Invest in Germany’s Post

A smart capital allocation under the European 🇪🇺 Chips Act. Securing funding for key players like ZEISS Group 🇩🇪 and Zadient Technologies 🇫🇷 significantly reduces exposure to global bottlenecks and stabilizes long-term manufacturing costs across Europe 🇪🇺. #FinanceTransformation #RiskManagement #Semiconductors #InvestInGermany

In the Netherlands, Nexperia subsidiary ITEC, TNO and several backend companies are developing plans for an automated panel-level OSAT. Meanwhile, Thales, Radiall and Foxconn are building Tessalia in France, an independent European OSAT for advanced packaging on 300 mm wafers that is still looking for additional shareholders. Nexperia should seriously consider joining the French initiative — with capital, technology, or both. The two projects could strengthen each other. Tessalia could benefit from Itec’s expertise in component placement and test technology, while Itec and the Dutch semiconductor ecosystem would gain access to a European industrial environment in which new technologies can be validated and brought to market. That does not mean the Netherlands should abandon its own OSAT ambitions. A highly automated panel-level facility focused on mature semiconductors and high volumes will provide cheap production environment for Tessalia customers and its ecosystem a few years after the 300mm OSAT in France is in volume production. Europe needs a backend ecosystem in which companies share knowledge, technology and investment, rather than a collection of national prestige projects.  We do no longer need to debate whether we need a strong advanced packaging industry. The real question is how to join forces. Tessalia’s invitation is on the table. I expect they have already picked up the phone in Nijmegen. By René Raaijmakers Picture taken last April by autor at the Semicon meeting at Nieuwspoort in Den Haag, where Joeri Voets (Sandgrain), Paul van Dijk (Xiver) and Joep Stokkermans (Nexperia ITEC) discus opportunities for a Dutch OSAT

Collaboration is the key, especially for small and medium sized Packaging and Test Manufacturing companies in Europe. René Raaijmakers points this out very well in his article at Bits&Chips. We don’t have the mass market that allows for healthy competition, and we can’t afford investing in manufacturing capacities that are going to stay idle in the end increasing cost and with it reducing competitiveness in local and global markets. Economy of scale is not just a topic for HVM but also for high mix low volume, just on another level.

Excited for this year's Nordic Chip Collaboration Meetup in Trondheim. With speakers across the Nordic and many other ecosystem leaders, the agenda covers key topics including chip design, advanced packaging and talent strategy. The Nordics have world class capabilities and potential. The next challenge is turning those strengths into deeper cross border collaboration and global competitiveness. See you soon in Trondheim! #semiconductors #NordicChipCollaboration

The Nordic Chip Collaboration Meetup returns on 29–30 September, this time in Trondheim as a side event of Trondheim Tech Festival. Following Helsinki in 2024 and Lund in 2025, the meetup brings the Nordic semiconductor ecosystem together for two days of keynotes, parallel sessions and site visits - covering chip design as a Nordic strength, the EuroCDP platform, advanced packaging, AI in chip development, and how the region builds and attracts talent. On day two, participants visit three companies representing different parts of the semiconductor value chain in Trondheim: Nordic Semiconductor, Arm Norway and Microchip. The aim is to showcase the Nordic value proposition in semiconductors and to foster cross-border partnerships between companies, research institutions and industry stakeholders. Registration is open. View the full programme here: https://lnkd.in/dViYtrfv A look back at last year's meetup in Lund: https://lnkd.in/d3m3wACd Innovation Norway | Business Finland | Business Sweden |Nordic Innovation Steinar Brede | Toni T. Mattila | Feng-I Tai | Robin Röj | Ida Knutsen #semiconductors #NordicChipCollaboration

*New R&D funding opportunity for collaboration with partners in #Taiwan: Horizon Europe Joint Undertaking (HORIZON-JU-Chips-2026-3-RIA). Goal is to foster low-TRL collaboration with India, Singapore, and Taiwan on chip design, manufacturing, and packaging. Closing date: 16 September 2026 #Neuromorphic Computing Systems #HeterogeneousIntegration #AdvancedPackaging https://lnkd.in/gnkjAWmA Neuromorphic Computing NL High Tech NL Semiconductors PhotonDelta Eddy Schipper Ruben Wassink David O. Axelera AI Innatera Euclyd Fortaegis Technologies TNO Innovatie Attaché Netwerk / IAN (Netherlands Innovation Network)

Behind every breakthrough is a team willing to challenge what's possible. The engineers behind Ganymede questioned existing boundaries, explored new possibilities and drew on decades of expertise to develop a platform designed for the evolving demands of semiconductor manufacturing. Through collaboration, persistence and a shared ambition to advance dry vacuum technology forward, the team transformed a vision into reality. Because the biggest innovations aren’t simply improvements. They’re breakthroughs that redefine what's possible. Learn more about Ganymede - https://bit.ly/4tk4bb1

It's exciting seeing a worldwide effort to improve quality and efficiency in the #semiconductorindustry in a product that will be built in #GeneseeCountyNY at Edwards Vacuum's PC Genesee manufacturing facility!

As Chairperson of ASEMEP, I was honored to speak at our General Membership Meeting on Advanced Assembly and Packaging: Trends and Technologies. The session explored how innovations such as chiplets, heterogeneous integration, AI-enabled manufacturing, and factory automations are shaping the future of the semiconductor industry. Beyond the technology, we discussed what these trends mean for the Philippines. Strengthening our talent pipeline, investing in smart manufacturing and R&D, and fostering stronger collaboration among industry, academe, and government will be critical to advancing our role in the global semiconductor value chain. Thank you to our members and partners for the engaging discussions. Looking forward to the next events!

Europe’s semiconductor roadmap has to work outside the roadmap. At FIRST by FMD, this means looking at the places where strategy becomes concrete: pilot lines, chiplet innovation, design infrastructure, regional ecosystems and the skills base behind Europe’s microelectronics capacity. The next speakers featured in our carousel reflect this range: Jari Kinaret from Chips Joint Undertaking and Jens Eisert from Freie Universität Berlin will contribute to the discussion on Europe’s edge in microelectronics and the path from pilot lines to production. Matthias Gläßer from JENOPTIK brings an industry perspective to the APECS Pilot Line session on European chiplet innovation. Thomas Heurung from Siemens EDA (Siemens Digital Industries Software) will join the strategic spotlight on design infrastructure and what startups, SMEs and research really need. Frank Bösenberg from Silicon Saxony will bring the ecosystem perspective into the discussion on talent, skills and sustainable workforce models. These are just a few of the speakers joining the FIRST by FMD program in Berlin. September 30 – October 1, 2026 | EUREF-Campus Berlin Registration is open: https://lnkd.in/dThKZKbH