultra-wideband (UWB) radio.

Apple U1

The Apple U1 is used in the iPhone 11 series up until the iPhone 15 series. (excluding the second and third generation iPhone SE), Apple Watch Series 6 (and Apple Watch Ultra) up until the Apple Watch Series 9 (and Apple Watch Ultra 2), HomePod (2nd generation), HomePod Mini, AirTag trackers and the charging case for AirPods Pro (2nd generation).^[234]

List of processors

Name	Model no.	Image	CPU	Semiconductor technology	First Released
U1	TMK A75 ^[235]		Cortex-M4 ARMv7E-M^[236]	16 nm FinFET (TSMC 16FF)	September 20, 2019
Name	Model no.	Image	CPU	Semiconductor technology	First Released

W series

The Apple "W" series is a family of RF SoCs used for Bluetooth and Wi-Fi connectivity.

Apple W1

The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones.^[237]^[238] It maintains a Bluetooth^[239] Class 1 connection with a computer device and decodes the audio stream that is sent to it.^[240]

Apple W2

The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple claimed the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.^[197]

Apple W3

The Apple W3 is used in the Apple Watch Series 4,^[241] Series 5,^[242] Series 6,^[206] SE (1st generation),^[206] Series 7, Series 8, SE (2nd generation), and Ultra. It is integrated into the Apple S4, S5, S6, S7 and S8 SiPs. It supports Bluetooth 5.0/5.3.

List of processors

Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	Memory technology	Bluetooth	First Released
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	Memory bandwidth	Bluetooth	First Released
W1	343S00130^[243] 343S00131^[243]		TBC	14.3 mm² ^[243]	TBC				4.2	December 13, 2016
W2	338S00348^[244]		TBC						4.2	September 22, 2017
W3	338S00464^[245]		TBC						5.0/5.3	September 21, 2018
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	Memory bandwidth	Bluetooth	First Released
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	Memory technology	Bluetooth	First Released

M-series coprocessors

The Apple M-series coprocessors are motion coprocessors used by Apple Inc. in their mobile devices. First released in 2013, their function is to collect sensor data from integrated accelerometers, gyroscopes and compasses and offload the collecting and processing of sensor data from the main central processing unit (CPU).

Only the M7 and M8 coprocessors were housed on separate chips; the M9, M10, and M11 coprocessors were embedded in their corresponding A-series chips. Beginning with the A12 Bionic chip in 2018, the motion coprocessors were fully integrated into the SoC; this allowed Apple to reuse the "M"-series codename for their desktop SoCs.

List of coprocessors

Name	Model no.	Image	Semiconductor technology	CPU ISA	CPU	First Released	Utilizing devices
Apple M7	LPC18A1		90 nm	ARMv7-M	150 MHz Cortex-M3	September 10, 2013	iPhone 5s iPad Air iPad Mini 2 iPad Mini 3
Apple M8	LPC18B1		90 nm	ARMv7-M	150 MHz Cortex-M3	September 9, 2014	iPhone 6 iPhone 6 Plus iPad Mini 4 iPod Touch (6th generation)
Name	Model no.	Image	Semiconductor technology	CPU ISA	CPU	First Released	Utilizing devices

Miscellaneous devices

This segment is about Apple-designed processors that are not easily sorted into another section.

Early series

Apple first used SoCs in early versions of the iPhone and iPod Touch. They combine in one package a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary for mobile computing.

The APL0098 (also 8900B^[246] or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process.^[11] The iPhone 3G and the first-generation iPod Touch also use it.^[247]

The APL0278^[248] (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod Touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.^[11]^[247]

The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.^[107]

The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC^[11] and was introduced on September 9, 2009, at the launch of the third-generation iPod Touch.

Other

The Samsung S5L8747 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to-HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iPhone, iPod Touch, or iPad, then taking a serial signal from the iOS device translating that into a proper HDMI signal.^[249]^[250]

Model no.	Image	First released	CPU ISA	Specs	Application	Utilizing devices	Operating system
339S0196		September 2012	Unknown ARM	256 MB RAM	Lightning to HDMI conversion	Apple Digital AV Adapter	XNU
Model no.	Image	First released	CPU ISA	Specs	Application	Utilizing devices	Operating system

Notes

^ Could be referred to as "A1" though it is not labelled as such
^ Could be referred to as "A2" though it is not labelled as such
^ Sometimes referred to as "A3" though it is not labelled as such
^ iPad (1st generation)
^ iPod touch (5th generation), iPad 2 (Wi-Fi), iPad (3rd generation, Wi-Fi), iPad mini (1st generation, Wi-Fi)
^ iPhone 4S, iPad 2 (Wi-Fi + Cellular), iPad (3rd generation, Wi-Fi + Cellular), iPad mini (1st generation, Wi-Fi + Cellular)
^ iPhone 5C and iPad (4th generation, Wi-Fi)
^ iPhone 5 and iPad (4th generation, Wi-Fi + Cellular)
^ iPad Pro 12.9-inch (5th generation) with 1 TB and 2 TB storage, iPad Pro 11-inch (3rd generation) with 1 TB and 2 TB storage, online configured MacBook Air (M1) and online configured MacBook Pro 13-inch (M1)
^ Except iPad Air (5th generation)
^ Except iPad Air (5th generation)
^ Except iPad Air (5th generation) which only contains 1x USB-C 3.1 Gen 2 with DP 1.4 compatibility
^ Online configured MacBook Pro 14-inch (2021) and online configured MacBook Pro 16-inch (2021)
^ Online configured MacBook Pro 14-inch (2021), online configured MacBook Pro 16-inch (2021) and online configured Mac Studio (2022)
^ Online configured Mac Studio (2022)
^ iPad Pro 12.9-inch (6th generation) with 1 TB and 2 TB storage, iPad Pro 11-inch (4th generation) with 1 TB and 2 TB storage, online configured MacBook Air (M2) and online configured MacBook Pro 13-inch (M2)
^ Online configured MacBook Air (M2) and online configured MacBook Pro 13-inch (M2)
^ iPad Pro, MacBook Air and MacBook Pro 13-inch
^ Mac mini (M2, 2023) only
^ Online configured Mac mini (M2 Pro, 2023), online configured MacBook Pro 14-inch (2023) and online configured MacBook Pro 16-inch (2023)
^ Online configured MacBook Pro 14-inch (2023), online configured MacBook Pro 16-inch (2023) and online configured Mac Studio (2023)
^ Online configured MacBook Pro 14-inch (2023) with 38-core GPU, online configured MacBook Pro 16-inch (2023) with 38-core GPU and online configured Mac Studio (2023) with 38-core GPU
^ Online configured Mac Studio (2023) and Online configured Mac Pro (2023)
^ Online configured Mac Studio (2023) and Online configured Mac Pro (2023)

References

^ "Apple announces Mac transition to Apple silicon" (Press release). Apple. June 22, 2020. Archived from the original on June 22, 2020. Retrieved June 23, 2020.
^ Warren, Tom (June 22, 2020). "Apple is switching Macs to its own processors starting later this year". The Verge. Archived from the original on June 22, 2020. Retrieved June 22, 2020.
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Revision as of 05:32, 6 November 2023

A series

Apple A4

Apple A5

Apple A5X

Apple A6

Apple A6X

Apple A7

Apple A8

Apple A8X

Apple A9

Apple A9X

Apple A10 Fusion

Apple A10X Fusion

Apple A11 Bionic

Apple A12 Bionic

Apple A12X Bionic

Apple A12Z Bionic

Apple A13 Bionic

Apple A14 Bionic

Apple A15 Bionic

Apple A16 Bionic

Apple A17 Pro

List of processors

H series

Apple H1

Apple H2

List of processors

M series

Apple M1

Apple M1 Pro

Apple M1 Max

Apple M1 Ultra

Apple M2

Apple M2 Pro

Apple M2 Max

Apple M2 Ultra

Apple M3

Apple M3 Pro

Apple M3 Max

List of processors

R series

Apple R1

S series

Apple S1

Apple S1P

Apple S2

Apple S3

Apple S4

Apple S5

Apple S6

Apple S7

Apple S8

Apple S9

List of processors

T series

Apple T1

Apple T2

List of processors

U series

Apple U1

List of processors

W series

Apple W1

Apple W2

Apple W3

List of processors

M-series coprocessors

List of coprocessors

Miscellaneous devices

Early series

Other

See also

Similar platforms

Notes

References

Further reading