Press Room
MediaTek First to Adopt Google’s Project Treble for Automotive Industry
08 Aug 2025 - 13:09
HSINCHU, Taiwan – August 6, 2025 – MediaTek has announced it is the first partner to commit to Project Treble specifically for the automotive ecosystem. This program, which provides customers with at least four years of firmware upgrades and maintenance patches, is designed to enhance partner support, reduce total costs, protect user data, and extend the lifecycle of automotive products.
MediaTek Showcases AI Vision From Edge to Cloud at Computex 2025
20 May 2025 - 07:00
TAIPEI, Taiwan - May 20, 2025 – At Computex 2025, MediaTek will present its latest advancements in AI computing under the theme “AI for Everyone: From Edge to Cloud”. Dr. Rick Tsai, Vice Chairman and CEO of MediaTek, will deliver a keynote on May 20, the opening day of the exhibition, offering key insights into the roles of AI, 6G, edge and cloud computing in digital transformation and...
MediaTek T930 enhances FWA cellular broadband applications with R18 5G-Advanced modem and AI technologies
14 May 2025 - 14:30
MediaTek today announced its T930 chipset for 5G Fixed Wireless Access (FWA) and mobile Wi-Fi (Mi-Fi) devices. This third-generation platform highlights the company’s industry leadership by supporting the latest and most advanced wireless communication technologies and solutions available. A highly integrated and exceptionally power-efficient 4nm chipset solution, the MediaTek T930 supports...
MediaTek Delivers More Flagship-Class Experiences with Dimensity 9400e Mobile Platform
14 May 2025 - 14:30
HSINCHU, Taiwan – May 14, 2025 – Today, MediaTek unveiled its latest chipset in the flagship space, the MediaTek Dimensity 9400e. Featuring the company’s advanced All Big Core architecture, the Dimensity 9400e is the latest addition to MediaTek’s family of flagship-class processors, providing a wider variety of options and functionality for device makers, and delivering exceptional performance...
MediaTek Unveils Flagship Dimensity Auto Platforms, Defining the Future of The Intelligent Cockpit
23 Apr 2025 - 13:30
HSINCHU, Taiwan – April 23, 2025 – At the Shanghai International Automobile Industry Exhibition 2025 (Automobile Shanghai 2025), MediaTek announced its upcoming flagship Dimensity Auto Cockpit Platform C-X1 and Dimensity Auto Connect MT2739. MediaTek and its ecosystem partners showcased the future of intelligent driving experiences through generative AI-enhanced cockpit and agentic AI...
MediaTek Enhances Flagship AI Performance with Dimensity 9400+ Mobile Platform
11 Apr 2025 - 00:30
HSINCHU, Taiwan – April 10, 2025 – MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek’s Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design.
MediaTek Kompanio Ultra to Redefine On-Device AI and Performance for Chromebook Plus
02 Apr 2025 - 15:00
Flagship Processor Delivers Powerful AI Capabilities and Exceptional Power Efficiency
TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
12 Mar 2025 - 14:00
HSINCHU, Taiwan, R.O.C. Mar. 12, 2025 - MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
MediaTek Unveils Genio 720 and Genio 520 IoT Platforms for Generative AI Applications
11 Mar 2025 - 20:30
NUREMBERG, Germany – March 11, 2025 – Today at Embedded World, MediaTek introduced the high-performance Genio 720 and Genio 520 edge-AI IoT platforms. These new additions to the Genio series support the latest generative AI models, human machine interface (HMI), multimedia, and connectivity features for smart home, retail, industrial, and commercial IoT devices.
MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
27 Feb 2025 - 07:00
BARCELONA, Spain – February 27, 2025 – At Mobile World Congress 2025, MediaTek is showcasing several key technologies that enable wireless evolution towards 6G, including hybrid computing, a live LEO broadband NR-NTN trial, sub-band full duplex (SBFD), along with the new M90 5G Advanced modem. In addition, the company is also sharing its latest developments in Dimensity Auto and Dimensity...
