imec

𝗟𝗲𝘁'𝘀 𝘁𝗮𝗹𝗸 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝘀, 𝘀𝘆𝘀𝘁𝗲𝗺𝘀, 𝗮𝗻𝗱 𝘄𝗵𝗮𝘁'𝘀 𝗻𝗲𝘅𝘁! That's why we sponsor the TechWorks Semiconductors to Systems Summit in London on August 26, bringing together 600+ leaders in chip design, semiconductor manufacturing, electronic systems, cybersecurity, AI and compute. At the summit, katayoon basharkhah will share imec's perspective on the future of automotive computing with her talk, "From Virtual Prototypes to Chiplet Platforms: Engineering the Future of Automotive Compute." As vehicles become increasingly software-defined and compute-intensive, innovation across the semiconductor stack will be key. Join us to learn more on our latest breakthroughs and how to work with imec. 👉 More about the event: https://lnkd.in/egf7uXap #techworkssummit2026 #deeptech #semiconductors #chiplets #automotive 

𝗬𝗼𝘂𝗿 𝗱𝗶𝗳𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗶𝘀 𝘆𝗼𝘂𝗿 𝘀𝘁𝗿𝗲𝗻𝗴𝘁𝗵. imen jadli grew up in Tunisia and started her career as a professor before taking a leap outside her comfort zone and joining imec in Belgium. Today, she sees her different experiences and perspectives as a strength. At imec, she found an environment where people from diverse backgrounds can bring their own perspectives to the table, while working together to push technology and innovation forward. Her journey is a great example of what can happen when you embrace new challenges, stay curious and don’t be afraid to ask for help along the way. 🎥 Meet imen and hear more about her journey at imec.

𝗠𝗼𝗿𝗲 𝗱𝗮𝘁𝗮. 𝗛𝗶𝗴𝗵𝗲𝗿 𝘀𝗽𝗲𝗲𝗱𝘀. 𝗦𝗺𝗮𝗹𝗹𝗲𝗿 𝗰𝗵𝗶𝗽𝗹𝗲𝘁𝘀.   AI infrastructure (and the underlying interconnects) are being pushed into increasingly challenging territory. One way forward? Bringing different semiconductor technologies together to get the best of each.   Imec’s RF silicon interposer technology combines CMOS, BiCMOS and III-V chiplets to enable high-frequency, extreme-bandwidth systems. Early design assessments indicate it could shrink III-V chiplet area by more than 3x - without sacrificing performance.   A promising approach as hyperscalers look to scale AI infrastructure.   Full article: https://lnkd.in/eMKQC8GW

𝗔 𝗹𝗼𝗼𝗸 𝗯𝗮𝗰𝗸 𝗮𝘁 𝟰𝟬 𝘆𝗲𝗮𝗿𝘀 𝗼𝗳 𝗺𝗲𝘁𝗿𝗼𝗹𝗼𝗴𝘆 𝗮𝗻𝗱 𝗶𝗻𝘀𝗽𝗲𝗰𝘁𝗶𝗼𝗻, 𝗮𝗻𝗱 𝘁𝗵𝗲 𝗿𝗼𝗮𝗱 𝗮𝗵𝗲𝗮𝗱... Over the past four decades, the continuation of the logic technology roadmap has diversified the in-fab metrology and inspection toolbox. Driven by advances in lithography and patterning, as well as by innovations in device materials and architectures, new metrology and inspection techniques have emerged to complement optical methods – many pioneered by imec and its partners in metrology. In this article, imec metrology experts take you on a journey through 40 years of in-fab metrology and inspection, hooked up to four defining periods in patterning and device development. But the story doesn’t stop there. The next 40 years will continue to offer exciting opportunities for the metrology community. Discover how imec’s forward-looking metrology roadmap is addressing key challenges – from continued dimensional scaling and the rise of 3D technologies to demands around cost and sustainability. Read the full article: https://lnkd.in/eWepJVMY

What if the biggest challenge in biomanufacturing isn't collecting more data, but turning them into insights and actions? As advanced therapeutics become more complex, manufacturing needs to become more adaptive, automated, and connected. The question shifts from "what can we measure?" to "which decisions do we want to automate?" At imec's Bioconvergence Forum, experts from Lonza, Thermo Fisher Scientific, Cytiva, CSEM and imec discussed how integrated data, real-time process control, and closer collaboration across the ecosystem can help turn today's "data graveyards" into decision-driven manufacturing. Read the key insights from the discussion: https://lnkd.in/eKh-58Xz

𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗱𝗼𝗲𝘀𝗻'𝘁 𝗵𝗮𝗽𝗽𝗲𝗻 𝗶𝗻 𝗶𝘀𝗼𝗹𝗮𝘁𝗶𝗼𝗻. 𝗜𝘁 𝗵𝗮𝗽𝗽𝗲𝗻𝘀 𝘄𝗵𝗲𝗻 𝗲𝘅𝗽𝗲𝗿𝘁𝗶𝘀𝗲, 𝗶𝗻𝗳𝗿𝗮𝘀𝘁𝗿𝘂𝗰𝘁𝘂𝗿𝗲 𝗮𝗻𝗱 𝗰𝗼𝗹𝗹𝗮𝗯𝗼𝗿𝗮𝘁𝗶𝗼𝗻 𝗰𝗼𝗺𝗲 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿 𝘁𝗼 𝘀𝗼𝗹𝘃𝗲 𝘀𝗵𝗮𝗿𝗲𝗱 𝗰𝗵𝗮𝗹𝗹𝗲𝗻𝗴𝗲𝘀.   Earlier this month, CHIP CONNECT BW officially kicked off in Baden-Württemberg, bringing together research organizations, industry and the public sector to strengthen the region's semiconductor ecosystem. As one of the initiative's key partners, imec Germany contributes its expertise in chiplet-based architectures, design and validation. Together, the partners are working to accelerate innovation in strategic domains including physical AI, #chiplets for the #autonomous edge and sustainable mobility, helping move promising research closer to industrial applications.   By connecting expertise across academia, research, industry and government, CHIP CONNECT BW aims to strengthen regional collaboration, support Europe's semiconductor value chain and reinforce the competitiveness of one of Europe's leading innovation regions.   Thank you to CHIP CONNECT BW, imec Germany, e-mobil BW GmbH, IPAI, Fraunhofer IAF, microTEC Südwest e.V., Ministerium für Wirtschaft, Handwerk und Tourismus Baden-Württemberg, all speakers and participants for making the kick-off a success.    We look forward to the collaborations and innovations this initiative will enable. 📸 © Laura Boysen

What happens when brain-computer interfaces evolve from hundreds to thousands of recording channels?   A newly awarded European Research Council (ERC) Proof of Concept grant will support AIM-HIGH, a research project that builds on imec's latest work in neural telemetry.   Brain-computer interfaces (BCIs) are advancing rapidly, but scaling them comes with a major challenge: managing the enormous volumes of neural data generated while keeping power consumption and heat generation under control.   Researchers at imec the Netherlands have developed a neuromorphic compressive telemetry (NCT) chip that reduces neural data volumes by more than 10x while preserving signal fidelity. This breakthrough lays the foundation for future high-density BCIs capable of recording neural activity at unprecedented scale. Read the full article on the website: https://lnkd.in/enTFUjg3

𝗛𝗼𝘄 𝗱𝗼 𝘄𝗲 𝗸𝗲𝗲𝗽 𝗔𝗜 𝗼𝗻 𝗮 𝘀𝘂𝘀𝘁𝗮𝗶𝗻𝗮𝗯𝗹𝗲 𝗮𝗻𝗱 𝘀𝗰𝗮𝗹𝗮𝗯𝗹𝗲 𝗴𝗿𝗼𝘄𝘁𝗵 𝗽𝗮𝘁𝗵? As AI workloads continue to grow, the industry faces a difficult challenge: translating technology advances into systems that can deliver meaningful gains in performance, power efficiency, and manufacturability at scale. At ITF Taiwan, experts from across the semiconductor ecosystem will discuss some of the key technologies driving that transition, including High-NA EUV, CMOS 2.0, heterogeneous integration, integrated photonics for AI infrastructure, advanced memory technologies, and 3D integration. The program features perspectives from K.C. Hsu (TSMC), Teng Chow Ooi (FusionAP), James Palles-Dimmock (Quantum Motion), and Patrick Vandenameele (imec), alongside leaders from across the broader semiconductor value chain. Read more: https://lnkd.in/eyzXgFzv #ITFTaiwan

AI is changing how new semiconductor materials are discovered and developed. CuspAI, together with NVIDIA, Meta, Samsung Electronics, Applied Materials, Lam Research, Tokyo Electron and imec, has launched the AI Materials Foundry. As one of the 48 founding members, imec is joining a global network that combines high-quality data, world-class laboratories, advanced compute infrastructure and scientific expertise to accelerate the discovery and development of new materials. The AI Materials Foundry provides the production infrastructure for industrial materials discovery, enabling partners to run full discovery cycles from AI-driven materials design and simulation to synthesis planning and experimental validation. For the semiconductor industry, identifying, testing and validating new materials remains a major bottleneck for future advances in logic, memory, packaging and energy-efficient computing. imec will contribute its expertise in materials research and AI, together with its experimental infrastructure and compute know-how, to help accelerate the transition from digital materials discovery to validated physical results.

"𝗬𝗼𝘂 𝗮𝗿𝗲 𝗺𝗼𝗿𝗲 𝘁𝗵𝗮𝗻 𝗷𝘂𝘀𝘁 𝗮 𝗹𝗮𝗯𝗲𝗹." Growing up in India, Darayus Adil Patel learned an important lesson: we are not defined by the labels others place on us. Looking back, there's one piece of advice he'd share with his younger self: first look within. And whatever answer you find, pursue it with passion. Today, he works alongside colleagues from more than 100 nationalities. For him, that's one of the most rewarding aspects of working at imec. Because the best ideas don't emerge in silos. They emerge when diverse perspectives, experiences and ambitions come together. And that's what excites him most: not just imagining the future, but helping create it every day. 🎥 Meet Darayus and hear the advice he'd share with his younger self. #futureatimec