We’re looking forward to hearing Qnity CEO Jon Kemp’s keynote on "Shrink to Stack" at SEMICON Taiwan 2026 CEO Summit & Ecosystem Executive Summit on September 2. He’ll explore how the industry is innovating from continued scaling toward more complex stacking, advanced packaging, and system integration. Register today for SEMICON Taiwan and the CEO Summit & Ecosystem Executive Summit: https://lnkd.in/gP22deNB #SEMICONTaiwan #SEMI #AI #Semiconductors #AdvancedPackaging
🇹🇼 First time speaking in Taiwan! Qnity CEO Jon Kemp to discuss "Shrink to Stack" “After 50 years of making chips smaller, shrink alone can no longer keep up with AI compute.” In the video, Qnity Electronics CEO Jon Kemp points to a fundamental shift facing the semiconductor industry. At the SEMICON Taiwan 2026 CEO Summit & Ecosystem Executive Summit, Qnity Electronics CEO and keynote speaker Jon Kemp will present “Shrink to Stack - Redefining Semiconductor Innovation in the Angstrom Era,” exploring how semiconductor innovation is moving beyond continued scaling toward more complex stacking, advanced packaging, and system integration. Qnity’s materials and solutions span semiconductor manufacturing, advanced packaging, interconnects, and thermal management, supporting the growth of AI, high-performance computing, and advanced connectivity. Qnity has also announced a US$61.5 million investment in a new advanced semiconductor research and manufacturing facility in Taiwan to expand capacity and support global customer demand. “The chip is no longer the single unit of innovation. The system is. And it only works when we build it together.” Reflecting Jon Kemp’s emphasis on system-level collaboration, this year’s summit will be held under the theme “Ecosystem × AI × Semiconductor to Transform Tomorrow.” International technology leaders from Google, Qnity Electronics, KLA, Merck KGaA, Microsoft, Broadcom, Micron, Infineon Technologies, and NVIDIA will connect the materials, manufacturing, packaging, computing, and systems ecosystems shaping the next era of AI innovation. 👉 Register now: https://lnkd.in/gjQ3-ySH.. 🔗 Full agenda and registration: https://lnkd.in/gDHv5act Beyond the summit, visit Qnity Electronics at Booth S7930 to explore how material innovation connects semiconductor manufacturing, advanced packaging, interconnects, and thermal management. 📍 SEMICON Taiwan 2026 CEO Summit & Ecosystem Executive Summit September 2|10:00 a.m.–5:00 p.m. 701AB (Future Stage), 7F, TaiNEX 2 📍 SEMICON Taiwan 2026 September 2–4|TaiNEX 1 & 2, Taipei #SEMICONTaiwan #SEMI #Qnity #ShrinkToStack #AdvancedPackaging #SemiconductorMaterials #AngstromEra #AIInfrastructure #ThermalManagement