AL8891Q

SYNCHRONOUS BUCK LED DRIVER

Description Pin Assignments

The AL8891Q is an easy-to-use synchronous step-down DC-DC LED
driver with high-side current sense capable of driving up to 2A of
constant current from an input voltage ranging from 4.5V to 65V. The
AL8891Q provides high switching frequency up to 2.5MHz to optimize
high efficiency, allowing a smaller inductor size and compact form
factor solution. Pin arrangement allows simple, optimum PCB layout. (3D Step file available)
Constant on time control is employed to achieve simple control-loop
compensation and cycle-by-cycle current limiting with fast dynamic Top View – (Not to Scale)
response.

PGND 1 16 SW
Features such as fault flag, PWM and analog dimming, internal soft-
start, and shutdown provide a flexible and easy-to-use platform for a PGND CBOOT
wide range of applications. Discontinuous conduction and automatic
VIN NC
frequency reduction at light loads improve light-load efficiency. AL8891Q
EN Exposed FAULT
Pad
Protection features include thermal shutdown, VIN and VCC PDIM VCC
undervoltage lockout, cycle-by-cycle current limit, output open & short-
FDSET AGND
circuit protection for LED, and external components open & short
protection. ADIM CSN

FREQ 8 9 CSP
The AL8891Q device is available in the thermal enhanced TSSOP-
16EP package.
TSSOP-16EP

Features Applications
• AEC-Q100 Grade 1 • Automotive head lights
• Input voltage 4.5V to 65V • Daytime running lights (DRL)
• VOUT close to VIN rail (up to 99% duty cycle) • Front and rear fog lights
• Integrated MOSFETs high-side 200mΩ and low-side 130mΩ • Turn/stop lights
• 2A constant output current • Map lights
• High-side current sense • Dimmable interior/exterior lights
• Support both PWM and analog dimming
• Internal compensation without external capacitor
• Cycle-by-cycle current protection
• Diagnosis and fault flag indicator
• LED open and short protection
• Overtemperature thermal protection and auto-restart
• Ambient temperature -40°C to +125°C
• Thermally enhanced TSSOP-16EP package
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• The AL8891Q is suitable for automotive applications
requiring specific change control; this part is AEC-Q100
qualified, PPAP capable, and manufactured in IATF16949
certified facilities.
[Link]

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See [Link] for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

AL8891Q 1 of 24 September 2024

Document number: DS46540 Rev. 1 - 2 [Link] © 2024 Copyright Diodes Incorporated. All Rights Reserved.
 AL8891Q

Typical Applications Circuit

VIN
VIN CBOOT
CBOOT L1 RCS
CIN SW
PGND
COUT
CSP
VCC
CSN
AGND
VIN
AL8891Q
EN

FDSET

PDIM
VIN
ADIM
RFAULT

FREQ FAULT
RON

Figure 1. Typical Application

Functional Block Diagram

FAULT EN PDIM FREQ AGND VCC

ENABLE VCC LDO

REGULATOR

FAULT
DETECTOR
Constant CBOOT CBOOT
STATE On Time SWITCH
UVLO
MACHINE VIN
HICCUP

Thermal
Shutdown

Bandgap

VREF
PWM SW

ADIM + LOGIC
REF
-

Error Vcc
CSP +
- Ampfilier
CSN

+ Open Fault
VFDSET
- Detection Enable
2.0V

FDSET PGND

Figure 2. Functional Block Diagram

AL8891Q 2 of 24 September 2024

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 AL8891Q

Pin Descriptions
Pin Number
Pin Name Function
(TSSOP-16EP)
PGND 1, 2 Power ground. Connect the pins to ground plane.
Power supply input pin to high-side power MOSFET and VIN LDO regulator. Decouple this pin to
VIN 3
GND with ceramic capacitors.
Enable pin for VCC LDO regulator and input voltage for VIN UVLO. Connect to VIN directly through a
EN 4 resistor divider, or to an external voltage source. This pin can also achieve PWM dimming by
connecting to an external pulse signal.
PWM dimming input pin. Apply PWM signal for PWM dimming.
PDIM 5
Connect to high-level voltage when not in use. Do not leave it floating.
Set VIN rising threshold to mask LED open fault. Connect to an external divider to detect VIN rising
FDSET 6
condition.
ADIM 7 Apply an analog voltage for analog dimming. Do not leave it floating.
Switching frequency control pin. Place a resistor between this pin and AGND to set the switching
FREQ 8
frequency between 200kHz and 2.5MHz.
CSP 9 Current sense positive input across RCS
CSN 10 Current sense negative input across RCS
Analog ground for regulator and system. All electrical parameters are measured with respect to this
AGND 11
pin. Connect to EP and PGND on PCB.
Internal VCC regulator that powers the control circuits. Must be decoupled to PGND with 1µF to 4.7µF
VCC 12
ceramic capacitor.
FAULT 13 FAULT Indication. Asserted Low to report faulty conditions. Needs an external pullup resistor.
NC 14 Not Connected, leave it floating.
Bootstrap supply input for high-side gate driver. Connect a 100nF ceramic capacitor from this pin to
CBOOT 15
SW pin.
SW 16 Regulator switch node. Connect to power inductor.
Exposed Thermal
— Connect to ground plane for adequate heat sinking and noise reduction.
Pad

AL8891Q 3 of 24 September 2024

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 AL8891Q

Absolute Maximum Ratings (Note 4)

Symbol Parameter Rating Unit
VIN Input voltages, VIN to PGND V
-0.3 to +72
VEN, VFAULT Input voltages, EN, FAULT to AGND V
VAGND Input voltages, AGND to PGND -0.3 to +0.3 V
VPDIM, VADIM, VFREQ, VFDSET Input voltages, PWM, ADIM to AGND -0.3 to +5.5 V
VSW Output voltages, SW to PGND -0.3 to VIN+0.3 V
VSW_PK Output voltages, SW to PGND less than 10ns transients -3.5 to +72 V
VCSP, VCSN Input voltages, CSP, CSN to AGND -0.3 to +72 V
VCBOOT_SW Output voltages, CBOOT to SW -0.3 to +5.5 V
VCC Output voltages, VCC to AGND -0.3V to +5.5 V
TJ Operating junction temperature -40 to +150 °C
TST Storage temperature -55 to +150 °C
Human body model (HBM) ±2000
VESD V
Charged-device model (CDM) ±1000

Note: 4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings for extended periods can affect device reliability.

Thermal Information (Note 5)

θJC θJA (Note 5)
PDIS
Package Thermal Resistance Thermal Resistance
TA = +25°C
Junction-to-Case Junction-to-Ambient
TSSOP-16EP 23°C/W 50°C/W 2.5W

Note: 5. The device is mounted on JEDEC standard 4 layers (2s2p) PCB test board.

Recommended Operating Conditions (Over operating free-air temperature range, unless otherwise specified.) (Note 6)
Parameter Min Typ Max Unit
VIN to PGND 4.5 — 65
EN 0 — VIN
Input voltages V
PDIM, ADIM, FDSET 0 — 5.5
AGND to PGND -0.1 — 0.1
Output voltage, CBOOT 1 — 65 V
Output voltage, VOUT 1 — 65 V
Output current, IOUT 0 — 2 A
Operating junction temperature range, TJ -40 — +150 °C
Operating ambient temperature range, TA -40 — +125 °C

Note: 6. Operating ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For verified
specifications, see Electrical Characteristics.

AL8891Q 4 of 24 September 2024

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 AL8891Q

Electrical Characteristics
Limits apply to the recommended operating junction temperature (TJ) range of -40°C to +150°C, unless otherwise stated. Minimum and Maximum
limits are specified through test, design or statistical correlation. Unless otherwise stated, the following conditions apply: V IN = 24V, fS = 400kHz.

Symbol Parameter Condition Min Typ Max Unit

Supply Voltage (VIN Pin)

VIN_MIN Minimum input voltage for startup — — — 4.5 V

ISHDN Shutdown quiescent current VIN = 24 V, VEN = 0V — 0.1 10 µA

VEN = VIN = 24V, IOUT = 0A
IQ_SW Operating quiescent current (switching) — 1.0 — mA
fS = 400kHz
Enable VIN UVLO (EN Pin)

ENVCC-ON VEN high-level threshold VEN rising 2.2 — — V

ENVCC-OFF VEN low-level threshold VEN falling — — 0.7 V

VIN_UVLO_R VIN UVLO rising threshold VIN rising 4.0 4.2 4.45 V

VIN_UVLO_F VIN UVLO falling threshold VIN falling — 3.9 — V

IQ-EN EN pin current VEN = 3.3V — 1 — µA

tEN_OFF_DELAY EN turned off delay — 6 23 40 ms

Internal LDO (VCC Pin)

VCC Internal LDO output voltage VCC VIN ≥ 6V, IVCC > 15mA 4.4 5.0 5.7 V

IVCC_LIMIT VCC current limit VIN > 6V, VCC = 4.5V 30 — — mA

Undervoltage lockout (UVLO) thresholds VCC rising threshold 3.4 3.6 3.8 V
VCC_UVLO
for VCC — 0.15 — mV
VCC thresholds hysteresis

Current Control (CSP, CSN, ADIM Pins)

VADIM = 2V 192 200 208

VCSP-CSN CSP-CSN voltage VADIM = 1V — 100 — mV

VADIM = 0.4V — 40 —

VCSPN-LOW CLAMP Analog dimming low clamp VADIM ≤ 0.15V — 20 — mV

ICSN CSN sink current VCSP - VCSN = 200mV, VCSN > 5V 30 60 90 µA

Overcurrent Limit

IHS-LIMIT Peak inductor current positive limit VIN = 24V — 3.6 — A

ILS-LIMIT Valley inductor current negative limit VIN = 24V — -1.6 — A

AL8891Q 5 of 24 September 2024

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 AL8891Q

Electrical Characteristics (continued)

Limits apply to the recommended operating junction temperature (TJ) range of -40°C to +150°C, unless otherwise stated. Minimum and Maximum
limits are specified through test, design or statistical correlation. Unless otherwise stated, the following conditions apply: VIN = 24V, fS = 400kHz.

Symbol Parameter Condition Min Typ Max Unit

Power MOSFETs (Note 7)

High-side MOSFET ON-resistance
RDSON_HS IOUT = 0.5A, VCBOOT - VSW = 5V — 200 360 mΩ
(Note 8)
Low-side MOSFET ON-resistance
RDSON_LS IOUT = 0.5A, VCC = 5V — 130 240 mΩ
(Note 8)
tON (SW, FREQ Pins)
TA = +25°C, VIN = 24V, VOUT = 12V
tON_MIN_HS Minimum high-side MOSFET ON-time — 65 90 ns
RON = 237kΩ, ILOAD = 0A
TA = +25°C, VIN = 24V, VOUT = 12V
tON Typical tON @400kHz — 1250 — ns
RON = 237kΩ, ILOAD = 0A
TA = +25°C, VIN = 24V, VOUT = 12V
f Typical 400kHz frequency — 400k — Hz
RON = 237kΩ, ILOAD = 0A
VIN = 4.5V to 65V
%F Frequency over 400kHz target VOUT = 3V to VIN x 95%, RON = 237kΩ 80 — 120 %
ILOAD = 0A, full temperature range
TA = +25°C, VIN = 24V, VOUT = 12V
tON_2.1M Typical tON @2.1MHz — 238 — ns
RON = 43kΩ, ILOAD = 0A
TA = +25°C, VIN = 24V, VOUT = 12V
f2.1M Typical 2.1MHz frequency — 2.1M — Hz
RON = 43kΩ, ILOAD = 0A
VIN = 4.5V to 65V
%F2.1M Frequency over 2.1MHz target VOUT = 3.5V to VIN x 85%, RON = 43kΩ 80 — 120 %
ILOAD = 0A, full temperature range
Minimum high-side MOSFET OFF-time
tOFF_MIN_HS — — 100 — ns
(Note 7)
Dimming (PDIM Pin)

Rising 1.5 — — V
VPDIM PDIM input threshold
Falling — — 0.7 V
Minimum PWM on time with FAULT
tON_PDIM_MIN — — 360 — µs
recovery
Spread Spectrum (Measured at SW Pin)
TA = +25°C, VIN = 24V, VOUT = 12V
tON_SS tON spread spectrum amplitude — ±10 — %
RON = 238.5kΩ, ILOAD = 0A
TA = +25°C, VIN = 24V, VOUT = 12V
fSS tON spread spectrum frequency — 20 — kHz
RON = 238.5kΩ, ILOAD = 0A
Notes: 7. Guaranteed by design.
8. Measured at package pins.

AL8891Q 6 of 24 September 2024

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 AL8891Q

Electrical Characteristics (continued)

Limits apply to the recommended operating junction temperature (TJ) range of -40°C to +150°C, unless otherwise stated. Minimum and Maximum
limits are specified through test, design or statistical correlation. Unless otherwise stated, the following conditions apply: VIN = 24V, fS = 400kHz.

Symbol Parameter Condition Min Typ Max Unit

Fault Detection

VFT_SHORT_FALL LED short threshold detected on CSN falling VIN = 24V 1.0 1.6 — V

VFT_SHORT_RISE LED short threshold detected on CSN rising VIN = 24V — 1.8 2.5 V

VPD_FAULT Fault pin pulldown strength IFT = 1mA — 40 100 mV

tFDT Fault deglitch timer — — 80 — µs

tMASK-DET Fault detect mask timer — — 160 — µs

tMASK-REL Fault mask release timer — — 320 — µs

ILEAK_FT Fault leakage current VFT = 5V — 10 100 nA

VFDSET LED open-fault enable reference Reference to AGND 1.8 2.0 2.2 V

ROPEN FREQ pin to GND open detect threshold VCC = 5V 2 — — MΩ

RSHORT FREQ pin to GND short detect threshold VCC = 5V — — 150 Ω

tRETRY Time for fault retry — — 1 — ms

Thermal Shutdown

TSD Thermal shutdown threshold — — +170 — °C

TSD(HYS) Thermal shutdown hysteresis — — +20 — °C

AL8891Q 7 of 24 September 2024

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 AL8891Q

Typical Performance Characteristics (VIN = 24V, IOUT = 2A, COUT = 0.47µF, fSW = 400kHz, unless otherwise specified.)

Figure 3. IQ_SW vs. VIN Figure 4. Analog Dimming Curve

100
100
90 L=22uH, COUT=0.47µF,
L=22µH, COUT=0.47uF, fFsw=400KHz
SW=400kHz L=5.6uH, COUT=0.1uF,fSW
Fsw=2.2MHz
90 L=5.6µH, COUT=0.1µF, =2.2MHz
80
80
Relative Out Current (%)

Relative Out Current (%)

70
70

60 60

50 50

40 40

30 200Hz
fPWM=200Hz
30
1kHz
fPWM=1KHz
200Hz
200Hz 20
20 10kHz
fPWM=10KHz
1kHz
1KHz
10kHz
10KHz 10
10
0
0 0 10 20 30 40 50 60 70 80 90 100
0 10 20 30 40 50 60 70 80 90 100 Duty Cycle (%)
Input PWM Duty (%)
Figure 5. PWM Dimming Curve Figure 6. PWM Dimming Curve

L=5.6µH, COUT=0.1µF, fSW=2.2MHz

L=22µH, COUT=0.47µF, fSW=400kHz
fsw (kHz)
fsw (kHz)

Figure 7. fsw vs. VIN Figure 8. fsw vs. VIN

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 AL8891Q

Typical Performance Characteristics (continued)

(VIN = 24V, IOUT = 2A, COUT = 0.47µF, fSW = 400kHz, unless otherwise specified.)

100 90
L=22uH,
L=22µH,Cout=0.47uH,
COUT=0.47µF,Fsw=400KHz ㄛ Load=2LEDS
fSW=400kHz, Load=2LEDs L=5.6uH,
L=5.6µH, SW=2.2MHz, ㄛ
Cout=0.1uF, fFsw=2.2MHz
COUT=0.1µF, Load=2LEDS
Load=2LEDs
95
85
90
80
85

Efficiency (%)
Efficiency (%)

80 75

75 70

70
65
Io=2A
65 Io=2A
Io=1.5A 60
Io=1A Io=1.5A
60
Io=0.5A Io=1A
55 Io=0.5A
55

50 50
10 15 20 25 30 35 40 45 50 55 60 65 10 15 20 25 30 35 40 45 50 55 60 65

VIN (V)
Vin (V) VIN
Vin (V)
(V)
Figure 9. Efficiency vs. VIN Figure 10. Efficiency vs. VIN

95
100
L=22uH,
L=22µH,Cout=0.47uH,
COUT=0.47µF,Fsw=400KHz ㄛ Load=6LEDs
fSW=400kHz, Load=6LEDS L=5.6uH,
L=5.6µH, Cout=0.1uF,fSW
COUT=0.1µF, Fsw=2.2MHz ㄛ Load=6LEDS
=2.2MHz, Load=6LEDs
90
95
85
Efficiency (%)

90
Efficiency (%)

80

85 75

Io=0.5A 70 Io=0.5A
80 Io=1A Io=1A
Io=1.5A 65 Io=1.5A
Io=2A Io=2A
75
60

70 55
20 25 30 35 40 45 50 55 60 65 25 30 35 40 45 50 55 60 65

VIN
Vin(V)
(V) Vin (V)
VIN (V)
Figure 11. Efficiency vs. VIN Figure 12. Efficiency vs. VIN

100 L=22µH, COUT=0.47µF, fSW=400kHz 100

L=22uH, COUT=0.47uF, Fsw=400KHz L=5.6µH, COUT=0.1µF, fSW=2.2MHz
98
95 L=5.6uH, COUT=0.1uF, Fsw=2.2MHz
96
94 90
92
90 85
88
80
Efficiency (%)

86
Efficiency (%)

84 75
82
80 70
78
65
76
74 60
VO=1LED VO=10LEDS VO=1LED VO=8LEDS
72
VO=2LEDS VO=12LEDS 55 VO=2LEDS VO=10LEDS
70
VO=4LEDS VO=14LEDS VO=4LEDS VO=12LEDS
68
50 VO=6LEDS VO=14LEDS
66 VO=6LEDS VO=16LEDS
64 VO=8LEDS VO=18LEDS 45
62
60 40
5 10 15 20 25 30 35 40 45 50 55 60 65 5 10 15 20 25 30 35 40 45 50 55 60 65
Input Voltage (V) Input Voltage (V)

Figure 14. Efficiency vs. Input Voltage

Figure 13. Efficiency vs. Input Voltage
AL8891Q 9 of 24 September 2024
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 AL8891Q

Typical Performance Characteristics (continued)

(VIN = 24V, IOUT = 2A, COUT = 0.47µF, fSW = 400kHz, unless otherwise specified.)

100 100
Vin=12V, L=22µH,
VIN=12V, L=22uH, COUT=0.47µF,
Cout=0.47uF, Fsw=400KHz
fSW=400kHz Vin=12V, L=5.6µH,
VIN=12V, L=5.6uH, COUT=0.1µF,
Cout=0.1uF, Fsw=2.2MHz
fSW=2.2MHz
95 90

80
90
70
85

Efficiency (%)
Efficiency (%)

60
80
50
75
40
70 1 Led
30
2 Leds
65 3 Leds 20 1 Leds
2Leds
60 10

55 0
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 1200 1400 1600 1800 2000

LED Current (mA) LED Current (mA)

Figure 15. Efficiency vs. LED Current Figure 16. Efficiency vs. LED Current

100 100
Vin=24V, L=22uH,
VIN=24V, L=22µH,Cout=0.47uF,
COUT=0.47µF,Fsw=400KHz
fSW=400kHz Vin=24V,L=5.6µH,
L=5.6uH, Cout=0.1uF, Fsw=2.2MHz
VIN=24V, COUT=0.1µF, fSW=2.2MHz
95 90

90 80

70
85
Efficiency (%)

Efficiency (%)

60
80
50
75 3 Leds
40
5Leds
70 3 Leds 30
6 Leds
65 20

60 10

0
55 0 200 400 600 800 1000 1200 1400 1600 1800 2000
0 200 400 600 800 1000 1200 1400 1600 1800 2000
LED Current (mA)
LED Current (mA)

Figure 18. Efficiency vs. LED Current

Figure 17. Efficiency vs. LED Current
100
100 Vin=48V, L=5.6uH,
Vin=48V, L=22µH,
VIN=48V, L=22uH, Cout=0.47uF,
COUT=0.47µF, Fsw=400KHz
fSW=400kHz VIN=48V, L=5.6µH,Cout=0.1uF,
COUT=0.1µF,Fsw=2.2MHz
fSW=2.2MHz
90
95
80
90
70
Efficiency (%)

85
Efficiency (%)

60
80
50

75 40
3 Leds 3 Leds
70 6 Leds 30 6 Leds
9 Leds 9 Leds
65 12 Leds 20 11 Leds

60 10

0
55 0 200 400 600 800 1000 1200 1400 1600 1800 2000
0 200 400 600 800 1000 1200 1400 1600 1800 2000

LED Current (mA) LED Current (mA)

Figure 20. Efficiency vs. LED Current

Figure 19. Efficiency vs. LED Current

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 AL8891Q

Typical Performance Characteristics (continued)

(VIN = 24V, IOUT = 2A, COUT = 0.47µF, fSW = 400kHz, unless otherwise specified.)

100 100
Vin=60V, L=22µH,
VIN=60V, L=22uH, COUT=0.47µF,
Cout=0.47uF, Fsw=400KHz
fSW=400kHz VIN=60V,
Vin=60V, L=5.6µH,
L=5.6uH, COUT=0.1µF, fSW=2.2MHz
Cout=0.1uF, Fsw=2.2MHz
95 90

80
90
70
85

Efficiency (%)
Efficiency (%)

60
80
50
75
3 Leds 40 3 Leds
70 6 Leds 6 Leds
30
9 Leds 9 Leds
65 12 Leds 12 Leds
20

60 10

55 0
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 1200 1400 1600 1800 2000

LED Current (mA) LED Current (mA)

Figure 21. Efficiency vs. LED Current Figure 22. Efficiency vs. LED Current

5.5 5.20

5.4
5.15
5.3
5.10
5.2
5.05
5.1
VCC (V)

VCC (V)

5.0 5.00

4.9
4.95 ～
-40°C
Ta=-40 C
4.8 Ta=-40～C
-40°C Ta=+25 ～
+25°C
C
Ta=+25 ～
+25°C
C 4.90 Ta=+125 ～
+125°CC
4.7 Ta=+125 ～
+125°CC
4.85
4.6

4.5 4.80
5 10 15 20 25 30 35 40 45 50 55 60 65 0 5 10 15 20 25 30
VIN (V) Ivcc (mA)

Figure 23. VCC vs. VIN Figure 24. VCC vs. Ivcc
4.5 2.4

4.4
2.3
4.3
2.2
4.2
2.1
VIN_UVLO (V)

4.1
VFDSET (V)

4.0 2.0

3.9
1.9
3.8 UVLO_H
UVLO_L 1.8
3.7
1.7
3.6

3.5 1.6
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
～
Temperature ((°C)
C) ～
Temperature ((°C)
C)
Figure 25. VIN UVLO vs. Temperature Figure 26. VFDSET vs. Temperature
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 AL8891Q

Typical Performance Characteristics (continued)

(VIN = 24V, IOUT = 2A, COUT = 0.47µF, fSW = 400kHz, unless otherwise specified.)

VCC (1V/div) VCC (1V/div)

VPWM (2V/div)
VOUTDC (1V/div)

IL (1A/div)

VSW (10V/div)
IL (1A/div)

5μs/div VSW (10V/div) 10ms/div

Figure 27. Steady State, Iout = 2A Figure 28. PWM Dimming, 100Hz, 50% Duty Cycle

VCC (1V/div)
VPWM (2V/div)
VFAULTB (5V/div)

IL (1A/div)
VOUT (2V/div)

IL (1A/div)

VIN (10V/div)
10ms/div
VSW (10V/div) 500μs/di
v

Figure 29. PWM Dimming, 2kHz, 50% Duty Cycle Figure 30. Startup through VIN

VFAULTB (5V/div) VFAULTB (5V/div)

VOUT (2V/div) VOUT (2V/div)

IL(1A/div) IL (1A/div)

VIN (10V/div) VIN (10V/div)

10ms/div 10ms/div

Figure 31. Shutdown through VIN, VFDSET = 0V Figure 32. Shutdown through VIN, VFDSET = 5V

AL8891Q 12 of 24 September 2024

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 AL8891Q

Typical Performance Characteristics (Test at TA = +25°C, VIN = 24V, LOAD = 2LEDs in series, IOUT = 2A, COUT =
0.47µF, fSW = 400kHz, unless otherwise specified.)

VEN (2V/div)

VOUT (2V/div)
VEN (2V/div)

VFAULTB (5V/div)

VFAULTB (5V/div)

VOUT (2V/div) IL (1A/div)

IL (1A/div)
500µs/div 5ms/div

Figure 33. Start through EN Figure 34. Shutdown through EN

VFAULTB (5V/div)

VFAULTB (5V/div)

IL (1A/div) IL(1A/div)

VOUT (5V/div)
VOUT (5V/div)

20µs/div 5µs/div
VSW (10V/div) VSW (10V/div)

Figure 35. LED+ Short to LED- Entry, VIN = 12V Figure 36. LED+ Short to LED- Recovery, VIN = 12V

VFAULTB (5V/div)
VFAULTB (5V/div)

IL (1A/div)
IL (1A/div)
VOUT (5V/div)

VOUT (5V/div)
Vsw (10V/div)

Vsw (10V/div)

50us/div 100μs/div

Figure 37. LED Open Entry, VIN = 12V Figure 38. LED Open Recovery, VIN = 12V

AL8891Q 13 of 24 September 2024

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 AL8891Q

Functional Description
Overview
The AL8891Q regulator is an easy-to-use, high-efficiency, compact, synchronous step-down LED driver capable of driving up to 2A of load current
from an input voltage ranging from 4.5V to 65V. The switching frequency is adjustable from 200kHz to 2.5MHz by an external resistor.

Constant on time control is employed to achieve simple control-loop compensation and cycle-by-cycle current limiting. Internal compensation makes
the AL8891Q require few external components.

Optional features such as programmable switching frequency, Power Good flag, internal soft-start, and multiple dimming methods provide a flexible
and easy-to-use platform for a wide range of applications. Protection features include thermal shutdown, VIN and VCC undervoltage lockout, cycle-
by-cycle current limit, output short-circuit protection, LED open and short detection, and external components open and short protection.

Switching Frequency
An adaptive on-time average current mode control is implemented to provide near constant switching frequency which can be set between 200kHz
and 2.5MHz. The frequency is programmed using an external resistor RON connected between the FREQ pin and ground, thus the switching
frequency is adjusted. tON is given by the following equation:

tON = k x (RON + RINT) x (VOUT/VIN) Equation 1

fSW =1 / [k x (RON + RINT)] Equation 2

Where k = 0.0103, with fSW in MHz, tON in μs, RON and RINT in kΩ. RINT is an internal resistor 3kΩ
fsw (MHz)

Figure 39. fSW vs. RON

Enable (EN)
Enable (EN) is a digital control pin that turns the converter on and off. The AL8891Q is activated when a logic high signal is applied to the EN pin
and VIN is above UVLO threshold. The device delivers desired LED current set by RCS when PDIM is high. EN pin should not be open circuit or
floating.

PWM Dimming (PDIM) Control

PWM dimming can be achieved by PDIM pin or EN pin. By sending a PWM signal to PDIM pin or EN pin, the average LED current is proportional
to the duty cycle of the applied PWM signal. The dimming frequency between 100Hz and 2kHz is recommended. By selecting a PWM frequency
100Hz, a dimming ratio of 0.1% can be achieved. The average LED current during dimming can be calculated as the following equation:

𝐼𝐿𝐸𝐷_𝐴𝑉𝐺 = 𝑃𝑊𝑀 𝑑𝑢𝑡𝑦 𝑐𝑦𝑐𝑙𝑒 x 𝐼𝐿𝐸𝐷_𝑠𝑒𝑡𝑡𝑖𝑛𝑔 Equation 3

Note that when EN dimming is applied, a pulse width greater than 200μs is necessary to activate the device during startup.

When the EN pin is toggled from high to low, the output is turned off immediately, but VCC will keep on for time tEN_OFF_DELAY and the device will
stay in standby mode during this period. After that VCC will turn off, and the device will shut down completely.

AL8891Q 14 of 24 September 2024

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 AL8891Q

Functional Description (continued)

Analog Dimming (ADIM) Control
The AL8891Q can also achieve analog dimming by applying an analog voltage on ADIM pin. When V ADIM is higher than 2.0V, the LED current is at
100% level which is defined by sense resistor RCS. When VADIM is between 2V and 0.15V, the LED current decreases linearly down from 100% to
7.5% level. The LED current is internally clamped to 7.5% level when V ADIM is lower than 0.15V. The analog dimming feature is shown as below.

VCSP-CSN

0.2V

0.015V
VADIM
0.15V 2V

Figure 40. VCSP-CSN vs. VADIM

Then the LED current can be calculated as the following equation, the LED current can be programmed by sense resistor RCS.

𝐼𝐿𝐸𝐷_𝐴𝑉𝐺 = 𝑉𝐶𝑆𝑃-CS𝑁/𝑅𝐶𝑆 Equation 4

VCC, and UVLO

The AL8891Q integrates an internal LDO to generate VCC for control circuitry and MOSFET drivers. The nominal voltage for VCC is 5V (typical). The
VCC pin is the output of the LDO. A high-quality ceramic capacitor is recommended to be placed as close as possible to VCC pin. The VCC output
pin must not be loaded during operation.

Undervoltage lockout (UVLO) protects the chip from operating at an insufficient supply voltage. It monitors the VCC voltage. When the voltage is
lower than UVLO threshold voltage, the device is shut down. The UVLO rising threshold is about 3.6V (typical), while its falling threshold is 3.45V
(typical).

Bootstrap Voltage (CBOOT)

A voltage higher than VIN is required to drive the HS power MOSFET. The capacitor connected between CBOOT and SW pins works as a charge
pump to boost voltage on the CBOOT pin to (VSW + VCC) through internally integrated diode. A ceramic capacitor of 0.47µF/6.3V or higher value for
CBOOT is recommended.

AL8891Q 15 of 24 September 2024

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 AL8891Q

Functional Information – Fault and Protections

The AL8891Q provides full protection functions, including cycle-by-cycle peak and valley current clamp, LED short and open protection, inductor
short and open protection, RCS short protection (overcurrent), LED+ short to battery protection, FREQ pin short and open protection, and thermal
shutdown. The following table summarizes all fault functions.

Fault Detection Fault Flag Fault Delay Fault Mode Output

LED+ short to LED- CSN-PGND < 1.6V Yes tFDG No action to driver Running
FDSET > threshold & low LED current,
LED open Yes tMASK_DET Hiccup mode Stop
no-fault- reporting if ADIM < 0.4V.
LED+ short to battery Same as LED open Yes tMASK_DET Hiccup mode Stop
Inductor open Same as LED open Yes tMASK_DET Hiccup mode Stop
Trigger peak current limit for 9 cycles
Inductor short then latch. Toggle EN can exit latch Yes 0µs Latchoff Stop
after fault removal.
FDSET > threshold & overcurrent, no-
RCS short Yes tMASK_DET Hiccup mode Stop
fault- reporting if ADIM < 0.4V.
Trigger peak current limit for 9 cycles
Overcurrent Yes 0µs Latchoff Stop
then latch.
External resistor open circuit detected
FREQ pin open Yes 0µs Latchoff Stop
for TON pin after VCC power-up
External resistor short circuit detected
FREQ pin short Yes 0µs Latchoff Stop
for TON pin after VCC power-up.
Shutdown and auto
Overtemperature TJ > Thermal shutdown threshold Yes 0µs Stop
recovery

LED+ Short to LED-

When output short fault occurred and CSN-PGND < 1.6V, including LED+ short to LED- or output capacitor short or any other event resulting in
output short, the fault is detected, and FAULT pin is set to low level after deglitch time tFDT. But the converter will work continuously and output
nominal current. When the output short fault is removed and CSN-PGND > 1.8V, FAULT is set to high level immediately and the converter returns
to normal work.

LED Open
The LED open fault is masked when FDSET pin voltage is lower than VFDSET, that is to avoid misreporting LED open faults during VIN startup. To
achieve the mask function, connect a voltage divider between VIN and GND, and connect the center of the divider to FDSET pin.

Figure 41. Set VIN Threshold to Mask LED Open Fault

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 AL8891Q

Functional Information – Fault and Protections (continued)

The VIN rising threshold that enables LED open fault detection can be determined by:

𝑉𝐼𝑁−𝑅𝐼𝑆𝐼𝑁𝐺 = (1+R𝐹𝐷𝑇 / R𝐹𝐷𝐵) ×V𝐹𝐷𝑆𝐸𝑇 Equation 5

In addition, no LED open fault reporting if ADIM < 0.4V. So, only FDSET > threshold and ADIM > 0.4V are met, the LED open fault is reported, and
the converter enter hiccup mode after mask time tMASK-DET. When LED open is removed, the converter returns to normal operation when a hiccup
period ended. FAULT pin is set to high level after mask time tMASK-REL. The cool down time of hiccup mode is tRETRY.

Note that FDSET is a high-impedance input pin and should not be left floating. If LED open detection is not required, tie the FDSET pin to GND. Or
tie the FDSET pin to VCC then LED Open fault is never masked.

For inductor open and LED+ short to Battery fault, the detection and recovery is same as LED open fault.

RCS Short
When RCS short occurs and the peak current does not reach peak current limit IPEAK-LIMIT, the converter will enter hiccup mode after mask time
tMASK-DET and FAULT is set to low level. When RCS short is removed, the converter returns to normal operation: 1) when a hiccup period ended,
and FAULT pin is set to high level after mask time tMASK-REL; 2) FDSET > threshold and ADIM > 0.4V.

Inductor Short and Overcurrent Protection

When inductor short occurs, the current of internal power MOSFET will ramp up until it hits peak current limit IPEAK-LIMIT. After triggering peak current
limit for 9 cycles the converter latches off immediately and FAULT is set to low level. Toggling EN can exit latch after inductor short fault is removed.

Besides inductor short, if there is any other reason that results in the current of internal power MOSFET triggering peak current limit for 9 cycles, the
converter will latch off.

FREQ Pin Fault

There is FREQ pin short and open detection after each VCC power-up. Make sure the FREQ pin is properly connected to a resistor to avoid triggering
pin short or open fault. After fault is detected, the converter latches off immediately and FAULT pin is set to low level. The fault is latched until next
VCC power-up.

Overtemperature Protection
When the junction temperature exceeds TSD, the AL8891Q shuts down the switching regulator to reduce thermal dissipation. It automatically restarts
the switching regulator after junction temperature drops back below TSD-TSD(HYS). The VCC LDO regulators remain operational during
overtemperature event.

AL8891Q 17 of 24 September 2024

Document number: DS46540 Rev. 1 - 2 [Link] © 2024 Copyright Diodes Incorporated. All Rights Reserved.
 AL8891Q

Typical Application Information

1) PWM Dimming Application Diagram

VIN
VIN CBOOT
CBOOT L1 RCS
CIN SW

PGND CSP COUT

FDSET CSN
VCC
AL8891Q

AGND

EN

PDIM
Vin
ADIM
RFAULT

FREQ FAULT
RON

2) Analog Dimming Application Diagram

VIN
VIN CBOOT
CBOOT L1 RCS
CIN SW

PGND CSP COUT

FDSET CSN
VCC
AL8891Q

AGND

EN

PDIM
Analog Vin
ADIM
input
RFAULT

FREQ FAULT
RON

AL8891Q 18 of 24 September 2024

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 AL8891Q

Typical Application Information (continued)

3) EN Pin to VIN Dimming Application Diagram

VIN
VIN CBOOT
CBOOT L1 RCS
CIN SW
PGND
COUT
CSP
EN
CSN
VCC
AL8891Q
VIN
AGND

FDSET

PDIM
VIN
ADIM
RFAULT

FREQ FAULT
RON

4) PDIM and ADIM Both Pins Dimming Application Diagram

VIN
VIN CBOOT
CBOOT L1 RCS
CIN SW
PGND
COUT
CSP
EN
CSN
VCC AL8891Q
VIN
AGND

FDSET

PDIM
VIN
ADIM
RFAULT

FREQ FAULT
RON

AL8891Q 19 of 24 September 2024

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 AL8891Q

Typical Application Information (continued)

5) Output Capacitor Calculation
The output capacitor value depends on the total series resistance of the LED string, 𝒓_𝑳𝑬𝑫, and the switching frequency, 𝒇_𝒔𝒘. The capacitance
required for the target LED ripple current, ∆𝒊_𝑳𝑬𝑫, is calculated using Equation below.

Where

∆𝒊_(𝑳_𝒎𝒂𝒙) maximum ripple current of power inductor in worst case

𝒇_𝒔𝒘 switching frequency
𝒓_𝑳𝑬𝑫 equivalent resistance of total LED string
∆𝒊_𝑳𝑬𝑫 target ripple current of LED string

When choosing the output capacitors, consider the ESR and ESL characteristics because they directly impact the LED current ripple. Ceramic
capacitors are the best choice due to the following:

• Low ESR
• High ripple current rating
• Long lifetime
• Good temperature performance

With ceramic capacitor technology, consider the derating factors associated with higher temperature and DC bias operating conditions. It is
recommend to use an X7R dielectric with a voltage rating greater than the maximum LED stack voltage.

6) Input Capacitor Calculation

The input capacitor buffers the input voltage for transient events and decouples the converter from the supply. It is recommended to use a 10µF
input capacitor across the VIN pin and PGND placed close to the device and connected using wide traces. X7R-rated ceramic capacitors are the
best choice due to the low ESR, high ripple current rating, and good temperature performance.

In addition, a small case size 100nF ceramic capacitor must be used across VIN to PGND, immediately adjacent to the device. This usage provides
a high-frequency bypass for the control circuits internal to the device. These capacitors also suppress SW node ringing, which reduces the maximum
voltage present on the SW node and EMI.

The capacitance can be increased to further limit the input voltage deviation during PWM dimming operation.

AL8891Q 20 of 24 September 2024

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 AL8891Q

Typical Application Information (continued)

7) Layout
The performance of any switching converter depends as much upon the layout of the PCB as the component selection. The AL8891Q is designed
to meet the optimization requirements of PCB layout in the pin assignment. For example, VIN and GND pins are adjacent to each other, which is
convenient for placing VIN bypass capacitors.

Radiated EMI is generated by the high di/dt components in pulsing currents in switching converters. The larger area covered by the path of a pulsing
current, the more electromagnetic emission is generated. The key to minimize radiated EMI is to minimize the area of the pulsing current path, thus,
placing high frequency ceramic bypass capacitor(s) as close as possible to the VIN and GND pins is necessary.

In addition, high dv/dt occurs on SW node during switching, so the trace between SW pin and inductor should be as short as possible, and just wide
enough to carry the load current without excessive heating. Short and thick traces are highly recommended to minimize parasitic resistance. Besides,
sensitive signal lines should be kept away from SW traces.

The following guidelines are provided to help users design a PCB with the best power conversion performance, thermal performance, and minimized
generation of unwanted EMI.

1. Place high-frequency ceramic bypass CIN as close as possible to VIN and GND pins; a ceramic capacitor in small package (such as 0603) is
still needed even if multiple input capacitors are implemented.
2. The high-current loop consisting of VIN, VOUT and PGND should be as compact as possible.
3. The bypass capacitors of VCC should be arranged close to the VCC pin and return to the PGND pin with the shortest connection.
4. It is recommended to use a four-layer board with 2oz top and bottom layers, and a dedicate ground plane on middle layer. Use a minimum 3
by 4 arrays of 10 mil thermal VIAs to connect the thermal pad to the system ground plane for heat dissipation purpose.
5. The SW and CBOOT nodes contain a lot of high-frequency noise, so the connection of these pins should be as short as possible, meanwhile,
there should be sufficient width to conduct the current.
6. Sensitive analog signals, such as CSP and CSN need to be far away from the noisy nodes, and ground plane can be used as a shielding layer
while routing these sensitive signals.
7. The resistor for FREQ pin RON must be located as close to the pin as possible.

Design Tools (Note 9)

• AL8891Q Demo Board
• Demo Board Gerber File for PCB Layout Reference

Note: 9. Diodes Incorporated’s design tools can be found on our website at [Link]

AL8891Q 21 of 24 September 2024

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 AL8891Q

Ordering Information (Note 10)

AL8891Q XX - XX

Package Packing
T16E: TSSOP-16EP 13: Tape & Reel

Packing
Orderable Part Number Package Code Package
Qty. Carrier
AL8891QT16E-13 T16E TSSOP-16EP 2500 Tape & Reel

Note: 10. For packaging details, go to our website at [Link]

Marking Information
TSSOP-16EP

( Top View – Not to Scale)

16

Logo YY : Year (ex: 24 = 2024)

Identification Code WW : Week : 01 to 52; 52
AL8891Q represents week 52 and 53
YY WW X X E
X X : Internal Code
E : TSSOP-16EP
1 8

AL8891Q 22 of 24 September 2024

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 AL8891Q

Package Outline Dimensions

Please see [Link] for the latest version.

TSSOP-16EP

D X
TSSOP-16EP
e
Dim Min Max Typ
A - 1.20 -
A1 0.025 0.100 -
A2 0.80 1.05 0.90
b 0.19 0.30 -
E1 E Y
c 0.09 0.20 -
D 4.90 5.10 5.00
E 6.20 6.60 6.40
PIN 1
ID MARK E1 4.30 4.50 4.40
e 0.65 BSC
A2
L 0.45 0.75 0.60
0.25
Gauge Plane
L1 1.0 REF
L2 0.65 BSC
A  X - - 2.997
Seating Plane Y - - 2.997
b A1
L
DETAIL θ1 0° 8° -
All Dimensions in mm
L1

Suggested Pad Layout

Please see [Link] for the latest version.

TSSOP-16EP

X2

Y Value
Dimensions
(in mm)
C 0.650
X 0.450
Y3 Y1 Y2 X1 3.290
X1 X2 5.000
Y 1.450
Y1 3.290
Y2 4.450
Y3 7.350

X C

Mechanical Data
• Moisture Sensitivity: Level 1 per JESD22-A113
• Terminals: Finish – Matte Tin Plated Leads, Solderable per M2003 JESD22-B102
• Weight: 0.055 grams (Approximate)

AL8891Q 23 of 24 September 2024

Document number: DS46540 Rev. 1 - 2 [Link] © 2024 Copyright Diodes Incorporated. All Rights Reserved.
 AL8891Q

IMPORTANT NOTICE

1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH
REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY
RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’ products
described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product
described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products.
Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting
the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring
their applications, which incorporate Diodes’ products, comply the applicable legal and regulatory requirements as well as safety and functional-
safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques,
redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications.

3. Diodes assumes no liability for any application-related information, support, assistance or feedback that may be provided by Diodes from
time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated with such use, and
will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against all damages and liabilities.

4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications.
Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks and trademark
applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties
whose products and services may be described in this document or on Diodes’ website) under this document.

5. Diodes’ products are provided subject to Diodes’ Standard Terms and Conditions of Sale
([Link] or other applicable terms. This document does not
alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in respect of any products
purchased through unauthorized sales channel.

6. Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sale is
prohibited under any applicable laws and regulations. Should customers or users use Diodes’ products in contravention of any applicable laws or
regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any damages, losses or
penalties arising in connection therewith or as a result thereof, and (b) indemnify and hold Diodes and its representatives and agents harmless
against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with
the applicable laws and regulations, as well as any unintended or unauthorized application.

7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may contain
technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document is error-free and
Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes reserves the right to make
modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final
and determinative format released by Diodes.

8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion hereof) is
prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any such unauthorized
use.

9. This Notice may be periodically updated with the most recent version available at [Link]
conditions/important-notice

The Diodes logo is a registered trademark of Diodes Incorporated in the United States and other countries.
All other trademarks are the property of their respective owners.
© 2024 Diodes Incorporated. All Rights Reserved.

[Link]

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