PCM 2903 C
PCM 2903 C
PCM2903C
SBFS038A – JUNE 2012 – REVISED SEPTEMBER 2015
Line In
PCM2903C
HID Controls
VDD AGNDC
VCCC AGNDP
VCCX AGNDX
VCCP1 DGND
VCCP2
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PCM2903C
SBFS038A – JUNE 2012 – REVISED SEPTEMBER 2015 [Link]
Table of Contents
1 Features .................................................................. 1 9.3 Feature Description................................................. 17
2 Applications ........................................................... 1 9.4 Device Functional Modes........................................ 18
3 Description ............................................................. 1 9.5 Programming........................................................... 18
4 Revision History..................................................... 2 10 Application and Implementation........................ 24
10.1 Application Information.......................................... 24
5 Device Comparison Table..................................... 3
10.2 Typical Application ............................................... 24
6 Pin Configuration and Functions ......................... 4
11 Power Supply Recommendations ..................... 26
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5 12 Layout................................................................... 26
12.1 Layout Guidelines ................................................. 26
7.2 ESD Ratings.............................................................. 5
12.2 Layout Example .................................................... 26
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5 13 Device and Documentation Support ................. 27
7.5 Electrical Characteristics........................................... 6 13.1 Documentation Support ........................................ 27
7.6 Typical Characteristics .............................................. 9 13.2 Community Resources.......................................... 27
13.3 Trademarks ........................................................... 27
8 Parameter Measurement Information ................ 15
13.4 Electrostatic Discharge Caution ............................ 27
9 Detailed Description ............................................ 16
13.5 Glossary ................................................................ 27
9.1 Overview ................................................................. 16
9.2 Functional Block Diagram ....................................... 16 14 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Removed Package/Ordering Information table ..................................................................................................................... 5
DB Package
28-Pin SSOP
Top View
D+ 1 28 SSPND
D- 2 27 VDD
VBUS 3 26 DGND
DGNDU 4 25 DOUT
HID0 5 24 DIN
HID1 6 23 VCCX
HID2 7 22 AGNDX
SEL0 8 21 XTI
SEL1 9 20 XTO
VCCC 10 19 VCCP2
AGNDC 11 18 AGNDP
VINL 12 17 VCCP1
VINR 13 16 VOUTL
VCOM 14 15 VOUTR
Pin Functions
PIN
DESCRIPTION
NAME NO. I/O
AGNDC 11 – Analog ground for codec
AGNDP 18 – Analog ground for PLL
AGNDX 22 – Analog ground for oscillator
D– 2 I/O USB differential input/output minus (1)
D+ 1 I/O USB differential input/output plus (1)
DGND 26 – Digital ground
DGNDU 4 – Digital ground for USB transceiver
(2)
DIN 24 I S/PDIF input
DOUT 25 O S/PDIF output
HID0 5 I HID key state input (mute), active-high (3)
HID1 6 I HID key state input (volume up), active-high (3)
HID2 7 I HID key state input (volume down), active-high (3)
SEL0 8 I Must be set to high (4)
SEL1 9 I Connected to the USB port of VBUS (4)
SSPND 28 O Suspend flag, active-low (Low: suspend, High: operational)
VBUS 3 – Must be connected to VDD
VCCC 10 – Analog power supply for codec (5)
VCCP1 17 – Analog power supply for PLL (5)
VCCP2 19 – Analog power supply for PLL (5)
VCCX 23 – Analog power supply for oscillator (5)
(5)
VCOM 14 – Common for ADC/DAC (VCCC/2)
(5)
VDD 27 – Digital power supply
VINL 12 I ADC analog input for L-channel
VINR 13 I ADC analog input for R-channel
VOUTL 16 O DAC analog output for L-channel
VOUTR 15 O DAC analog output for R-channel
XTI 21 I Crystal oscillator input (6)
XTO 20 O Crystal oscillator output
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted). (1)
MIN MAX UNIT
Supply voltage, VCCC, VCCP1, VCCP2, VCCX, VDD –0.3 4 V
Supply voltage differences, VCCC, VCCP1, VCCP2, VCCX, VDD ±0.1 V
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU ±0.1 V
Digital input SEL0, SEL1, DIN –0.3 6.5 V
voltage D+, D–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND –0.3 (VDD + 0.3) < 4 V
Analog input voltage VINL, VINR, VCOM, VOUTR, VOUTL –0.3 (VCCC + 0.3) < 4 V
Input current (any pins except supplies) ±10 mA
Ambient temperature under bias –40 125 °C
Junction temperature TJ 150 °C
Lead temperature (soldering, 5 s) 260 °C
Package temperature (IR reflow, peak) 250 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) fIN = 1 kHz, using a System Two™ audio measurement system by Audio Precision™ in RMS mode with a 20-kHz LPF and 400-Hz HPF
in the calculation.
6 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
(2) fOUT = 1 kHz, using a System Two audio measuerment system by Audio Precision in RMS mode with a 20-kHz LPF and 400-Hz HPF.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: PCM2903C
PCM2903C
SBFS038A – JUNE 2012 – REVISED SEPTEMBER 2015 [Link]
0.01 95
Total Harmonic Distortion + Noise (%)
91
0.007
Dynamic Range
0.006
89
0.005 SNR
87
0.004
0.003 85
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Free-Air Temperature (°C) Free-Air Temperature (°C)
G001 G002
Figure 1. Total Harmonic Distortion + Noise at –1 dB vs Figure 2. Dynamic Range and SNR vs Free-Air
Free-Air Temperature Temperature
0.01 95
Total Harmonic Distortion + Noise (%)
0.009
93
0.008
91
0.007
Dynamic Range
0.006
89
SNR
0.005
87
0.004
0.003 85
2.8 3 3.2 3.4 3.6 3.8 2.8 3 3.2 3.4 3.6 3.8
Supply Voltage (V) Supply Voltage (V)
G003 G004
Figure 3. Total Harmonic Distortion + Noise at –1 dB vs Figure 4. Dynamic Range and SNR vs Supply Voltage
Supply Voltage
0.01 95
Total Harmonic Distortion + Noise (%)
0.009
93
0.008
91
0.007
0.005 SNR
87
0.004
0.003 85
30 35 40 45 50 30 35 40 45 50
Sampling Frequency (kHz) Sampling Frequency (kHz)
G005 G006
Figure 5. Total Harmonic Distortion + Noise at –1 dB vs Figure 6. Dynamic Range and SNR vs Sampling Frequency
Sampling Frequency
0.008 98
Total Harmonic Distortion + Noise (%)
97
0.006 95
94
0.005 93
Dynamic Range
92
0.004
91
0.003 90
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Free-Air Temperature (°C) Free-Air Temperature (°C)
G007 G008
Figure 7. Total Harmonic Distortion + Noise at 0 dB vs Figure 8. Dynamic Range and SNR vs Free-Air
Free-Air Temperature Temperature
0.008 98
Total Harmonic Distortion + Noise (%)
97
Dynamic Range and SNR (dB)
0.007 SNR
96
0.006 95
94
0.005 93
Dynamic Range
92
0.004
91
0.003 90
3 3.1 3.2 3.3 3.4 3.5 3.6 3 3.1 3.2 3.3 3.4 3.5 3.6
Supply Voltage (V) Supply Voltage (V)
G009 G010
Figure 9. Total Harmonic Distortion + Noise at 0 dB vs Figure 10. Dynamic Range and SNR vs Supply Voltage
Supply Voltage
0.008 98
Total Harmonic Distortion + Noise (%)
97
Dynamic Range and SNR (dB)
0.007 SNR
96
0.006 95
94
0.005 93
Dynamic Range
92
0.004
91
0.003 90
30 35 40 45 50 30 35 40 45 50
Sampling Frequency (kHz) Sampling Frequency (kHz)
G011 G012
Figure 11. Total Harmonic Distortion + Noise at 0 dB vs Figure 12. Dynamic Range and SNR vs Sampling
Sampling Frequency Frequency
0 0
-20 -20
-40 -40
Amplitude (dB)
Amplitude (dB)
-60 -60
-80 -80
-100 -100
-120 -120
-140 -140
0 5 10 15 20 0 5 10 15 20
Frequency (kHz) Frequency (kHz)
G013 G014
Figure 13. Output Spectrum (–1 dB, N = 8192) Figure 14. Output Spectrum (–60 dB, N = 8192)
0 0
-20 -20
-40 -40
Amplitude (dB)
Amplitude (dB)
-60 -60
-80 -80
-100 -100
-120 -120
-140 -140
0 5 10 15 20 0 5 10 15 20
Frequency (kHz) Frequency (kHz)
G015 G016
Figure 15. Output Spectrum (0 dB, N = 8192) Figure 16. Output Spectrum (–60 dB, N = 8192)
80 1.6 80
Operational Supply Current (mA)
30 0.6 30
20 0.4 20
Suspend
10 0.2 10
0 0 0
3 3.1 3.2 3.3 3.4 3.5 3.6 30 35 40 45 50
Supply Voltage (V) Sampling Frequency (kHz)
G017 G018
Figure 17. Operational and Suspend Supply Current vs Figure 18. Operational Supply Current vs Sampling
Supply Voltage Frequency
0 0
-10
-20
-20
-40
-30
Amplitude (dB)
Amplitude (dB)
-60 -40
-80 -50
-60
-100
-70
-120
-80
-140 -90
-160 -100
0 8 16 24 32 0 0.2 0.4 0.6 0.8 1
Frequency (× fS) Frequency (× fS)
G019 G020
0 -4
Amplitude (dB)
Amplitude (dB)
-0.2 -8
-0.4 -12
-0.6 -16
-0.8 -20
0 0.1 0.2 0.3 0.4 0.5 0.46 0.48 0.5 0.52 0.54
Frequency (× fS) Frequency (× fS)
G021 G022
0 0
-10
-20 -0.2
-30
Amplitude (dB)
Amplitude (dB)
-40 -0.4
-50
-60 -0.6
-70
-80 -0.8
-90
-100 -1.0
0 0.1 0.2 0.3 0.4 0 1 2 3 4
Frequency (× fS/1000) Frequency (× fS/1000)
G023 G024
Figure 23. Stop-Band Characteristics Figure 24. Passband Characteristics
0 0
-10 -0.2
Amplitude (dB)
Amplitude (dB)
-20 -0.4
-30 -0.6
-40 -0.8
-50 -1.0
1 10 100 1k 10k 0.01 0.1 1 10 100
Frequency (kHz) Frequency (kHz)
G025 G026
0 0.2
-10
-20 0
-30
Amplitude (dB)
Amplitude (dB)
-40 -0.2
-50
-60 -0.4
-70
-80 -0.6
-90
-100 -0.8
0 1 2 3 4 0 0.1 0.2 0.3 0.4 0.5
Frequency (× fS) Frequency (× fS)
G027 G028
Figure 27. Stop-Band Attenuation Figure 28. Passband Ripple
0
-2
-4
-6
Amplitude (dB)
-8
-10
-12
-14
-16
-18
-20
0.46 0.47 0.48 0.49 0.5 0.51 0.52 0.53 0.54
Frequency (× fS)
G029
0 0.2
-10 0
Amplitude (dB)
Amplitude (dB)
-20 -0.2
-30 -0.4
-40 -0.6
-50 -0.8
0 8 16 24 32 0 0.1 0.2 0.3 0.4 0.5
Frequency (× fS) Frequency (× fS)
G030 G031
0.0 0.0
-10 -0.2
Amplitude (dB)
Amplitude (dB)
-20 -0.4
-30 -0.6
-40 -0.8
-50 -1.0
1 10 100 1k 10k 0.01 0.1 1 10 100
Frequency (kHz) Frequency (kHz)
G032 G033
9 Detailed Description
9.1 Overview
The PCM2903C is an audio codec with USB connection capability and a digital S/PDIF digital interface. The
PCM2903C is a self-powered device; it needs an external 3.3V voltage source. The PCM2903C meet the
requirements of USB1.1 standard connection. This device has analog and digital inputs and outputs; it has a
digital S/PDIF interface for input and output data. The PCM2903C has 3 external interrupts (HID) which control
the Mute, Volume Up and Volume Down, these control inputs are active High. The PCM2903C requires a 12MHz
clock; it can be provided by an external clock or generated by a built-in crystal resonator.
VCCC VCCP1 VCCP2 VCCX VDD AGNDC AGNDP AGNDX DGND DGNDU
Lock
Power
Manager SSPND
VBUS
VINL
ISO-In
ADC FIFO
End-Point
VINR
USB SIE
D+
XCVR
Analog D-
PLL
VCOM Selector Control
End-Point
Analog
PLL
SEL0
SEL1
VOUTL
ISO-Out
DAC FIFO
End-Point
VOUTR
HID0
HID
HID1
DOUT S/PDIF Encoder End-Point
HID2
USB
Protocol
Controller
96 MHz Tracker
PLL (×8)
(SpAct)
12 MHz
XTI XTO
4.7 mF
VINR 30 kW
+
13 –
– (+)
+
+
(–)
VCOM Delta-Sigma
Modulator
14
+ (VCCC/2)
10 mF
Reference
9.5 Programming
9.5.1 USB Interface
Control data and audio data are transferred to the PCM2903C via D+ (pin 1) and D– (pin 2). All data to and from
the PCM2903C are transferred at full speed. The device descriprtor contains the information described in
Table 1.
(1) Ensure that there are two blank spaces between "Audio" and "CODEC"; copying and pasting will not
transfer the two blank spaces correctly.
End-Point #0
Default End-Point
FU
End-Point #2 Analog Out
(IF #1) IT OT
TID1 TID2
Audio Streaming Interface
UID3
End-Point #4 Analog In
(IF #2) OT IT
TID5 TID4
Audio Streaming Interface
End-Point #5
(IF #3)
HID Interface
The built-in digital volume controller can be manipulated by an audio class specific request from 0 dB to –64 dB
in 1-dB steps. Changes are made by incrementing or decrementing by one step (1 dB) for every 1/fS time interval
until the volume level has reached the requested value. Each channel can be set for different values. The master
volume control is not supported. A request to the master volume is stalled and ignored. The built-in digital mute
controller can be manipulated by audio class-specific request. A master mute control request is acceptable. A
request to an individual channel is stalled and ignored.
0V
5 V = VBUS
SEL1 (Pin 9)
(Typ)
Bus Reset Set Configuration First Audio Data Second Audio Data
Bus Idle
D+/D–
SSPND
VOUTL BPZ
VOUTR
Internal Reset
Ready for Setup Ready for Playback
Attach
(Connect to USB Bus)
0V
5 V = VBUS
SEL1 (Pin 9)
(Typ)
Bus Reset Set Configuration First Audio Data Second Audio Data
Bus Idle
D+/D–
SSPND
VOUTL BPZ
VOUTR
Internal Reset
Ready for Setup Ready for Playback
D+/D–
VOUTL
VOUTR
1 ms Detach
D+/D–
VINL
VINR
1 ms
SSPND
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
1.5 kW × 3
IC1
1.5 kW
22 W
D+ 1 D+ SSPND 28
22 W C3
D– 2 D- VDD 27
5 HID0 DIN 24
C4
6 HID1 VCCX 23
7 HID2 AGNDX 22
1 MW C5
8 SEL0 XTI 21
C6
9 SEL1 XTO 20
C1 12 MHz C7
1 MW 10 VCCC VCCP2 19
MUTE/
11 AGNDC AGNDP 18 Power Down
C9 C8
12 VINL VCCP1 17
C10 C11 LPF,
13 VINR VOUTL 16 Amp
C2 C12
14 VCOM VOUTR 15
LPF,
Amp
0.01 95
Total Harmonic Distortion + Noise (%)
91
0.007
Dynamic Range
0.006
89
SNR
0.005
87
0.004
0.003 85
2.8 3 3.2 3.4 3.6 3.8 2.8 3 3.2 3.4 3.6 3.8
Supply Voltage (V) Supply Voltage (V)
G003 G004
Figure 42. ADC Total Harmonic Distortion + Noise at –1 dB Figure 43. ADC Dynamic Range and SNR vs Supply
vs Supply Voltage Voltage
0.008 98
Total Harmonic Distortion + Noise (%)
97
Dynamic Range and SNR (dB)
0.007 SNR
96
0.006 95
94
0.005 93
Dynamic Range
92
0.004
91
0.003 90
3 3.1 3.2 3.3 3.4 3.5 3.6 3 3.1 3.2 3.3 3.4 3.5 3.6
Supply Voltage (V) Supply Voltage (V)
G009 G010
Figure 44. DAC Total Harmonic Distortion + Noise at 0 dB Figure 45. DAC Dynamic Range and SNR vs Supply
vs Supply Voltage Voltage
80 1.6 80
Operational Supply Current (mA)
70 1.4 70
Suspend Supply Current (mA)
60 1.2 60
Operational
50 1 50
ADC and DAC
40 0.8 40
30 0.6 30
20 0.4 20
Suspend
10 0.2 10
0 0 0
3 3.1 3.2 3.3 3.4 3.5 3.6 30 35 40 45 50
Supply Voltage (V) Sampling Frequency (kHz)
G017 G018
Figure 46. Operational and Suspend Supply Current vs Figure 47. Operational Supply Current vs Sampling
Supply Voltage Frequency
12 Layout
SSPND
DOUT DIN 1MOhm
AND Gate
D+
22Ohm
D-
VBUS 10uF
GND
1MOhm
1.5kOhmx3
USB port
VINL VINR
HID controls
13.3 Trademarks
SpAct, E2E are trademarks of Texas Instruments.
System Two, Audio Precision are trademarks of Audio Precision, Inc.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
[Link] 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
PCM2903CDB ACTIVE SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 PCM2903C
PCM2903CDBR ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 PCM2903C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
[Link] 10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
[Link] 3-Jun-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
[Link] 3-Jun-2022
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
[Link] 3-Jun-2022
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
DB0028A SCALE 1.500
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
C
8.2
TYP
A 7.4
0.1 C SEATING
PIN 1 INDEX AREA
PLANE
26X 0.65
28
1
2X
10.5
8.45
9.9
NOTE 3
14
15
0.38
28X
0.22
5.6 0.15 C A B
B
5.0
NOTE 4
2 MAX
(0.15) TYP 0.25
SEE DETAIL A GAGE PLANE
DETAIL A
A 15
TYPICAL
4214853/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
[Link]
EXAMPLE BOARD LAYOUT
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
1 (R0.05) TYP
28X (0.45) 28
26X (0.65)
SYMM
14 15
(7)
4214853/B 03/2018
NOTES: (continued)
[Link]
EXAMPLE STENCIL DESIGN
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
26X (0.65)
SYMM
14 15
(7)
4214853/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
[Link]
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