Nadine Hatto

Both 5G/6G networks and LEO satellites leverage mmWave technology to achieve high data throughput and low latency, which are essential for applications like autonomous vehicles, IoT, augmented reality, and other advanced technologies.

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We are bringing wireless audio into different level

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SIGLENT’s SDS7000A series Digital Storage Oscilloscopes are available in bandwidths of 6 GHz, 4 GHz and 3 GHz, have 12-bit ADCs with sample rate up to 20 GSa/s, maximum record length of 1Gpts/ch, and display up to 4 analog channels + 16 digital channels for high performance mixed signal analysis. https://lnkd.in/gnmscFkg

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DreamBig Semiconductor Inc. Announces Mercury AI-SuperNIC with scalable 12.8Tbps HW Offloaded UEC RoCEv2 throughput. Mercury delivers 800Gbps bandwidth connectivity for any AI chipset with industry leading throughput of 800Mpps while minimizing power consumption, latency, and area. It features a hardened RDMA engine with programmable congestion control for RoCE v2 and UEC standards, making it an ideal solution for AI and HPC applications. When integrated as a chiplet compatible component with previously announced DreamBig Mars Chiplet Platform, the solution can scale to 12.8Tbps RDMA throughput. #chiplet #UEC #AI #Accelerator #RDMA #RoCEv2

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Tech Thought #1 Innovations Beyond HBM in Memory Technology Exciting advancements are on the horizon beyond HBM in memory technology. HBM3 is poised to elevate bandwidth and capacity for demanding applications, while Memory-Class Storage (MCS) merges memory and storage features for enhanced speed and capacity. Persistent Memory (PMEM) offers a blend of DRAM-like performance and storage durability, propelling innovation in data processing efficiency. Furthermore, breakthroughs in 3D integration, like 3D NAND and 3D DRAM, promise heightened storage density and performance. Neuromorphic memory, inspired by neural networks, and Quantum memory, harnessing quantum states, hold the potential to revolutionize speed and capacity in memory technology. Reconfigurable memory architectures are also set to adapt to diverse workloads, optimizing performance across various applications. These advancements collectively mark a significant leap forward in memory technology, paving the way for a future that goes beyond the capabilities of HBM. #MemoryArchitecture #3DMemories #HBM #SpintronicsAI

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AMAZING DEMO FROM Xscape Photonics Inc. You may know that all our technical team in Optica corporate engagement outreach have regular one-on-one discussions with CEOs and CTOs of our corporate members. Of course, most of these conversations are very confidential and not recorded. Very occasionally, when a company is seeking partnerships or industry feedback, then we ask permission to conduct a short interview for use on Linked In. Here is one of those. After meeting at the Optica PECC summit at Synopsys Inc, I was lucky to speak with Vivek Raghunathan, the CEO of Xscape Photonics Inc. During our discussion, he permitted us to record. Below is the result, and I am glad he was able to show what they have done. This startup featured in the mainstream news a few weeks ago by announcing they’ve raised US$44 million Series A from IAG Capital Partners, with investments from Altair, Cisco Investments, Fathom Fund, Kyra Ventures, LifeX Ventures, NVIDIA and OUP. Xscape Photonics is at the forefront of advanced photonic integrated chips (PICs) that revolutionise ultrahigh-bandwidth connectivity for data centres and high-performance computing systems. What sets Xscape Photonics apart is their innovative multi-wavelength programmable laser technology. Traditionally, short-distance data connections rely on a separate laser for each colour or wavelength of light. Xscape Photonics, however, can generate hundreds of different wavelengths from a single laser, drastically improving efficiency and simplifying system complexity. The foundation of this groundbreaking technology lies in research initiated at Columbia University. Xscape Photonics’ co-founders—Professors Alexander Gaeta, Keren Bergman, and Michal Lipson—developed this multi-wavelength laser platform to address the challenge of efficiently transferring massive data volumes across AI accelerators and between memory stacks. Xscape Photonics’ approach of channelling multiple data streams through different wavelengths produced by a single laser significantly reduces costs, power consumption, and overall physical footprint. This innovation directly addresses the needs of hyperscalers looking to solve bandwidth density and supply capacity issues within data centers. Xscapephotonics has offices in Fort Lee, NJ, and Santa Clara, CA. If you have an application, I would encourage you to contact them.

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EPDT’s Products of the Year Candidates (Sponsored by Cree LED) Product: xG26 SoCs Company: Silicon Labs Announced: Spring 2024 Facilitating Matter-over-Thread deployments, Silicon Labs’ xG26 multi-protocol 2.4GHz wireless system-on-chip (SoC) devices rely on Arm Cortex-M33 processing capabilities to accelerate the computation of AI algorithms, while still keeping down the associated power budget. Flash data storage capacity has doubled and the number of GPIOs has significantly increased too. Inclusion of proprietary Secure Vault plus Arm TrustZone technology safeguard against data breaches. More information: https://lnkd.in/dmxPX5Zx Jacey Zuniga Simon Holt Brandon Tolany Leigh Pankonien Daniel Cooley Joel Munday Colin Cureton Sam Ponedal Alisha Perkins Holley Wright Dev Pradhan Martin Looker Mikko Nurmimäki Matt Saunders Rune Gundersen

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Microcombs are Shaping the Future of Photonics and Microwave Engineering! Innovations in integrated microcombs are transforming optical-to-microwave links. This system leverages 2-point optical frequency division (2P-OFD) to deliver high stability, coherence, and precision—all while minimizing system complexity. Perfect for applications in radar, atomic clocks, and timekeeping! Discover the full impact of microcombs on photonics and beyond: https://lnkd.in/eh2UBcbC #Photonics #MicrowaveTech #Microcombs #Innovation #TechAdvancement

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Excellent Qualcomm webinar on 6G spectrum explains how 6G technology will use current bands more efficiently. It also emphasizes the critical importance of 7.1 to 8.4 GHz for 6G in the United States, particularly because much of the rest of the world will be using 6.4 to 7.1 GHz, which in the United States has been allocated to Wi-Fi. https://lnkd.in/gxBEtYDN

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Do you have questions about how LTE-M and NB-IoT will evolve in 5G? Read our white paper to learn more. https://lnkd.in/g22KWzMr #cellulariot #ltem #nbiot #5G #IoT

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The soon-to-come Ottawa Semiconductor Fab in Canada, a vast III-V semiconductor tech campus, is set to be a hub for semiconductor manufacturing, research, academia, and related amenities. SILICAN's report stresses the need to enhance domestic chip capacity to safeguard Canada's security and economy amidst geopolitical shifts, urging investments to connect chip producers and end-users, while calling for a robust talent pool in the industry. CMC Microsystems emphasizes securing advanced device supply, protecting IP, and boosting onshore manufacturing through initiatives like FABriC, aiming to create intelligent sensor technology and enhance Canada's competitive advantage and supply chain security, particularly in Ottawa's Compound Semiconductor sandbox. Various partnership opportunities are envisioned to propel compound semiconductor innovation, support academia, develop technology like GaN power systems, foster EV battery advancements, and bolster autonomous vehicle technologies within Ottawa's flourishing semiconductor ecosystem. #Canada #semiconductor #chip #GaN #EV #AI #power #research #innovation #manufacturing #technology #sensor #compoundsemiconductor https://lnkd.in/evsN-6HN

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Photonic Inc. has entered a new collaboration with TELUS to advance #quantum communication technologies in Canada, as highlighted by EE Times | Electronic Engineering Times' Gary Hilson, in a recent announcement. This joint effort provides #Photonic with access to the Telus PureFibre network – an important step in the testing and development of scalable, secure #QuantumNetworking. Read the article now to learn how this collaboration will help ready #Canada for the quantum internet and underscores how Photonic and Telus are shaping quantum #connectivity: https://lnkd.in/gJM348-B #QuantumComputing #DistributedQuantumComputing #DistributedEntanglement

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Check out my new blog on using our #radhard #MCU to reconfigure #Space deployed #FPGA. Please reach out if you have interest and we can provide specific details on how to deploy

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Read the continuation of our technical description of the new high accuracy distance measurement feature in Bluetooth called Channel Sounding. https://lnkd.in/gyzzHR_U

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Improve performance ? Market strategy ?

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Demos, seminars, and workshops keyed in on Keysight Technologies' new advanced #RF, #5G, and #6G breakthroughs at #IMS2024. #testandmeasurement

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IES6300TSN-8GT2GS-2LV 🌐 TSN Protocols: Reliable, low-latency data ⏱️ PTP Sync: Sub-microsecond precision 🔄 SW-Ring: <20ms recovery Built for tough environments, ready for your network. ⚙️ #TSN #IndustrialNetworking

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