Processing
Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
The Nordic Semiconductor nRF54LM20B is a wireless SoC in the company’s nRF54L series that combines an MCU, low-power wireless connectivity, and on-chip AI acceleration. The device integrates up to 2 Mbytes of nonvolatile memory and 512 kbytes of RAM, the largest memory configuration in the series.
IoT
Software Offers Seamless Cloud integration, Wireless Mesh-Network Management
March 25, 2026
NeoCortec has introduced an updated version of its gateway software, called NeoCortec NeoGW, along with a new web-based network management application designed to simplify the integration and administration of wireless mesh networks based on the company’s NeoCortec NeoMesh protocol stack.
Industrial
Flexible Conductive Film Boasts High Transparency, Low Resistance
March 24, 2026
Panasonic Industry recently introduced a transparent conductive film called FineX FineCross) designed for EMI shielding in applications where optical clarity must be maintained. The film targets systems such as displays, industrial equipment interfaces, and wireless communication environments where both visibility and electromagnetic control are required.
IoT
Product of the Week: Innodisk Corporation’s Intel Core Ultra Series 3 Reference Kit
March 23, 2026
Pre-built hardware development solutions, like a reference kit, are often designed to accelerate the deployment of edge AI applications. These solutions provide support for AI building blocks, coupled with reliable, high-performance capabilities, and the seamless integration of robust, high-speed storage for edge AI workloads.
AI & Machine Learning
2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic
March 19, 2026
There were many themes and trends discussed at the 2026 embedded world exhibition and conference in Nuremberg, Germany this year. Those being energy-efficiency and sustainability, security regulations like the Cyber Resilience Act (CRA), and, of course, one that will likely continue to be a topic for years to come and for many embedded computing companies, artificial intelligence (AI).
Analog & Power
Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
In the fast-paced world of electronic design, engineers often focus on processing, power consumption, connectivity, and performance as the key levers of innovation. But in 2025, something fundamental is shifting in the design process — and engineers are taking notice.
Debug & Test
The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.
AI & Machine Learning
The Role of Motor Control in Physical AI
March 16, 2026
Physical AI is a term that’s in vogue right now. It refers to the application of AI to systems that directly interact with and influence the physical world. Unlike Cloud-based AI models that analyze data and produce insights, physical AI closes the loop between perception, decision-making, and actuation. It senses its environment, processes that data locally or at the Edge, and then potentially drives such equipment as motors, valves, pumps, or actuators. In short, it turns algorithms into action.
Industrial
The Road from embedded world: APLEX Demonstrates ATEX Explosion-Proof Panel PCs, Displays, and AVoIP Technology
March 16, 2026
APLEX Technology Inc. thanks everyone who visited and supported it during embedded world Germany. During the show APLEX demonstrated its new ATEX explosion-proof solutions, including panel PCs, displays, and AVoIP (Audio and Video Over Internet Protocol) box.
Uncategorized
embedded world Germany 2026 Best-in-Show: Honorable Mention
March 11, 2026
All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.
Uncategorized
embedded world Germany 2026 Best-in-Show: Winners
March 11, 2026
All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.
IoT
The Road to embedded world: Ambarella Debuts Edge AI Innovations and Developer Tools
March 9, 2026
Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.
Industrial
embedded world 2026 Product Showcase: WIZnet WIZ-IP20 ioPort
March 9, 2026
Most of today’s industrial and embedded applications require the advanced, versatile, and reliable networking capabilities needed by communication devices. Legacy serial devices often lack in this area and require solutions that can speak to modern devices.
Processing
Trenz Electronic Showcases 10 New FPGA Platforms at embedded world Germany
March 26, 2026
While attending embedded world Germany, Trenz Electronic showcased ten new FPGA-based platforms including seven AMD-based and three Altera-based solutions. Highlighted were a range of solutions from cost-optimized FPGA platforms to high-I/O designs, RF signal processing, and edge AI applications.
Analog & Power
Multimedia
ADLINK Marco Krause at embedded world 2026
March 26, 2026
Rich Nass interviews Managing Director Marco Krause from ADLINK at embedded world 2026.
Automotive
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How BASE-AU Enables High-Speed Optical Camera Links in Next-Generation Vehicles
March 05, 2026
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From Design to Verification: Best Practices for Automotive Functional Safety Certification
February 05, 2026
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
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New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
Debug & Test
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The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
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embedded world Germany: Upgraded TASKING Compiler Brings Integrated Compile, Debug, and Test for RH850 Architecture
March 04, 2026
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Mouser Product of the Week: Analog Devices’ EV-ADF4030SD1Z Evaluation Board
March 02, 2026
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embedded world Germany 2026: TASKING Toolchain Brings AI-Driven Compile, Debug, and Test for Safety-Critical Applications
February 12, 2026
Healthcare
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Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
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Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
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Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
October 13, 2025
Open Source
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embedded world Germany 2026 Dev Kit Zone
March 06, 2026
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Trends in Embedded: LVGL Innovation & A Countdown to embedded world 2026
March 05, 2026
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DevTalk with Rich and Vin: HMIs and LVGL
March 03, 2026
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The Zephyr Project Grows Membership, Highlights Security and Resilience at embedded world 2026
February 10, 2026
Processing
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Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
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embedded world 2026 Podcast with Tria Technologies
March 23, 2026
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embedded world Product Showcase: Ambient Scientific’s GPX10 Pro
March 09, 2026
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embedded world Product Showcase: ECS-DoT Ultra-Low-Power Edge AI SoC from EMASS
March 09, 2026
Security
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Embedded Executive: Once Again, You MUST Implement Security | Thistle Technologies
March 18, 2026
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Meeting the EU Cyber Resilience Act: Kudelski Labs Highlights Future-Ready Security Solutions at embedded world
March 03, 2026
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EU CRA: Guidance for Non-IP Embedded Communication Systems
February 24, 2026
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The Road to embedded world: PQShield Advances Post-Quantum Cryptography
February 17, 2026
Software & OS
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Infineon’s New ModusToolbox Power Suite Streamlines Digital Power Conversion Designs Using PSOC Control C3 MCUs
March 03, 2026
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From IDEs to Integrated Suites: Embedded Development Tools Are Evolving Again
February 19, 2026
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Building Trust in Embedded Systems & Smarter HMI Design
January 15, 2026
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DevTalk with Rich and Vin: UI Design
January 09, 2026
HPC/Datacenters
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
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Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025