Size of this preview: 800 × 571 pixels. Other resolutions: 320 × 228 pixels | 640 × 456 pixels | 1,024 × 730 pixels | 1,402 × 1,000 pixels.
Original file (1,402 × 1,000 pixels, file size: 1.07 MB, MIME type: image/jpeg)
 | This is a file from the Wikimedia Commons. Information from its description page there is shown below. Commons is a freely licensed media file repository. You can help. |
Summary
| Description |
English: Compliant bonding a silicon integrated circuit chip from a complaint tape used to carry the chip to the bonding site |
| Date | |
| Source | Own work |
| Author | Yield3 |
Licensing
I, the copyright holder of this work, hereby publish it under the following license:
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Unported license.
- You are free:
- to share – to copy, distribute and transmit the work
- to remix – to adapt the work
- Under the following conditions:
- attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
- share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
File history
Click on a date/time to view the file as it appeared at that time.
| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 00:51, 11 January 2013 | | 1,402 × 1,000 (1.07 MB) | Yield3 | User created page with UploadWizard |
File usage
The following page uses this file:
