BTT6200 4EMA Infineon
BTT6200 4EMA Infineon
BTT6200-4EMA
Smart High-Side Power Switch
Quad Channel, 200mΩ
Data Sheet
PROFET™+ 24V
Rev. 1.0, 2014-08-20
Automotive Power
BTT6200-4EMA
Table of Contents
Table of Contents
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 Voltage and Current Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3.1 PCB set up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3.2 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1 Output ON-state Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2 Turn ON/OFF Characteristics with Resistive Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.3 Inductive Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.3.1 Output Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.3.2 Maximum Load Inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.4 Inverse Current Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.5 Electrical Characteristics Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1 Loss of Ground Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.2 Undervoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.3 Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4 Reverse Polarity Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5 Overload Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5.1 Current Limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5.2 Temperature Limitation in the Power DMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.6 Electrical Characteristics for the Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7 Diagnostic Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1 IS Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.2 SENSE Signal in Different Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.3 SENSE Signal in the Nominal Current Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.3.1 SENSE Signal Variation as a Function of Temperature and Load Current . . . . . . . . . . . . . . . . . . . 28
7.3.2 SENSE Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.3.3 SENSE Signal in Open Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
[Link] Open Load in ON Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
[Link] Open Load in OFF Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
[Link] Open Load Diagnostic Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.3.4 SENSE Signal in Short Circuit to VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.3.5 SENSE Signal in Case of Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.3.6 SENSE Signal in Case of Inverse Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.4 Electrical Characteristics Diagnostic Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8 Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.1 Input Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.2 DEN / DSEL0,1 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table of Contents
1 Overview
Application
• Suitable for resistive, inductive and capacitive loads
• Replaces electromechanical relays, fuses and discrete circuits
• Most suitable for loads with high inrush current, such as lamps
• Suitable for 24V Trucks and Transportation System
Basic Features
PG-SSOP-24-14 EP
• Quad channel device
• Very low stand-by current
• 3.3 V and 5 V compatible logic inputs
• Electrostatic discharge protection (ESD)
• Optimized electromagnetic compatibility
• Logic ground independent from load ground
• Very low power DMOS leakage current in OFF state
• Green product (RoHS compliant)
• AEC qualified
Description
The BTT6200-4EMA is a 200 mΩ quad channel Smart High-Side Power Switch, embedded in a PG-SSOP-24-14
EP , Exposed Pad package, providing protective functions and diagnosis. The power transistor is built by an
N-channel vertical power MOSFET with charge pump. The device is integrated in Smart6 HV technology. It is
specially designed to drive lamps up to R10W 24V or R5W 12V, as well as LEDs in the harsh automotive
environment.
Overview
Diagnostic Functions
• Proportional load current sense multiplexed for the 4 channels
• Open load detection in ON and OFF
• Short circuit to battery and ground indication
• Overtemperature switch off detection
• Stable diagnostic signal during short circuit
• Enhanced kILIS dependency with temperature and load current
Protection Functions
• Stable behavior during undervoltage
• Reverse polarity protection with external components
• Secure load turn-off during logic ground disconnection with external components
• Overtemperature protection with latch
• Overvoltage protection with external components
• Enhanced short circuit operation
Block Diagram
2 Block Diagram
Channel 0
VS
voltage sensor
internal
power
over T
supply
temperature clamp for
inductive load
IN0 gate control
driver & over current
logic charge pump switch limit
DEN ESD
protection load current sense and OUT 0
open load detection
IS
VS
Channel 1
Channel 2
IN2
OUT 2
Channel 3
IN3
OUT 3
GND
Block diagram [Link]
Pin Configuration
3 Pin Configuration
NC 1 24 OUT0
IN0 2 23 NC
NC 3 22 NC
GND 4 21 NC
IN1 5 20 OUT1
DEN 6 19 NC
IS 7 18 NC
DSEL0 8 17 OUT2
IN2 9 16 NC
IN3 10 15 NC
DSEL1 11 14 NC
NC 12 13 OUT3
[Link]
Figure 2 Pin Configuration
Pin Configuration
Figure 3 shows all terms used in this data sheet, with associated convention for positive values.
VS
IIN0
IN0 IOUT0
VIN0
IIN1 OUT0
IN1
VIN1 IIN2
IN2 IOUT1
VIN2 IIN3 OUT1
IN3
VIN3 IDEN
DEN IOUT2
V DEN IDSEL0 OUT2
DSEL0
VDSEL 0 IDSEL1
DSEL1 IOUT3
VDSEL 1 IIS OUT3
IS
VIS
GND
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
70µm
1.5mm
35µm
2 2
1 1
2 2
2 2
1 COOLING 1
TAB
2 VS 2
2 2
1 1
2 2
1 1
2 2
PCB_600_SSOP24.vsd
Figure 5 PC Board Top and Bottom View for Thermal Simulation with 600 mm² Cooling Area
100
10
Zth‐ja [K/W]
1s0p‐footprint
1s0p‐300mm²
1s0p‐600mm²
2s2p
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Time [s]
80
75
70
65
60
Rthja [K/W]
55
50
45
1s0p
40
35
30
0 100 200 300 400 500 600 700
2
footprint Area [mm ]
Power Stage
5 Power Stage
The power stages are built using an N-channel vertical power MOSFET (DMOS) with charge pump.
400
320
350 300
280
300
260
RDS(ON) [mΩ ]
RDS(ON) [mΩ ]
240
250
220
200
200
180
160
150
140
100 120
-40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25 30 35
Junction Temperature TJ [°C] Supply Voltage VS [V]
IN
VIN_H
VIN_L
t
VOUT dV/dt ON dV/dt OFF
t ON
90% VS
tOFF_delay
70% VS
30% VS
tON_delay tOFF
10% VS
t
Switching [Link]
Power Stage
VS
ZDS(AZ)
VDS
INx
LOGIC
VBAT IL
GND OUTx
VIN L, RL
VOUT
ZGND
Output [Link]
IN
t
V OUT
VS
V S-VDS(AZ)
IL
t
Switching an [Link]
During demagnetization of inductive loads, energy has to be dissipated in the BTT6200-4EMA. This energy can
be calculated with following equation:
V S – V DS ( AZ ) RL × IL ⎞
× ln ⎛ 1 – --------------------------------
L
E = V DS ( AZ ) × ------ × -------------------------------- ⎝
+I (1)
RL RL V S – V DS ( AZ )⎠ L
Power Stage
1 VS
E = --- × L × I × ⎛⎝ 1 – --------------------------------⎞
2
(2)
2 V S – V DS ( AZ )⎠
The energy, which is converted into heat, is limited by the thermal design of the component. See Figure 12 for the
maximum allowed energy dissipation as a function of the load current.
100
EAS (mJ)
10
1
0 0.5 1 1.5 2 2.5 3
IL(A)
Figure 12 Maximum Energy Dissipation Single Pulse, TJ_START = 150 °C; VS = 28V
Power Stage
VBAT
VS
Gate driver
VINV
Device OL
INV
IL(INV)
logic Comp.
comp. OUT
GND
IS
ZGND
inverse [Link]
Power Stage
Power Stage
Protection Functions
6 Protection Functions
The device provides integrated protection functions. These functions are designed to prevent the destruction of
the IC from fault conditions described in the data sheet. Fault conditions are considered as “outside” normal
operating range. Protection functions are designed for neither continuous nor repetitive operation.
ZIS(AZ) VS
DSEL0
R DSEL
DSEL1
R DSEL
DEN LOGIC
R DEN
INx
R IN IOUT(GND)
OUTx
ZDESD GND
RIS
IS
ZGND
Protection Functions
VOUT
undervoltage behavior
.vsd
VS
VS(UV) VS(OP)
ISOV
ZIS(AZ) VS
DSEL0
R DSEL
DSEL1
R DSEL
DEN LOGIC
R DEN
R IN
INx
OUTx
ZDESD GND
R IS
ZGND
Overvoltage [Link]
Protection Functions
Micro controller
protection diodes Z IS(AZ) VS
ZD(AZ) ZDS(AZ)
IS
RSENSE
VDS(REV)
DSEL0
RDSEL0
DSEL1
RDSEL1
DEN LOGIC
R DEN
INx -V S(REV)
IN0 R IN
OUTx
ZDESD GND
IS
R GND
R IS
Reverse [Link]
Protection Functions
IN
t
IL
LOAD CURRENT BELOW
LOAD CURRENT LIMITATION PHASE
LIMITATION PHASE
IL(x)SC
IL(NOM)
t
TDMOS
TJ(SC) Temperature
protection phase
ΔTJ(SW)
TA t
tsIS(FAULT)
IIS tsIS(OC_blank)
IIS(FAULT)
IL(NOM) / kILIS
0A t
VDEN tsIS(OFF)
0V t
Hard [Link]
Protection Functions
Diagnostic Functions
7 Diagnostic Functions
For diagnosis purpose, the BTT6200-4EMA provides a combination of digital and analog signals at pin IS. These
signals are called SENSE. In case the diagnostic is disabled via DEN, pin IS becomes high impedance. In case
DEN is activated, the sense current of the channel X is enabled/disabled via associated pins DSEL0 and DSEL1.
Table 7 gives the truth table.
7.1 IS Pin
The BTT6200-4EMA provides a sense signal called IIS at pin IS. As long as no “hard” failure mode occurs (short
circuit to GND / current limitation / overtemperature / excessive dynamic temperature increase or open load at
OFF) a proportional signal to the load current (ratio kILIS = IL / IIS) is provided. The complete IS pin and diagnostic
mechanism is described on Figure 19. The accuracy of the sense current depends on temperature and load
current. The sense pin multiplexes the currents IIS(0), IIS(1), IIS(2) and IIS(3) via the pins DSEL0 and DSEL1. Thanks
to this multiplexing, the matching between kILISCHANNEL0, kILISCHANNEL1, kILISCHANNEL2 and kILISCHANNEL3 is optimized.
Due to the ESD protection, in connection to VS, it is not recommended to share the IS pin with other devices if
these devices are using another battery feed. The consequence is that the unsupplied device would be fed via the
IS pin of the supplied device.
VS
ZIS(AZ)
0
FAULT
1 1
IS 1
0
0
DEN
FAULT
1
DSEL1
Diagnostic Functions
Diagnostic Functions
4
IIS [mA]
Diagnostic Functions
500
calibrated k ILIS
min/max k ILIS
450 typical k ILIS
400
350
k ILIS
300
250
200
150
0 0.5 1 1.5
IL [A]
BTT6200-4EMA
Figure 21 Improved Current Sense Accuracy with One Calibration Point at 0.2A
VINx
t
ILx
tONx tOFFx tONx
90% of
IL static
t
VDEN
t
IIS tsIS(LC)
tsIS(chC)
tsIS(ON) tsIS(OFF)
tsIS(ON_DEN)
90% of
IIS static
t
VDSEL
t
VINy
t
ILy
tONy
t
current sense settling disabling time .vsd
Diagnostic Functions
I IS
IIS(OL)
IL
IL(OL)
Sense for OL .vsd
Diagnostic Functions
Vbat
SOL
VS
IIS(FAULT)
R OL
OL
comp.
OUT
IS
ILOFF
Ileakage
GND
RIS
R PD
ZGND
Rleakage
VOL(OFF)
VIN
VOUT t
VS-V OL(OFF)
RDS(ON) x IL shutdown with load
IOUT t
tsIS(FAULT_OL_ON_OFF) t
IIS
tsIS(LC)
Diagnostic Functions
Vbat
VS
IIS(FAULT) VBAT
OL
comp.
IS
OUT
V OL(OFF)
GND
IS
RIS ZGND
RSC_VS
Diagnostic Functions
Diagnostic Functions
Diagnostic Functions
Input Pins
8 Input Pins
IN
Input Pins
Characterization Results
9 Characterization Results
The characterization have been performed on 3 lots, with 3 devices each. Characterization have been performed
at 8 V, 28 V and 36 V over temperature range.
P_4.2.3 P_4.2.4
5.000 4.000
4.900 3.900
4.800 3.800
4.700 3.700
4.600 3.600
[V]
[V]
4.500 3.500
4.400 3.400
4.300 3.300
8V 8V
4.200 28V 3.200 28V
36V 36V
4.100 3.100
4.000 3.000
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
3.500
6.000
3.000
5.000
2.500
4.000
[mA]
[µA]
2.000
3.000
1.500
2.000
1.000
8V 8V
1.000
28V 0.500 28V
36V 36V
0.000 0.000
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
Current Consumption for Whole Device with Load. Standby Current for Whole Device with Load.
All Channels Active IGND_2 = f(TJ;VS) IS(OFF) = f(TJ;VS)
Characterization Results
P_5.5.4 P_5.5.5
12.000 75.000
11.500 74.000
11.000 73.000
10.500 72.000
10.000 71.000
[mV]
[V]
9.500 70.000
9.000 69.000
8.500 68.000
8.000 67.000
8V 8V
28V 66.000 28V
7.500
36V 36V
7.000 65.000
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
Output Voltage Drop Limitation at Low Load Current Drain to Source Clamp Voltage VDS(AZ) = f(TJ)
VDS(NL) = f(TJ) and VDS(NL) = f(VS)
P_5.5.11 P_5.5.12
1.000 1.000
0.900 0.900
0.800 0.800
0.700 0.700
0.600 0.600
[V/µs]
[V/µs]
0.500 0.500
0.400 0.400
0.300 0.300
0.200 0.200
8V 8V
Characterization Results
P_5.5.14 P_5.5.15
80.000 90.000
70.000 80.000
70.000
60.000
60.000
50.000
50.000
[ms]
[µs]
40.000
40.000
30.000
30.000
20.000
20.000
8V 8V
10.000 28V 10.000 28V
36V 36V
0.000 0.000
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
P_5.5.19 P_5.5.20
2.50E‐04 3.00E‐04
2.50E‐04
2.00E‐04
2.00E‐04
1.50E‐04
[µJ]
[µJ]
1.50E‐04
1.00E‐04
1.00E‐04
5.00E‐05
8V 5.00E‐05 8V
28V 28V
36V 36V
0.00E+00 0.00E+00
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
Characterization Results
P_6.6.4
12.000
10.000
8.000
[A]
6.000
4.000
2.000 8V
28V
36V
0.000
‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C]
Characterization Results
P_7.5.2
1.400
11.000
1.200
10.500
1.000 10.000
0.800 9.500
[µA]
[mA]
9.000
0.600
8.500
0.400
8.000
8V
0.200 8V
28V
7.500 28V
36V
36V
0.000
‐50 ‐25 0 25 50 75 100 125 150 7.000
Temperature [°C] ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C]
P_7.5.3 P_7.5.7
75.000 20.000
74.000 18.000
73.000 16.000
72.000 14.000
71.000 12.000
[mA]
[V]
70.000 10.000
69.000 8.000
68.000 6.000
67.000 4.000
8V 8V
Sense Signal Maximum Voltage Sense Signal Maximum Current in Fault Condition
VIS(AZ) = f(TJ;VS) IIS(FAULT) = f(TJ;VS)
Characterization Results
P_8.4.1 P_8.4.2
1.340 1.530
1.320
1.520
1.300
1.510
1.280
1.260 1.500
1.240
[V]
[V]
1.490
1.220
1.200 1.480
1.180
1.470
1.160 8V 8V
28V 1.460 28V
1.140
36V 36V
1.120 1.450
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
P_8.4.3 P_8.4.5
350.000 16.000
14.000
300.000
12.000
250.000
10.000
200.000
[mV]
[µA]
8.000
150.000
6.000
100.000
4.000
8V 8V
50.000
28V 2.000 28V
36V 36V
0.000 0.000
‐50 ‐25 0 25 50 75 100 125 150 ‐50 ‐25 0 25 50 75 100 125 150
Temperature [°C] Temperature [°C]
Application Information
10 Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
VBAT
Voltage Regulator
OUT VS
GND
T1
Z
CVS
R OL
VDD VS
I/O R DEN DEN OUT0
C OUT
R PD
I/O Relay
R DSEL DSEL0
86 30
controller
OUT2 +
I/O R IN IN1
C OUT E.C.U.
OUT3
R PD
-
I/O R IN IN2
R LED
I/O R IN IN3
OUT3 OUT4
COUT
A/D R SENSE IS
RPD
GND
R5W LED
GND
R IS
CSENSE
R GND
Application [Link]
Application Information
Package Outlines
11 Package Outlines
Revision History
12 Revision History
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office ([Link]).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.