Europe’s semiconductor roadmap has to work outside the roadmap. At FIRST by FMD, this means looking at the places where strategy becomes concrete: pilot lines, chiplet innovation, design infrastructure, regional ecosystems and the skills base behind Europe’s microelectronics capacity. The next speakers featured in our carousel reflect this range: Jari Kinaret from Chips Joint Undertaking and Jens Eisert from Freie Universität Berlin will contribute to the discussion on Europe’s edge in microelectronics and the path from pilot lines to production. Matthias Gläßer from JENOPTIK brings an industry perspective to the APECS Pilot Line session on European chiplet innovation. Thomas Heurung from Siemens EDA (Siemens Digital Industries Software) will join the strategic spotlight on design infrastructure and what startups, SMEs and research really need. Frank Bösenberg from Silicon Saxony will bring the ecosystem perspective into the discussion on talent, skills and sustainable workforce models. These are just a few of the speakers joining the FIRST by FMD program in Berlin. September 30 – October 1, 2026 | EUREF-Campus Berlin Registration is open: https://lnkd.in/dThKZKbH
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Great to see research translating into real-world impact through Tyndall National Institute and UCC Innovation spin-out companies: Vivid Photonics, PulpoSemi and Endurance Semiconductors. Read more about Tyndall's innovation ecosystem, from world-class research to new spin-out companies, in their 2025 Annual Report below ⬇️
Today, Tyndall publishes its 2025 Annual Report, showcasing a landmark year for research, innovation and industry engagement. Among the year's standout achievements was the launch of 3 new #semiconductor #spinout companies: Vivid Photonics, PulpoSemi and Endurance Semiconductors, all of which are bringing cutting-edge Irish semiconductor technologies to global markets. All three companies were selected for the inaugural ChipStart EU Programme, Europe's first incubator dedicated to semiconductor start-ups, with Tyndall spinouts accounting for 25% of the successful applicants selected from across Europe. Commenting on the report, Professor William Scanlon, CEO, Tyndall, said: “The momentum created in 2025 positions Tyndall strongly for the years ahead. As Ireland continues to expand its semiconductor capabilities, our focus is on supporting industry, developing talent, commercialising research and helping more indigenous technology companies emerge and scale.” Read the full story here: https://lnkd.in/dMMW4tBt. University College Cork | Department of Further and Higher Education, Research, Innovation and Science | Department of Enterprise, Tourism and Employment | Enterprise Ireland | IDA Ireland | Research Ireland | Rinn Semiconductors | UCC Research
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Today, Tyndall publishes its 2025 Annual Report, showcasing a landmark year for research, innovation and industry engagement. Among the year's standout achievements was the launch of 3 new #semiconductor #spinout companies: Vivid Photonics, PulpoSemi and Endurance Semiconductors, all of which are bringing cutting-edge Irish semiconductor technologies to global markets. All three companies were selected for the inaugural ChipStart EU Programme, Europe's first incubator dedicated to semiconductor start-ups, with Tyndall spinouts accounting for 25% of the successful applicants selected from across Europe. Commenting on the report, Professor William Scanlon, CEO, Tyndall, said: “The momentum created in 2025 positions Tyndall strongly for the years ahead. As Ireland continues to expand its semiconductor capabilities, our focus is on supporting industry, developing talent, commercialising research and helping more indigenous technology companies emerge and scale.” Read the full story here: https://lnkd.in/dMMW4tBt. University College Cork | Department of Further and Higher Education, Research, Innovation and Science | Department of Enterprise, Tourism and Employment | Enterprise Ireland | IDA Ireland | Research Ireland | Rinn Semiconductors | UCC Research
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Congratulations to Tyndall National Institute on a landmark year for semiconductor Spin-out formation. The launch of Vivid Photonics, PulpoSemi and Endurance Semiconductors is another important step in building Ireland's #indigenous semiconductor sector. At Rinn Semiconductors, we're committed to accelerating semiconductor innovation by translating world-leading research into commercial technologies, supporting entrepreneurship and creating the next generation of indigenous semiconductor Spin-out companies. https://lnkd.in/dMMW4tBt https://lnkd.in/dabmbd5q #Semiconductors #Spinouts #Innovation #SiliconIsland
Today, Tyndall publishes its 2025 Annual Report, showcasing a landmark year for research, innovation and industry engagement. Among the year's standout achievements was the launch of 3 new #semiconductor #spinout companies: Vivid Photonics, PulpoSemi and Endurance Semiconductors, all of which are bringing cutting-edge Irish semiconductor technologies to global markets. All three companies were selected for the inaugural ChipStart EU Programme, Europe's first incubator dedicated to semiconductor start-ups, with Tyndall spinouts accounting for 25% of the successful applicants selected from across Europe. Commenting on the report, Professor William Scanlon, CEO, Tyndall, said: “The momentum created in 2025 positions Tyndall strongly for the years ahead. As Ireland continues to expand its semiconductor capabilities, our focus is on supporting industry, developing talent, commercialising research and helping more indigenous technology companies emerge and scale.” Read the full story here: https://lnkd.in/dMMW4tBt. University College Cork | Department of Further and Higher Education, Research, Innovation and Science | Department of Enterprise, Tourism and Employment | Enterprise Ireland | IDA Ireland | Research Ireland | Rinn Semiconductors | UCC Research
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Excited for this year's Nordic Chip Collaboration Meetup in Trondheim. With speakers across the Nordic and many other ecosystem leaders, the agenda covers key topics including chip design, advanced packaging and talent strategy. The Nordics have world class capabilities and potential. The next challenge is turning those strengths into deeper cross border collaboration and global competitiveness. See you soon in Trondheim! #semiconductors #NordicChipCollaboration
The Nordic Chip Collaboration Meetup returns on 29–30 September, this time in Trondheim as a side event of Trondheim Tech Festival. Following Helsinki in 2024 and Lund in 2025, the meetup brings the Nordic semiconductor ecosystem together for two days of keynotes, parallel sessions and site visits - covering chip design as a Nordic strength, the EuroCDP platform, advanced packaging, AI in chip development, and how the region builds and attracts talent. On day two, participants visit three companies representing different parts of the semiconductor value chain in Trondheim: Nordic Semiconductor, Arm Norway and Microchip. The aim is to showcase the Nordic value proposition in semiconductors and to foster cross-border partnerships between companies, research institutions and industry stakeholders. Registration is open. View the full programme here: https://lnkd.in/dViYtrfv A look back at last year's meetup in Lund: https://lnkd.in/d3m3wACd Innovation Norway | Business Finland | Business Sweden |Nordic Innovation Steinar Brede | Toni T. Mattila | Feng-I Tai | Robin Röj | Ida Knutsen #semiconductors #NordicChipCollaboration
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The Nordic Chip Collaboration Meetup returns on 29–30 September, this time in Trondheim as a side event of Trondheim Tech Festival. Following Helsinki in 2024 and Lund in 2025, the meetup brings the Nordic semiconductor ecosystem together for two days of keynotes, parallel sessions and site visits - covering chip design as a Nordic strength, the EuroCDP platform, advanced packaging, AI in chip development, and how the region builds and attracts talent. On day two, participants visit three companies representing different parts of the semiconductor value chain in Trondheim: Nordic Semiconductor, Arm Norway and Microchip. The aim is to showcase the Nordic value proposition in semiconductors and to foster cross-border partnerships between companies, research institutions and industry stakeholders. Registration is open. View the full programme here: https://lnkd.in/dViYtrfv A look back at last year's meetup in Lund: https://lnkd.in/d3m3wACd Innovation Norway | Business Finland | Business Sweden |Nordic Innovation Steinar Brede | Toni T. Mattila | Feng-I Tai | Robin Röj | Ida Knutsen #semiconductors #NordicChipCollaboration
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𝗪𝗵𝗲𝗻 𝘁𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝘆 𝗺𝗼𝘃𝗲𝘀 𝗳𝗿𝗼𝗺 𝘀𝘁𝗿𝗮𝘁𝗲𝗴𝘆 𝘁𝗼 𝗶𝗺𝗽𝗹𝗲𝗺𝗲𝗻𝘁𝗮𝘁𝗶𝗼𝗻, 𝗲𝗮𝗿𝗹𝘆 𝗼𝗿𝗶𝗲𝗻𝘁𝗮𝘁𝗶𝗼𝗻 𝗯𝗲𝗰𝗼𝗺𝗲𝘀 𝗮 𝗰𝗼𝗺𝗽𝗲𝘁𝗶𝘁𝗶𝘃𝗲 𝗮𝗱𝘃𝗮𝗻𝘁𝗮𝗴𝗲. With the EU Chips Act and Germany’s High-Tech Agenda entering a phase of execution, the semiconductor ecosystem is now facing practical questions: Which technologies will become available? Which markets will drive demand? Where should companies, researchers, and public institutions focus their next decisions? These are the questions at the center of FIRST – Fast Innovation through Research in Semiconductor Technologies, the new European trend forum launched by FMD - Forschungsfabrik Mikroelektronik Deutschland. As one of the few German institutes with a clean room, we look forward to joining the discussion in Berlin. FIRST is not designed as a technical conference, but a strategic meeting point for the European semiconductor ecosystem. It connects investment priorities, infrastructure development, and industrial implementation – including areas such as chiplets, heterogeneous integration, advanced packaging, and European design infrastructure. To register for the event taking place on 30 Sep. and 1 Oct. 2026 at the EUREF-Campus Berlin, follow the link in the comments. Photo credit: (c) Marco Döpke. #Semiconductors #HighTechAgenda #FIRSTbyFMD
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Record Spinout Success Signals Growth of Irish Semiconductor Sector Tyndall National Institute has published its 2025 Annual Report, marking a landmark year for research, innovation and industry engagement, highlighted by the launch of three new semiconductor spin-out companies and growing evidence of Ireland’s emerging indigenous semiconductor sector. Tyndall is a partnership between the Department of Further and Higher Education, Research, Innovation and Science and […]
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The UK Semiconductor Centre (UKSC) will lead a delegation of British technology companies, researchers, and sector organizations to the SEMICON event in Taiwan to foster cross-border commercial and supply chain partnerships. #UKtech https://lnkd.in/d5UyhzNs
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Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap https://lnkd.in/dvbBiqFk In the context of this investment, Qnity has joined hands with imec, the world-leading research and innovation center for advanced semiconductor technologies. As a member of its research program, Qnity gains deeper access to imec’s broad portfolio of research programs, world-class infrastructure and experts, and global ecosystem of industry and academic partners. Read more at https://lnkd.in/dvbBiqFk #chiplet #3DIC #AdvancedPackaging #MultiDie #semiconductor
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Following the MoU agreement between TechWorks and the Canadian Semiconductor Council last year, the two organisations are working on practical opportunities for collaboration between the UK and Canadian semiconductor ecosystems. As part of this initiative, this webinar will introduce C2MI - Canada’s largest microelectronics and semiconductor research and development centre - to the UK semiconductor community. Backed by more than $400 million in advanced infrastructure, cleanrooms and specialist equipment, C2MI helps companies, startups and researchers move technologies from early-stage development towards industrialisation and commercial scale. Its capabilities include MEMS, advanced semiconductor packaging, photonics, 200mm and 300mm post-processing, and emerging quantum technologies. C2MI’s experienced engineering and research teams work directly with partners to reduce technical risk, solve complex development challenges and accelerate the path from concept to commercial application. C2MI has already demonstrated the potential of UK and Canadian collaboration by working with the UK Compound Semiconductor Applications Catapult and Canada’s National Research Council to deliver a co-packaged optical engine for AI data centres and this webinar will provide you with an insight into the Canadian semiconductor industry and the opportunities it might offer. Discover: • The capabilities, facilities and expertise available through C2MI • Opportunities to access Canadian semiconductor research and development infrastructure • How UK organisations can collaborate with Canadian companies, researchers, and innovation partners • Potential routes to accelerate development, de-risk innovation and reach new markets • How the TechWorks–Canadian Semiconductor Council partnership can support future transatlantic collaboration To register for the event, please click on the link below 👇 https://lnkd.in/eFyrXWyC
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