©
ISO 2018
Road vehicles — Functional safety —
Part 11:
Guidelines on application of ISO
26262 to semiconductors
Véhicules routiers — Sécurité fonctionnelle —
Partie 11: Lignes directrices sur l'application de l'ISO 26262 aux semi-
conducteurs
INTERNATIONAL
STANDARD
ISO
26262-11
First edition
2018-12
Reference number
ISO 26262-11:2018(E)
Copyright International Organization for Standardization
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ISO 26262-11:2018(E)
ii © ISO 2018 – All rights reserved
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© ISO 2018
CP 401 • Ch. de Blandonnet 8
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Website: www.iso.org
Published in Switzerland
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ISO 26262-11:2018(E)
Foreword ..........................................................................................................................................................................................................................................v
Introduction ................................................................................................................................................................................................................................vi
1 Scope ................................................................................................................................................................................................................................. 1
2 Normative references ...................................................................................................................................................................................... 1
..................................................................................................................................................................................... 1
4 A semiconductor component and its partitioning ............................................................................................................ 2
4.1 How to consider semiconductor components ............................................................................................................. 2
4.1.1 Semiconductor component development .................................................................................................. 2
4.2 Dividing a semiconductor component in parts ........................................................................................................... 2
..................................................................................................... 3
4.3.1 Fault models......................................................................................................................................................................... 3
4.3.2 Failure modes ..................................................................................................................................................................... 4
4.3.3 The distribution of base failure rate across failure modes .......................................................... 4
................................. 5
............................................................................................................................................................... 6
4.5.1 About IP ................................................................................................................................................................................... 6
.................................................................................................... 7
.............................................................................................................................................................................. 9
4.5.4 Work products for IP ................................................................................................................................................. 11
...................................................................................................................................14
4.6 Base failure rate for semiconductors ................................................................................................................................15
..................................................................................... 15
4.6.2 Permanent base failure rate calculation methods ...........................................................................20
................................................................................................................. 41
4.7.1 Introduction to DFA .................................................................................................................................................... 41
..................................................................................42
4.7.3 Dependent failure scenarios ............................................................................................................................... 42
4.7.4 Distinction between cascading failures and common cause failures .............................. 45
4.7.5 Dependent failure initiators and mitigation measures................................................................ 45
.................................................................................................................................................................. 51
.................................................................................................54
4.7.8 Dependent failures between software element and hardware element .......................55
4.8 Fault injection ....................................................................................................................................................................................... 55
................................................................................................................................................................................... 55
4.8.2 Characteristics or variables of fault injection ...................................................................................... 55
4.8.3 Fault injection results ............................................................................................................................................... 57
4.9 Production and Operation .......................................................................................................................................................... 57
4.9.1 About Production ......................................................................................................................................................... 57
4.9.2 Production Work Products ................................................................................................................................... 58
....................................... 58
4.10 Interfaces within distributed developments .............................................................................................................. 58
................................................................................................................................................................ 59
.................................................................................... 59
....................................................................................................60
5.1 Digital components and memories..................................................................................................................................... 60
5.1.1 About digital components ..................................................................................................................................... 60
........................................................................... 60
5.1.3 Detailed fault models of memories ............................................................................................................... 61
5.1.4 Failure modes of digital components ..........................................................................................................62
......................................... 62
.................................................... 66
..................................................................67
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Contents Page
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ISO 26262-11:2018(E)
.................................................................................................................... 69
during design of a digital component ......................................................................................................... 70
.........................................................................................74
..................................................... 75
.....................76
.......................................... 77
................................................................................................................................80
.................................................................................. 80
...................................................82
................................................................................................................................. 91
...................................................................................................................... 94
........................................... 97
....100
5.3 Programmable logic devices .................................................................................................................................................101
5.3.1 About programmable logic devices ...........................................................................................................101
5.3.2 Failure modes of PLD .............................................................................................................................................105
..............................................................................................................106
..............................................................................................112
..................................................................................................113
...................................................................................... 116
............................................................................................................116
5.4 Multi-core components..............................................................................................................................................................116
.................................................................................................................116
5.4.2 Implications of ISO 26262 series of standards for multi-core components ........... 117
5.5 Sensors and transducers ..........................................................................................................................................................119
.............................................................................................119
5.5.2 Sensors and transducers failure modes ................................................................................................. 120
......................................................................................125
..................................................126
............................... 130
.......................................131
Annex A (informative) Example on how to use digital failure modes for diagnostic coverage
evaluation ............................................................................................................................................................................................................. 132
Annex B (informative) Examples of dependent failure analysis .......................................................................................136
Annex C (informative) Examples of quantitative analysis for a digital component ...................................... 150
Annex D (informative) Examples of quantitative analysis for analogue component .................................. 155
Annex E (informative) Examples of quantitative analysis for PLD component ................................................. 169
Bibliography ......................................................................................................................................................................................................................... 175
iv © ISO 2018 – All rights reserved
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ISO 26262-11:2018(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
committee has been established has the right to be represented on that committee. International
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
www .iso .org/directives).
on the ISO list of patent declarations received (see www .iso .org/patents).
constitute an endorsement.
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT) see the following
URL: www .iso .org/iso/foreword .html.
complete listing of these bodies can be found at www .iso .org/members .html.
A list of all parts in the ISO 26262 series can be found on the ISO website.
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